PICKERING EMULSION COMPOSITION FOR HEAT DISSIPATION, HEAT DISSIPATION PASTE USING SAME, AND METHOD FOR MANUFACTURING SAME

WIPO Patent Application WO/2024/085324

A1

The present invention relates to a Pickering emulsion composition for heat dissipation, a heat dissipation paste using same, and a method for manufacturing same and, more specifically, provides a Pickering emulsion composition for heat dissipation comprising: a silicone oil; an aliphatic alcohol; and a thermally conductive filler, and a heat dissipation paste based on the Pickering emulsion and a method for manufacturing same. The thermally conductive filler in the Pickering emulsion forms a segregated network structure, securing high thermal conductivity and stability, and thus the emulsion can be used as a heat dissipation material in various fields. In addition, the filler can be recovered from the heat dissipation paste by using a simple centrifugation method and recycled.

JP2014152189	EPOXY RESIN COMPOSITION FOR SEALING AND SEMICONDUCTOR DEVICE USING THE SAME
WO/2023/125784	RESIN COMPOSITION, AND PREPREG AND USE THEREOF
JP4615665	Resin composition and heat ray and / or UV shielding material using the resin composition

KIM CHAE BIN (KR)
MIN SEONG BAE (KR)
JO YONG SU (KR)

PCT/KR2023/002406

April 25, 2024

February 20, 2023

Click for automatic bibliography generation  

NAT UNIV PUSAN IND UNIV COOP FOUND (KR)

C08K7/18; C08K3/013; C08K5/053; C08L83/04; C09K5/10; H05K7/20

KIM, Jong Seok (KR)

View/Download PDF      PDF Help

Previous Patent: DEVICE AND METHOD FOR OPTIMIZING RELAY UAV TRAJECTORY

Next Patent: COMPOSITION FOR ALLEVIATING, PREVENTING, OR TREATING PERITONEAL FIBROSIS, COMPRISING TIPLAXTININ