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WO/2022/014978A1 |
Provided are a polishing pad including a protrusion pattern having porosity so as to improve removal rate and reduce manufacturing costs at the same time, a polishing device including same, and a manufacturing method thereof. The polishi...
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WO/2022/010687A1 |
A system and method for polishing a substrate, and a retaining ring assembly therefor, are described herein. A retaining ring assembly is configured to be attached to a carrier head. The retaining ring assembly includes a retaining ring ...
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WO/2022/009990A1 |
The present invention provides a polishing composition which is capable of polishing the surface of a polycrystalline ceramic smooth. This polishing composition contains abrasive grains and water; and the average secondary particle diame...
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WO/2022/009700A1 |
This liquid supply device comprises: a rocking arm that can horizontally rock the upper side of a polishing table; a slurry tube that extends in the longitudinal direction of the rocking arm and discharges slurry onto the polishing table...
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WO/2022/010616A1 |
A retaining ring used in the polishing of semiconductor substrates is described herein. A retaining ring includes a bottom surface configured to contact a polishing pad and a top surface configured to attach to a carrier head. The top su...
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WO/2022/005884A1 |
A chemical mechanical polishing system includes a polishing a port to dispense polishing liquid onto a polishing pad and a liquid flow controller to control a flow rate of the polishing liquid to the port, a temperature control system to...
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WO/2022/005919A1 |
A carrier head for a polishing system includes a housing, a flexible membrane, a first plurality of pressure supply lines, a second plurality of pressure supply lines, and a valve assembly. The flexible membrane defines a multiplicity of...
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WO/2022/005045A1 |
Disclosed are a substrate polishing system and a substrate polishing method. A substrate polishing system according to an embodiment comprises a plurality of polishing apparatuses which sequentially polish a substrate, wherein each of th...
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WO/2022/006012A1 |
A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, and a pad cooling assembly. The pad cooling assembly has an arm extending over the platen, a nozzle suspended by the arm and ...
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WO/2022/006160A1 |
A chemical mechanical polishing apparatus includes a rotatable platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system in...
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WO/2022/006008A1 |
A chemical mechanical polishing system includes a steam generator with a heating element to apply heat to a vessel to generate steam, an opening to deliver steam onto a polishing pad, a first valve in a fluid line between the opening and...
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WO/2021/262521A1 |
A carrier head includes a housing, a support assembly having a support plate flexibly connected to the housing so as to be vertically movable, a plurality of fluid-impermeable barriers projecting from a bottom of the support plate to def...
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WO/2021/260629A1 |
A polishing pad includes a textured polishing layer comprising a working surface and a second surface opposite the working surface. The textured polishing layer comprises a polymeric blend comprising thermoplastic urethane in an amount o...
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WO/2021/262450A1 |
A method of training a neural network includes obtaining two ground truth thickness profiles a test substrate, obtaining two thickness profiles for the test substrate as measured by an in-situ monitoring system while the test substrate i...
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WO/2021/263043A1 |
A polishing assembly includes a rotatable platen to support a polishing pad, a polishing liquid delivery arm having an enclosure open at a bottom thereof and one or more ports to deliver a polishing liquid and a cleaning fluid downwardly...
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WO/2021/262602A1 |
A conditioner disk for use on a polishing pad during chemical mechanical polishing process includes a backing plate having a lower surface and abrasive diamond particles secured to the lower surface of the backing plate, the abrasive dia...
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WO/2021/263202A1 |
A pad conditioner head cleaning tool has a first clamp configured to removably engage a first portion of a sponge against an outer surface of a disk-shaped pad conditioner head at a first location, a second clamp configured to removable ...
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WO/2021/262947A1 |
In a substrate processing system, such as a chemical mechanical system, updated controller configuration data is obtained for a plurality of liquid flow controllers of the substrate processing system. Each of a plurality of liquid flow c...
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WO/2021/262755A1 |
A carrier head for holding a substrate in a polishing system has a housing including a carrier plate, a first flexible membrane secured to the housing, and a plurality of independently operable piezoelectric actuators secured to the carr...
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WO/2021/262612A1 |
In a chemical mechanical polishing system, a platen shield cleaning assembly is installed on a rotatable platen in a gap between the rotatable platen and a platen shield. The assembly includes a sponge holder attached to the platen and a...
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WO/2021/253589A1 |
A processing and manufacturing method capable of customizing a high-precision potassium tantalate niobate (KTa1-xNbxO3, where 0
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WO/2021/257136A1 |
Embodiments herein generally relate to polishing pads and method of forming polishing pads. In one embodiment, a polishing pad having a polishing surface that is configured to polish a surface of a substrate is provided. The polishing pa...
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WO/2021/252537A1 |
Interpenetrating polymer networks (IPNs) for a forming polishing pad for a semiconductor fabrication operation are disclosed. Techniques for forming the polishing pads are provided. In an exemplary embodiment, a polishing pad includes an...
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WO/2021/250937A1 |
According to the present invention, the sum and the ratio of the torque of a sun gear and the torque of a internal gear are controlled to be within predetermined ranges.
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WO/2021/252540A1 |
A polishing pad for a semiconductor fabrication operation includes a polishing region and a window region, wherein both regions are made of an interpenetrating polymer network formed from a free-radically polymerized material and a catio...
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WO/2021/251032A1 |
This device (1) for polishing the outer periphery of a wafer comprises: a stage (11) for retaining a disc-shaped wafer (31) horizontally; a rotational drive part (12) for rotating the stage (11) about the center axis thereof as a rotatio...
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WO/2021/251108A1 |
Provided are a composition for chemical mechanical polishing and a method for polishing that, while allowing a semiconductor substrate that contains a polysilicon film and/or a silicon nitride film to be polished at a high speed, makes i...
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WO/2021/252363A1 |
During polishing of a stack of adjacent conductive layers on a substrate, an insitu eddy current monitoring system measures sequence of characterizing values. A polishing rate is repeatedly calculated from the sequence of characterizing ...
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WO/2021/240949A1 |
The present invention provides a polishing head configured to hold a wafer, and perform polishing by rotating the wafer within a polishing surface of a polishing pad while applying pressure to the wafer and pressing the wafer against the...
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WO/2021/241162A1 |
The present invention realizes a polishing device that is suitable for surface reference polishing. A polishing device 100 includes: a plurality of substrate holding mechanisms 200 disposed along a first direction (X direction) of a su...
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WO/2021/241709A1 |
A polyfunctional quaternary ammonium salt of a sulfonic acid having active-hydrogen groups according to the present invention has at least two active-hydrogen groups in the molecule, wherein the quaternary ammonium salt skeleton comprise...
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WO/2021/238792A1 |
The present invention relates to the field of machining. Disclosed are a magnetic grinding apparatus and a magnetic grinding control method. The apparatus comprises: a magnet platform of a ground workpiece fixing table is connected to an...
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WO/2021/241505A1 |
Provided is a polishing method which makes it possible to efficiently provide a surface that is prevented from the occurrence of subsurface damages with high accuracy in a high-hardness material. A polishing method provided by the presen...
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WO/2021/241708A1 |
The CMP laminated polishing pad according to the present invention is characterized by being provided with at least a polishing layer and a foundation layer, and is characterized in that the foundation layer contains a resin obtained thr...
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WO/2021/235050A1 |
The present invention is a method for affixing a polishing pad of a double-sided polishing device, the method including: affixing a lower-surface-plate polishing pad to a lower surface plate, and subsequently mounting a ring-form tempora...
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WO/2021/235054A1 |
The present invention is an abrasive for synthetic quartz glass substrates that includes at least abrasive particles and water, wherein the abrasive particles include composite oxide particles of cerium and yttrium and composite amorphou...
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WO/2021/235066A1 |
The present invention is a method for manufacturing a carrier for a double-side polishing device that has an upper surface plate and a lower surface plate with polishing cloths adhered thereto, said carrier having a carrier base material...
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WO/2021/235067A1 |
The present invention is a substrate wafer production method in which a substrate wafer is produced by preparing a wafer that has a first principal surface and a second principal surface, forming a flattened resin layer on the second pri...
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WO/2021/230022A1 |
The present invention provides a double-sided polishing method in which a plurality of carriers are installed between an upper surface plate and a lower surface plate of a rotating surface plate having a surface plate center, one or more...
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WO/2021/231427A1 |
A method of polishing a substrate includes polishing a conductive layer on the substrate at a polishing station, monitoring the layer with an in-situ eddy current monitoring system to generate a plurality of measured signals values for a...
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WO/2021/228754A2 |
The invention relates to a mounting press for automatically mounting samples in mounting material, comprising: - a pressing unit, which has a pressing cylinder; - a metering apparatus for the metered introduction of mounting material; - ...
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WO/2021/230026A1 |
The present invention provides a detergent composition which enables thorough removal of a polishing agent, metal microparticles, and an anti-corrosion agent during washing of a semiconductor substrate as well as long-term maintaining of...
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WO/2021/220672A1 |
The present invention provides: a cerium-based polishing slurry raw material solution which exhibits good polishing performance on glass materials, while having excellent productivity; a method for producing this cerium-based polishing s...
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WO/2021/220787A1 |
The present invention addresses the problem of providing a polishing system in which the amount that an object to be polished is polished can be simply and precisely measured. The polishing system of the present invention uses an abras...
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WO/2021/213827A1 |
The invention relates to a method for grinding a semiconductor wafer, in which the semiconductor wafer is machined for material removal by means of a grinding tool containing grinding teeth having a height h, with a cooling medium being ...
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WO/2021/215115A1 |
A method for producing a glass article, the production method having a step for sandwiching a circular carrier holding a circular glass substrate between an upper lapping plate and a lower lapping plate and rotating the carrier with resp...
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WO/2021/216112A1 |
A polishing pad includes a supporting layer and a protruded pattern disposed on the supporting layer. The protruded pattern includes a horizontal extended surface and a vertical side surface. Further, the supporting layer includes a firs...
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WO/2021/210308A1 |
The present invention addresses the problem of providing a cleaning fluid for semiconductor substrates which is highly effective in preventing metallic layers from corroding. The present invention further addresses the problem of providi...
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WO/2021/210310A1 |
The present invention addresses the problem of providing a processing liquid that is for semiconductor substrates and that provides excellent corrosion prevention performance to metal-containing layers. The present invention also address...
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WO/2021/205740A1 |
The present invention is a wafer polishing method, for performing corrective polishing by pressing a wafer onto a polishing cloth while continuously supplying a water-containing polishing composition in order to correct the shape of a po...
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