Title:
SUB-PAD FOR POLISHING PAD, POLISHING PAD INCLUDING SAME, AND METHOD FOR MANUFACTURING SUB-PAD FOR POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2023/200269
Kind Code:
A1
Abstract:
The present invention provides a sub-pad for a polishing pad, a polishing pad including same, and a method for manufacturing the sub-pad for a polishing pad, the sub-pad being stacked under a top pad that contacts and polishes a wafer and including a nanofiber non-woven fabric pad, wherein the nanofiber density of an outer circumferential part of the nanofiber non-woven fabric pad is 1.2-5 times that of another part inside the outer circumferential part.
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Inventors:
MIN BYUNG JU (KR)
KIM SEUNG GEUN (KR)
KANG MIN WOO (KR)
OH NAM GUE (KR)
KIM SAN HA (KR)
JEONG JI HUN (KR)
EOM YOUN SICK (KR)
KIM SEUNG GEUN (KR)
KANG MIN WOO (KR)
OH NAM GUE (KR)
KIM SAN HA (KR)
JEONG JI HUN (KR)
EOM YOUN SICK (KR)
Application Number:
PCT/KR2023/005014
Publication Date:
October 19, 2023
Filing Date:
April 13, 2023
Export Citation:
Assignee:
KPX CHEMICAL CO LTD (KR)
KOREA ADVANCED INST SCI & TECH (KR)
KOREA ADVANCED INST SCI & TECH (KR)
International Classes:
B24B37/24; B24B37/22; B24D11/00
Foreign References:
| KR101591097B1 | 2016-02-02 | |||
| JP2001088019A | 2001-04-03 | |||
| KR20170113605A | 2017-10-12 | |||
| KR20170123504A | 2017-11-08 | |||
| US6464576B1 | 2002-10-15 |
Attorney, Agent or Firm:
KIM, Sung Ho (KR)
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