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WO/2020/036038A1 |
Use is made of a polyurethane for polishing layers that is a thermoplastic polyurethane which is for use as the material of the polishing layers of polishing pads and which is a product of reaction of raw polyurethane materials comprisin...
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WO/2020/035764A1 |
A structured abrasive article comprises a backing having first and second opposed major surfaces and an abrasive layer securely bonded to the first major surface of the backing. The abrasive layer comprises shaped abrasive composites. Ea...
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WO/2020/036953A1 |
Apparatus and systems are disclosed of a splash guard for a grinder/polisher having a base, a bowl, and a platen having an outer edge to prevent splashing during the grinding/polishing operation. The splash guard includes an inner sidewa...
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WO/2020/032106A1 |
[Problem] To provide a local polishing technique that stabilizes the volume of processing by means of local polishing, that can achieve a high level of corrective space resolution, and that is preferable for corrective polishing. [Soluti...
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WO/2020/032056A1 |
The present invention relates to a curable composition comprising: (A) a polypseudorotaxane monomer that has a composite molecular structure composed of a ring-shaped molecule having a polymerizable functional group and an axle molecule ...
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WO/2020/024879A1 |
A grinding disk kit for use in convex roller rolling surface finishing, comprising a coaxial pair of first and second grinding disks (21/22), first and second grinding disk front surfaces (211/221) being arranged opposite. The first grin...
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WO/2020/024878A1 |
A grinding disk kit for finishing rolling surfaces of a bearing roller, comprising a pair of first and second grinding disks (21/22) that are coaxial, a front face (211) of the first grinding disk comprising a set of radially distributed...
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WO/2020/027260A1 |
Provided is a polishing composition capable of quickly removing an oxide film even at a low abrasive grain concentration. This polishing composition contains a silica having a silanol group density of 2.0 OH/nm2 or more, and an organic s...
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WO/2020/022415A1 |
In this SiC wafer (40) manufacturing method, a SiC wafer (40) is manufactured wherein a work-affected layer removal step for removing a work-affected layer generated on the surface and interior of the SiC wafer (40) has been performed an...
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WO/2020/020568A1 |
A tool (1) for modifying substrate support elements (21) of a substrate holder (20), the substrate support elements having support surfaces (22) for supporting a substrate, said tool comprising a main body (2) having a main body surface ...
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WO/2020/021774A1 |
The purpose of the present invention is to provide a uniform polishing pad which can be manufactured in an improved work environment and has a hardness suitable for chemical mechanical polishing. Provided is a polishing pad comprising a ...
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WO/2020/021871A1 |
Provided are a workpiece double-side polishing device and workpiece double-side polishing method by which, during double-side polishing, double-side polishing can be finished at a time when the shape of the workpiece becomes a target sha...
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WO/2020/013151A1 |
According to one embodiment for supplying an automated device that conveys a rectangular substrate, a substrate-conveying device is provided for conveying the rectangular substrate, the substrate-conveying device having: a plurality of c...
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WO/2020/013332A1 |
The present invention provides: a chemical mechanical polishing composition which contains a polishing agent, a basic component, a polyoxyalkylene alkyl ether represented by formula (i) RO-(AO)n-H (wherein R represents a linear or branch...
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WO/2020/013508A1 |
A retainer ring according to an embodiment of the present invention is used in a CMP device and comprises: a frame layer which is coupled to the lower end of a carrier of the CMP device and includes a thermosetting resin; a synthetic res...
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WO/2020/007015A1 |
A diamond composite material comprising a honeycomb core material and water-soluble gypsum foam filled in pores of the honeycomb core material. The water-soluble gypsum foam comprises the following components in percentage by weight: ino...
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WO/2020/009055A1 |
Provided is a polishing procedure with which it is possible to improve the flatness of a substrate without a significant reduction in polishing speed. More specifically, provided is a polishing composition containing inorganic particles,...
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WO/2020/009054A1 |
The present invention provides a polishing means which is capable of improving the flatness of a substrate without significantly reducing the polishing rate. The present invention specifically provides a polishing composition which conta...
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WO/2019/246396A1 |
Methods and apparatus to control a fluid dispenser on a metallurgical specimen preparation machine are disclosed. An example system to dispense fluid for a grinder/polisher includes: a fluid dispenser having: a fluid reservoir to store a...
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WO/2019/239555A1 |
This polishing liquid, for polishing a cobalt-containing surface to be polished, contains: abrasive grains; at least one type of sugar component selected from a group consisting of sugar alcohols, sugar alcohol derivatives and polysaccha...
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WO/2019/240235A1 |
This polishing liquid, for polishing a cobalt-containing surface to be polished, contains: abrasive grains; at least one type of sugar component selected from a group consisting of sugar alcohols, sugar alcohol derivatives and polysaccha...
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WO/2019/233174A1 |
A polishing method for a light-emitting element. An energetic particle is used to subject a light-emitting element to radiation with an increasing energy gradient, such that damage is homogeneously inflicted on a phase A of the light-emi...
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WO/2019/229585A1 |
The invention relates to an assembly (10) for loading parts (30) to be treated into a single-side or double-side treatment machine, comprising:- a part holder (12) in the form of a plate for holding at least one part to be treated, compr...
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WO/2019/225087A1 |
The present invention proposes a double-sided polishing device and a double-sided polishing method capable of terminating double-sided polishing of a workpiece at a desired shape even when double-sided polishing of the workpiece is perfo...
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WO/2019/221249A1 |
The present invention is a polyrotaxane monomer (A) with a composite molecular structure comprising ring-shaped molecules and a shaft molecule that passes through the ring of the ring-shaped molecules and has bulky groups on both ends so...
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WO/2019/220712A1 |
[Problem] To suppress fluctuations in polishing pressure at an outer circumferential section of a wafer, and increase flatness. [Solution] A polishing head 10 of a wafer polishing device is provided with: a membrane head 16 that can inde...
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WO/2019/220919A1 |
Provided is a polishing fluid composition for magnetic disc substrates, that ensures polishing speed and is capable of reducing: surface defects on the substrate surface after polishing; and short-wavelength undulations during continuous...
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WO/2019/216301A1 |
The present invention relates to a polishing pad which is composed of: a base material; and an adsorption layer and a polishing layer, which are formed on the base material. The adsorption layer is formed of a composition which is obtain...
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WO/2019/217012A1 |
In one implementation, a method of forming a porous polishing pad is provided. The method comprises depositing a plurality of composite layers with a 3D printer to reach a target thickness. Depositing the plurality of composite layers co...
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WO/2019/216205A1 |
Provided is, as one embodiment, a polishing liquid composition for a glass hard disk substrate that can prevent deterioration of surface roughness of a substrate surface after washing while maintaining the polishing rate. One embodiment ...
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WO/2019/216279A1 |
There is used a method for modifying polyurethane that includes a step for preparing polyurethane having an ethylenic unsaturated bond and a step for treating the polyurethane using a solution that contains a compound having a conjugated...
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WO/2019/210911A1 |
The invention relates to a method and a device for a time-resolved analysis (optimally with real-time capability) of transfer films during the contacting of two different surfaces. To provide a method that allows the imaging of the entir...
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WO/2019/207926A1 |
The present invention is a polishing agent for synthetic quartz glass substrates, which contains polishing particles and water, and which is characterized in that: the polishing particles are composite oxide particles of cerium and yttri...
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WO/2019/208042A1 |
The present invention is a polishing device that is provided with a polishing head, a surface plate to which a polishing cloth is affixed, a loading stage for attaching a wafer to the polishing head, and an unloading stage for detaching ...
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WO/2019/208605A1 |
The present invention relates to a sheet-like underlay to be installed between a polishing pad and a surface plate when the polishing pad is fixed onto the surface plate. The underlay is a novel assistance member in which, in a surface t...
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WO/2019/199073A1 |
Polishing compositions according to various embodiments of the present disclosure comprise a fluorine-containing compound, a pH adjuster, an additive, and water, wherein the content of the fluorine-containing compound may be 0.01-20 wt% ...
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WO/2019/198675A1 |
The present invention is a urethane resin that is obtained by reacting (C1) a bifunctional active hydrogen-containing compound that has two active hydrogen-bearing groups per molecule with a polymerizable composition that comprises at le...
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WO/2019/198622A1 |
[Problem] To provide a polishing composition which can polish a substrate on which is formed a silica coating or the like at high speed by increasing the effects of mechanical friction using abrasive grains that produce no defects, which...
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WO/2019/198343A1 |
Provided is a double-sided polishing device for a workpiece that can perform double-sided polishing of the workpiece while maintaining accuracy, for a longer period of time than conventional devices, in measuring the thickness of the wor...
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WO/2019/193693A1 |
A polishing liquid that is used to polish silicon nitride, the polishing liquid comprising cerium-oxide-containing abrasive grains and a liquid medium, wherein the cerium oxide contains an element that has an ionic radius greater than th...
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WO/2019/193877A1 |
This polishing head comprises at least: an annular ceramic ring; a template which is adhered to the ceramic ring and in which a backing pad and a guide ring are integrated; and a backplate which is joined to the ceramic ring, and which f...
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WO/2019/195087A1 |
Data received from an in-situ monitoring system includes, for each scan of a sensor, a plurality of measured signal values for a plurality of different locations on a layer. A thickness of a polishing pad is determined based on the data ...
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WO/2019/188359A1 |
The present invention provides a means whereby a work can be polished at a high rate and have a further improved surface quality. The present invention is a polishing composition for use in polishing works which comprises abrasive alumin...
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WO/2019/188747A1 |
The present invention provides a polishing composition that is for polishing gallium compound semiconductor substrates. The polishing composition includes silica abrasive grains, a compound Cpho that has a phosphoric acid group or a phos...
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WO/2019/187814A1 |
The present invention relates to a substrate holding device for use in polishing a surface of a substrate by pressing the substrate against a polishing tool, such as a polishing pad. The present invention also relates to a method of manu...
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WO/2019/188901A1 |
Provided is a production method for a semiconductor substrate. The production method makes it possible to control the post-production shape of the substrate to a high degree. This production method for a semiconductor substrate includes ...
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WO/2019/188577A1 |
The present invention provides: a polishing pad that exhibits high stability in terms of polishing rate over time; and a method for producing same. This polishing pad is equipped with a polishing layer having a polyurethane sheet, wherei...
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WO/2019/189610A1 |
Provided is a polishing composition with which a high polish rate is achieved, surface smoothness (surface quality) of a polishing substrate is improved, and defects can be reduced. Specifically, this polishing composition contains silic...
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WO/2019/189124A1 |
Provided is a polishing composition that has excellent ability to eliminate bulging around an HLM. This polishing composition is for pre-polishing a silicon substrate. The polishing composition includes abrasive grains, a basic compound,...
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WO/2019/187837A1 |
The present invention provides a polishing composition, wherein there is a means with which it is possible to stably maintain a fixed polishing rate even when the polishing composition is stored for a long period of time in a concentrate...
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