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WO/2024/090656A1 |
The present application relates to an abnormal signal detection device using a dual acoustic wave sensor. The abnormal signal detection device using a dual acoustic wave sensor comprises: a housing including a first acoustic wave transmi...
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WO/2024/090331A1 |
[Problem] To improve the sensitivity of an electret capacitor sensor. [Solution] This electret capacitor sensor 1000 includes: an insulating electrode 100 that includes a first electrode 110 and an insulating layer 120; and an electret e...
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WO/2024/088705A1 |
The invention relates to a micromechanical structure (200) and a micromechanical speaker. The micromechanical structure (200) comprises at least one movable bending unit (220), which has a plurality of bending elements (225), wherein the...
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WO/2024/083378A1 |
The invention relates to a method for producing a micromechanical layer structure with a high aspect ratio of a layer thickness (33) to a distance (34) of a first structural element (31) from an adjacent second structural element (32) in...
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WO/2024/086330A1 |
Low-cost, robust, and high performance microelectromechanical systems (MEMS) acoustic sensors are described. Described MEMS acoustic sensors can comprise a set of etch release structures in the acoustic sensor membrane that facilitates r...
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WO/2024/075661A1 |
[Problem] To provide: a curable organopolysiloxane composition from which an organopolysiloxane cured product having viscoelastic properties (particularly, reversion characteristics after deformation by an external stress) that are parti...
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WO/2024/074444A1 |
A measurement microphone (10) comprising: a case (18) to protect the microphone (10); an acoustic sensor (13) to transform sound waves into an analog microphone input signal (24); an equalizer stage (27) built to achieve a substantial eq...
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WO/2024/076073A1 |
The present specification discloses a microphone comprising: a sensor package; and an elastic support which supports the bottom of the sensor package. The sensor package comprises: a lower diaphragm which is disposed on the elastic suppo...
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WO/2024/066132A1 |
Disclosed is a MEMS optical microphone, comprising: a housing, which has an inner cavity and a sound inlet that places the inner cavity in communication with the outside; a micro-electromechanical module, which comprises a diaphragm that...
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WO/2024/067243A1 |
A micro-electromechanical chip, comprising a substrate (1), a support structure layer (2), a diaphragm layer (3), and a back electrode layer (4). Cavities (5) are provided in the middle of the substrate (1) and in the middle of the suppo...
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WO/2024/057567A1 |
[Problem] To provide an electrostatic speaker that allows for greater physical flexibility and more effective utilization of the electrostatic speaker. [Solution] This electrostatic speaker 101 includes: first conductive cloth 111, which...
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WO/2024/058783A1 |
The present invention relates to a fixed-fixed membrane for a microelectromechanical system (MEMS) microphone. In one embodiment, a MEMS acoustic sensor includes a substrate; a membrane situated parallel to the substrate; and at least on...
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WO/2024/053227A1 |
Provided is a biological sound detection device which can detect a desired biological sound signal while suppressing a signal level of a noise signal. This biological sound detection device (100) comprises: a biological sound collection ...
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WO/2024/051441A1 |
A MEMS loudspeaker array (100), which relates to the field of MEMS loudspeakers, and is used for solving the technical problem that the sound production efficiency and the working bandwidth of MEMS loudspeakers cannot be simultaneously m...
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WO/2024/045283A1 |
Provided in the present invention is a MEMS microphone, comprising a base having a back chamber, and a capacitance system arranged on the base, wherein the capacitance system comprises a back plate, and a diaphragm arranged opposite to t...
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WO/2024/040649A1 |
The present application relates to a microphone chip, comprising: a substrate with a front cavity, and a capacitance system, which is arranged on and connected to the substrate. The capacitance system comprises a diaphragm located at an ...
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WO/2024/040494A1 |
The present utility model provides a vibration sensor, comprising a circuit board having an accommodating cavity, and a first vibration assembly having a first vibration cavity and a second vibration assembly having a second vibration ca...
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WO/2024/042036A1 |
A MEMS comprises a layer stack comprising a plurality of MEMS layers and a cavity arranged in the layer stack, said cavity being at least partially delimited by a delimiting structure comprising at least part of a MEMS layer of the layer...
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WO/2024/031961A1 |
Provided in the present invention is a cantilever microphone, comprising: a base plate; a cantilever, which comprises a rotor frame, a cover plate that covers the rotor frame, and a plurality of rotor comb fingers, the cantilever being p...
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WO/2024/034321A1 |
This earphone comprises: a housing 11 to which a guide tube part 15 for emitting sound to the outside is coupled; fixed poles 17 fixed to the inside of the housing 11; a vibration membrane 21 which is provided to bisect the space inside ...
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WO/2024/031783A1 |
A vibration sensor (100), comprising a circuit board (1), and a vibration pickup structure (2) and a signal pickup assembly (3) which are respectively fixed to two opposite sides of the circuit board (1). The vibration pickup structure (...
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WO/2024/026073A1 |
Utilization of microphone ultrasonic response is described. A system, comprising: a microelectromechanical system (MEMS) microphone device configured to capture signal data representing an ultrasonic signal and an audio-band signal simul...
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WO/2024/018625A1 |
In this MEMS element, a backplate (7) including a fixed electrode (5) and a vibrating film (3) including a movable electrode, opposing each other across a spacer (4), are arranged on a substrate (1) provided with a back chamber (9). The ...
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WO/2024/018455A1 |
An earphone assembly including an electrostatic acoustic device. An audio signal is input to the electrostatic acoustic device. The membrane of the electrostatic acoustic device is configured to respond mechanically to a vaiying electric...
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WO/2024/008774A1 |
In order to extend the possible applications of the previously known LIDE (laser induced deep etching) process, according to the invention a micromechanical comb structure (25) is produced by applying a plurality of laser pulses (4) to a...
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WO/2024/008132A1 |
The present application relates to the acoustoelectric field, and particularly relates to technologies responsible for collecting various sounds in mobile application scenarios, such as a hearing aid, a mobile phone and an intelligent lo...
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WO/2024/000797A1 |
An electrostatic clutch (100). The electrostatic clutch (100) comprises: a plurality of grounded high-impedance node electrode arrays (101), which form a rigid movable body; and a plurality of bias electrode arrays (102), which form anot...
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WO/2024/000773A1 |
The present invention provides a MEMS microphone, comprising a substrate having a back cavity and a capacitor system provided on the substrate. The capacitor system comprises a back plate and a vibrating diaphragm provided opposite to th...
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WO/2023/247046A1 |
A microelectromechanical audio module (1) comprising an enclosure (2) comprising an exterior shell (3) and interior support walls (4) extending within said exterior shell (3). At least one first diaphragm (5) and at least one second diap...
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WO/2023/245789A1 |
The present utility model provides a piezoelectric MEMS speaker, comprising a substrate having a back cavity, a diaphragm, a capacitor system, and a flexible film. The diaphragm comprises a fixed end and suspended ends, every two adjacen...
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WO/2023/245806A1 |
Provided in the present utility model is an MEMS loudspeaker, comprising a substrate defining a cavity and provided with openings at two ends, a cantilever extending from one end of the substrate to the cavity and at least partially susp...
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WO/2023/246520A1 |
An MEMS microphone and a microphone processing process. The MEMS microphone comprises a substrate, and a first diaphragm, a second diaphragm, and a back electret mounted on the substrate. Support columns are provided between the first di...
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WO/2023/247473A1 |
The invention relates to a method for producing a MEMS converter for interaction with a volume flow of a fluid. For this purpose, a shaping component for forming a vibration-capable membrane with an actuator layer in the form of a meande...
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WO/2023/244947A1 |
In an example, the present invention provides a micro-speaker device. The device has a movable diaphragm device comprising a thickness of silicon or graphene material which has a first surface and a second surface opposite of the first s...
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WO/2023/237397A1 |
The invention preferably relates to a process for producing a MEMS transducer comprising a membrane and a carrier, wherein the membrane has a meandering structure comprising vertical and horizontal sections. This comprises initially prov...
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WO/2023/239352A1 |
A vertical dual microphone stand is a single column microphone stand configured for the attachment of at least two microphones, wherein the positioning of the microphones is independently adjustable in the vertical and horizontal position.
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WO/2023/232452A1 |
The invention relates to a MEMS element (11, 12) for moving a mass element (110) of an acoustic transducer (101, 102) for generating and/or receiving acoustic signals (120), wherein the MEMS element is produced from a substrate (21, 22),...
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WO/2023/225978A1 |
A MEMS device, comprising: a first dielectric substrate (10), and a first assembly (100) provided on the first dielectric substrate (10). The first assembly (100) and the first dielectric substrate (10) define a movement space; the first...
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WO/2023/226761A1 |
A preparation process for a touch sound production display unit, comprising: processing one side between a first substrate (1) and a second substrate (4) to form a touch structure of a touch area (3), and processing the other side to for...
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WO/2023/226764A1 |
Disclosed in the present invention are a touch sound production display unit and apparatus. The unit comprises, successively stacked from top to bottom, a first substrate, a sound production layer, a second substrate layer and a third su...
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WO/2023/222593A1 |
The invention relates to a micromechanical component for a sensor device, microphone device and/or micro-loudspeaker device having a capping structure (12) with an inner side (12a) of the capping structure (12) which is oriented towards ...
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WO/2023/216686A1 |
The present application discloses a dual-diaphragm MEMS microphone and a manufacturing method therefor. The dual-diaphragm MEMS microphone comprises: a back plate unit, a first diaphragm, a second diaphragm, and multiple connection units...
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WO/2023/216687A1 |
The present application discloses a microphone structure and a voice communication device. The microphone structure comprises a hollow housing, a first substrate, an acoustic element, a second substrate, a third substrate and an elastic ...
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WO/2023/206642A1 |
A diaphragm (2) and an MEMS sensor (100) using the diaphragm. The diaphragm (2) is a rectangular diaphragm; the diaphragm comprises a diaphragm main body portion (21) as well as fixing portions (22) which are provided on the outside of t...
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WO/2023/206644A1 |
Provided is a MEMS microphone chip, comprising a substrate, a first diaphragm fixed to the substrate, a supporting member fixed to the first diaphragm, and a second diaphragm fixed to the supporting member and spaced apart from the first...
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WO/2023/206721A1 |
Provided in the present invention is an MEMS microphone. The MEMS microphone comprises a base having a back cavity and a capacitive system arranged on the base; the capacitive system comprises a back plate and a diaphragm arranged opposi...
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WO/2023/202418A1 |
Disclosed are a microphone assembly and an electronic device. The microphone assembly comprises a substrate, a diaphragm and a back plate. The diaphragm is located between the substrate and the back plate in the direction perpendicular t...
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WO/2023/201811A1 |
The present utility model provides a MEMS microphone, comprising a housing provided with an accommodating space, a sound hole that penetrates through the housing, MEMS microphone chips and an ASIC chip that are accommodated in the accomm...
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WO/2023/201828A1 |
The present utility model provides a microphone, comprising a protection structure provided with an accommodating space, and an ASIC chip and a MEMS microphone chip accommodated in the accommodating space. The microphone further comprise...
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WO/2023/202417A1 |
Disclosed are a microphone assembly and an electronic device. The microphone assembly comprises a substrate, a diaphragm and a back plate. The diaphragm is located between the substrate and the back plate in the direction perpendicular t...
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