| Document |
Document Title |
|
WO/2024/090444A1 |
An information processing device according to the present disclosure comprises: an information acquisition unit which can acquire a plurality of pieces of information related to a vehicle; an inference unit which calculates index values ...
|
|
WO/2024/090236A1 |
The present invention is a heat transfer member which is applied to a cooling device (100), which cools an object-to-be-cooled (70) in a state of being immersed in a liquid refrigerant and promotes heat transfer to the refrigerant from t...
|
|
WO/2024/090334A1 |
This projection display device (100) comprises a reflective liquid crystal display element (1), a heat sink (2), a heat generation source (3), and a cooling fan (5). In at least one direction among the long side direction and the short s...
|
|
WO/2024/091980A1 |
A cold plate assembly includes a thermally conductive cold plate having a first surface attachable to a heat generating electronic component of an information processing system. An opposite second surface includes an array of hollow rise...
|
|
WO/2024/091605A1 |
A method and apparatus for an evaporator assembly are provided. The evaporator assembly includes an evaporator body, a coating basin, and a porous media. The evaporator body includes an evaporator sidewall, an evaporator volume defined b...
|
|
WO/2024/090390A1 |
This information processing device comprises: a first processor for outputting point information obtained by capturing an imaged object as a point, from an image of the object imaged using a first camera; and a second processor for outpu...
|
|
WO/2024/087284A1 |
The present invention relates to the technical field of cable trays. Specifically, disclosed is a dustproof cable tray, comprising first partition plates. Fixing backets are fixedly connected to two ends of the lower surface of each firs...
|
|
WO/2024/089674A1 |
A cooling device for a solid-state electronics component is provided for electronics one or more electronics components that heats during The cooling device includes a chamber having a first region defining a pool with a heat conducting ...
|
|
WO/2024/087148A1 |
A hybrid cooling unit and a cooling mechanism. The hybrid cooling unit comprises a heat dissipation housing (1), a mounting housing (2), and a phase change material (3). The heat dissipation housing (1) has a recessed-protruding shape; a...
|
|
WO/2024/087606A1 |
A noise reduction apparatus and a communication device. The noise reduction apparatus comprises: a support frame (100), which has an air inlet and an air outlet; a first noise reduction module (200), which is arranged at the air inlet of...
|
|
WO/2024/088250A1 |
A heat dissipation apparatus (1), an electronic device (2), and an electric device (3). The heat dissipation apparatus (1) comprises a liquid cooling plate (11) and heat exchange fins (12). The liquid cooling plate (11) is provided with ...
|
|
WO/2024/091967A1 |
A cold plate assembly has a cold plate that is resistant to corrosion and particulate fouling, allowing direct use of facility-grade cooling liquid and omission of a secondary coolant loop that uses a purified liquid coolant. The cold pl...
|
|
WO/2024/090328A1 |
This information processing device comprises: a first processor that outputs point information which is obtained by capturing, from an image of an object imaged by a first camera, the imaged object as points; a second processor that outp...
|
|
WO/2024/090931A1 |
The present invention relates to a turbo compressor comprising: a motor having a rotary shaft, with one end portion coupled to an impeller, in order to rotate the impeller; a cooling-air path through which cooling gas accommodated therei...
|
|
WO/2024/089552A1 |
An optical system includes a sealed enclosure partially filled with hot coolant defining a headspace above the coolant, a first optical connector disposed in the headspace, and a temperature regulating system. The first optical connector...
|
|
WO/2024/090878A1 |
The present invention relates to a composite heat dissipation hybrid TIM sheet which is disposed between a heat sink and a heat source and composed of a heat-conductive sheet in which an auxiliary layer comprising a TIM layer or a heat-d...
|
|
WO/2024/091481A1 |
Embodiments of the present invention provide a cooling module for cooling heatgenerating electronic devices in an immersion cooling system. The cooling module includes an integrated pump, which draws immersion fluid from the surrounding ...
|
|
WO/2024/090389A1 |
This cooling execution device comprises: an acquiring unit for acquiring a detection result obtained by detecting an object relating to operation of a control device which is mounted in a vehicle and which controls automated driving of t...
|
|
WO/2024/091859A1 |
The present disclosure provides systems and method for cooling a heat source. The system may include a container and a heat exchanger. The heat exchanger may be a liquid-liquid heat exchanger configured to remove heat from a liquid conta...
|
|
WO/2024/088702A1 |
Disclosed is a heat sink (1) for cooling an electrical and/or electronic assembly (4), in particular for electric vehicles or hybrid vehicles, the heat sink having a support surface (32) for supporting the electrical and/or electronic as...
|
|
WO/2024/090719A1 |
The electronic device may comprise: a first structure having a first fastening structure; a second structure disposed on the top of the first structure and having a second fastening structure; a third structure disposed on the top of the...
|
|
WO/2024/089145A1 |
The invention relates to a cooler (KL) for coupling a power electronics module (LM), having: - a first cooler part (KT1) and a second cooler part (KT2) which together circumferentially enclose a cooling channel (KK) for conducting a cool...
|
|
WO/2024/057097A3 |
An electronics package includes a spring screw mounted assembly with a screw, a spring, a washer, electromagnetic shielding, and a seal. The seal is operable to prevent fluids or particulates from entering into the electronics package at...
|
|
WO/2024/084388A1 |
Methods and systems for cooling conditioned spaces (e.g., data centers) are provided. The cooling system includes a radiative cooling component disposed outside of the housing and including a radiative cooling surface configured to provi...
|
|
WO/2024/085324A1 |
The present invention relates to a Pickering emulsion composition for heat dissipation, a heat dissipation paste using same, and a method for manufacturing same and, more specifically, provides a Pickering emulsion composition for heat d...
|
|
WO/2024/085958A1 |
A cooling system may include a tank filled with a first cooling fluid. The cooling system may include a container including a chamber, the chamber receiving a heat-generating component, the container being sealed, the container being at ...
|
|
WO/2024/083749A1 |
The invention relates to a housing (10) for an electronic power device (1) of an electric powertrain, for example for an inverter, the housing (1) comprising a body (13) including a bottom (11) and a set of peripheral walls (12) which de...
|
|
WO/2024/086772A1 |
Systems, methods, and devices are provided for extended thermal transfer from a heat plane. Consistent with this disclosure, a device can include at least one cooling device configured to transfer heat to a fluid, where the cooling devic...
|
|
WO/2024/082915A1 |
Provided in the present application is a heat dissipation device, comprising an evaporator and a condenser. The evaporator comprises a casing and a partition plate; the casing is provided with a sealed inner chamber; the partition plate ...
|
|
WO/2024/085051A1 |
A heat dissipation substrate comprising: a base body that contains a carbon material; a cover member that is positioned on the outer surface of the base body; and a pipe mounting part that is a groove or a through hole positioned across ...
|
|
WO/2024/082678A1 |
A small-size double-redundancy electric power steering motor controller structure, comprising a sealing cover cap, a ventilation valve, a connector, a power joint connector, a bendable PCBA board, screws, a stud screw, a magnet, a radiat...
|
|
WO/2024/085103A1 |
This radiation cooling structure is provided with a reflective layer (13) and a transparent protective layer (14) provided on the reflective layer. A relief surface (16) configured by providing a large number of protrusions (15) differen...
|
|
WO/2024/083244A1 |
A working module (100) and an electronic device (200). The working module (100) is suitable for operating in a heat-dissipating air passage, the direction from an air inlet of the heat-dissipating air passage to an air outlet thereof bei...
|
|
WO/2024/083241A1 |
A working assembly (100) and an electronic device (200). The working assembly (100) comprises: a circuit board (110), the circuit board (110) being provided with a plurality of heating components (111); a first heat dissipator (123), pro...
|
|
WO/2024/085462A1 |
An electronic device according to one embodiment comprises: a housing; a printed circuit board including an insertion hole; at least one electronic component; and a fastening member inserted into the insertion hole, wherein the printed c...
|
|
WO/2024/083239A1 |
A working assembly (100) and an electronic device (200). The working assembly (100) comprises: a circuit board (110) and a heat sink (120); the heat sink (120) comprises a heat dissipation body (121) and a plurality of heat dissipation f...
|
|
WO/2024/085050A1 |
This heat dissipation substrate comprises a base body containing a carbon material, and a plurality of pipe mounting parts positioned on the base body. When the direction in which the plurality of pipe mounting parts are aligned is defin...
|
|
WO/2024/083233A1 |
An electronic device (200). The electronic device (200) comprises: a housing (210), a heat dissipation air duct having an air inlet and an air outlet being defined in the housing (210), and at least one working assembly (100) being provi...
|
|
WO/2024/085125A1 |
This bolt holding structure (100) comprises a bolt (13) and a holder (12). The bolt (13) holds a conductor (bus bar (14) and terminal (15)) between a nut (17) and the bolt (13). The holder (12) holds the bolt (13). The bolt (13) comprise...
|
|
WO/2024/084045A1 |
System (10) for distributing generated electricity to an electrical network (17) and comprises at least one generator (11). A power carrying link (12) from the generators (11) to the grid is also connected to at least one service module ...
|
|
WO/2024/084689A1 |
The present invention addresses the problem of providing a fixed structure, a fixing method, and a fixing device with which a high-precision surface can be held and manufacturing costs can be reduced. Provided is a structure that fixes...
|
|
WO/2024/083717A1 |
A heat sink comprises first coolant channels and second coolant channels. The first coolant channels comprise first inflow sections and are adapted to guide first coolant flows. The second coolant channels comprise second inflow sections...
|
|
WO/2024/082600A1 |
Provided in the present utility model is a bendable vapor chamber, comprising a bending section, wherein several bending-section support columns are arranged in an array on a housing plate of the bending section, and the cross sections o...
|
|
WO/2024/085770A1 |
A system and method for interfacing a module for computation with local 5 infrastructure is provided. The object of the invention is achieved using a receptacle (300) for a module (400) for computation, wherein the receptacle (300) compr...
|
|
WO/2024/082675A1 |
A refrigeration system, comprising a condensation heat exchanger, a switch valve, an evaporation heat exchanger, an adsorption bed and a compressor, wherein the condensation heat exchanger, the switch valve and the evaporation heat excha...
|
|
WO/2024/084972A1 |
[Problem] To prevent, in a surface contact heat exchanger, a brazing material and flux from flowing onto a seal surface of a flange plate. [Solution] In the present invention, an annular protrusion 7 is formed along the edge of a second ...
|
|
WO/2024/084837A1 |
The present invention is a heat radiation composite film that includes a heat radiating layer and an adhesive layer, the film being characterized in that: the thickness of the heat radiating layer is 5-200 μｍ; one surface of the heat ...
|
|
WO/2024/083228A1 |
A circuit board (110), provided with a chip array. The chip array comprises a plurality of power taking units (114), each power taking unit (114) comprises at least one chip (111), and the distances between at least some of the adjacent ...
|
|
WO/2024/083236A1 |
A working assembly (100) and an electronic device (200). The working assembly (100) comprises: a circuit board (110); a first heat sink (123) provided on a first surface of the circuit board (110); and screws (172) and springs (171), whi...
|
|
WO/2024/083229A1 |
A working assembly (100) and an electronic device (200). The working assembly (100) is suitable for working in a heat-dissipating air duct. The working assembly (100) comprises: a circuit board (110), multiple heating components (111) be...
|
