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Title:
HEAT DISSIPATION SUBSTRATE AND HEAT DISSIPATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/085050
Kind Code:
A1
Abstract:
This heat dissipation substrate comprises a base body containing a carbon material, and a plurality of pipe mounting parts positioned on the base body. When the direction in which the plurality of pipe mounting parts are aligned is defined as the X direction, the direction in which the plurality of pipe mounting parts extends is defined as the Y direction, the plane extending in the X direction and the Y direction is defined as the XY plane, and a direction intersecting the XY plane is defined as the Z direction, the thermal conductivity in the Z direction of the substrate is higher than the thermal conductivity in at least one direction along the XY plane of the substrate.

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WO/2016/167217BONDED BODY, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, HEAT SINK, METHOD FOR PRODUCING BONDED BODY, METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE WITH HEAT SINK, AND METHOD FOR PRODUCING HEAT SINK
JP3929374TOWER HEAT SINK
JPH07135279METHOD FOR PACKAGING MULTICHIP MODULE AND MULTICHIP MODULE PACKAGE
Inventors:
MIYAMOTO TAKASHI (JP)
Application Number:
PCT/JP2023/036972
Publication Date:
April 25, 2024
Filing Date:
October 12, 2023
Export Citation:
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Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/36; F28D15/02; H01L23/427; H05K7/20
Domestic Patent References:
WO2004097936A12004-11-11
Foreign References:
JP2016540371A2016-12-22
US20060113064A12006-06-01
JP2022117959A2022-08-12
JPS5748699U1982-03-18
JP2008547216A2008-12-25
JP2022003656A2022-01-11
US20140038362A12014-02-06
Attorney, Agent or Firm:
ARAFUNE Hiroshi et al. (JP)
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