Title:
HEAT TRANSFER MEMBER AND HEAT TRANSFER MEMBER MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/090236
Kind Code:
A1
Abstract:
The present invention is a heat transfer member which is applied to a cooling device (100), which cools an object-to-be-cooled (70) in a state of being immersed in a liquid refrigerant and promotes heat transfer to the refrigerant from the object-to-be-cooled (70). Furthermore, the object-to-be-cooled (70) is an electronic apparatus. The refrigerant is a fluorine-based insulating refrigerant having a boiling point equal to or lower than 100 °C. The refrigerant is exposed to the atmosphere. In addition, the refrigerant is a heat transfer member of which a degree of superheat dT is 10 K and heat flux q is 300 kW/m2 in a boiling curve with a lateral axis as the degree of superheat dT of the refrigerant and a vertical axis as the heat flux q. However, the degree of superheat dT is a value obtained by subtracting the saturation temperature Ts of the refrigerant from the temperature Tw of the heat transfer member. In addition, the heat flux q is the calories transferred per unit area to the refrigerant from a heat transfer portion.
Inventors:
SHIBATA TAKAHITO (JP)
KOHARA KIMIO (JP)
KAWAMOTO YOICHIRO (JP)
KOHARA KIMIO (JP)
KAWAMOTO YOICHIRO (JP)
Application Number:
PCT/JP2023/037151
Publication Date:
May 02, 2024
Filing Date:
October 13, 2023
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L23/427; F28D15/02; H05K7/20
Attorney, Agent or Firm:
KAI-SEI PATENT FIRM (JP)
Download PDF: