Title:
HEAT DISSIPATION APPARATUS, ELECTRONIC DEVICE AND ELECTRIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/088250
Kind Code:
A1
Abstract:
A heat dissipation apparatus (1), an electronic device (2), and an electric device (3). The heat dissipation apparatus (1) comprises a liquid cooling plate (11) and heat exchange fins (12). The liquid cooling plate (11) is provided with a first surface (111) and a second surface (112) which are oppositely arranged, and a first side surface (113) connecting the first surface (111) and the second surface (112), the first surface (111) being used for mounting an electronic device, and the heat exchange fins (12) being arranged on the second surface (112). A cooling flow channel (114) is provided in the liquid cooling plate (11), and the liquid cooling plate (11) is further provided with a liquid inlet (1131) and a liquid outlet (1132) on the first side surface (113), the liquid inlet (1131) and the liquid outlet (1132) separately communicating with the interior of the cooling flow channel (114). Therefore, the heat dissipation apparatus (1) improves the structural strength and further enhances the heat dissipation capability of itself by means of the heat exchange fins (12).
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Inventors:
GUO LIANGYIN (CN)
GAN SHAOPENG (CN)
CHEN YATI (CN)
ZHAO ZHIHAO (CN)
GAN SHAOPENG (CN)
CHEN YATI (CN)
ZHAO ZHIHAO (CN)
Application Number:
PCT/CN2023/126182
Publication Date:
May 02, 2024
Filing Date:
October 24, 2023
Export Citation:
Assignee:
SHENZHEN RSPOWER TECH CO LTD (CN)
International Classes:
H05K7/20
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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