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WO/2020/176149A1 |
A method of forming an ultrasonic transducer device includes forming and patterning a film stack over a substrate, the film stack comprising a metal electrode layer and a chemical mechanical polishing (CMP) stop layer formed over the met...
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WO/2020/159652A1 |
A microphone assembly comprises a substrate. An acoustic transducer is disposed on the substrate and configured to generate an electrical signal responsive to an acoustic signal. An integrated circuit is disposed on the substrate and ele...
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WO/2020/160348A1 |
The problem of contaminants entering a microphone assembly through a pressure equalization aperture is mitigated by moving the pressure equalization aperture from a location near the acoustic port to a location on the cover of the microp...
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WO/2020/154066A1 |
The present disclosure relates in a first aspect to a method of detecting leakage current from a DC bias voltage circuit of an integrated circuit for a capacitive microelectro mechanicalsystems (MEMS) transducer. A test signal with a pre...
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WO/2020/151140A1 |
The present invention relates to an electret capacitor microphone with a small noise coefficient and a manufacturing method thereof, comprising a housing and an electret type variable capacitor mounted in the housing, and an ASIC amplifi...
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WO/2020/140572A1 |
Provided is a method for manufacturing an MEMS microphone, the method comprising the following steps: selecting a substrate, and manufacturing a first diaphragm structure on a first surface of the substrate; manufacturing back plate stru...
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WO/2020/142320A1 |
An active noise reduction (ANR) device includes a first sensor configured to generate an input signal indicative of an environment of the active noise reduction device, in which the first sensor has a measured roll-off frequency. A first...
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WO/2020/140569A1 |
The present invention provides a piezoelectric microphone, comprising a base having a back cavity and a piezoelectric cantilever diaphragm fixed at the base. The piezoelectric cantilever diaphragm comprises a first diaphragm positioned a...
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WO/2020/133375A1 |
An MEMS sound sensor for detecting sound by means of at least one of air sound pressure change and mechanical vibration. The MEMS sound sensor comprises: a substrate provided with a back hole; a back plate provided above the substrate, a...
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WO/2020/139860A1 |
A microelectromechanical system (MEMS) transducer includes a transducer substrate, a diaphragm, and a stiffening member. A first side of the diaphragm is coupled to the transducer substrate. A second side of the diaphragm is coupled to t...
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WO/2020/133334A1 |
Disclosed is an MEMS sound sensor, comprising: a substrate; and a first sound sensing unit and a second sound sensing unit arranged on the substrate, wherein the first sound sensing unit is used for detecting a sound by means of at least...
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WO/2020/133312A1 |
A MEMS sound sensor, comprising: a substrate and a first sound sensing unit and a second sound sensing unit arranged on the substrate; the first sound sensing unit is used for detecting sound by means of at least one of air sound pressur...
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WO/2020/137966A1 |
This ultrasound device comprises: a support substrate; an ultrasound element; an attenuating material; and one or more electronic elements. The support substrate has a first surface, and a second surface on the reverse side of the first ...
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WO/2020/133352A1 |
An MEMS sound sensor, for use in detecting sound by means of at least one of air sound pressure change and mechanical vibration. The MEMS sound sensor comprises: a back plate; a diaphragm opposite to the back plate and having a gap with ...
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WO/2020/126843A1 |
Microphone capsules for capacitive or electret microphones often have individual deviations from a desired ideal electro-acoustic response, e.g. the frequency response and the phase response. In particular when multiple microphone capsul...
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WO/2020/124630A1 |
Provided is a combination sensor, comprising: a substrate (1); a first ASIC chip (2) and a second ASIC chip (3) mounted in the substrate (1); a first lead plate (4) and a second lead plate (5) arranged on the substrate (1); a first MEMS ...
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WO/2020/123725A2 |
A transducer assembly comprises an acoustic transducer comprising a transducer substrate having a first aperture defined at a first location of the transducer substrate, an acoustic transducer diaphragm disposed on the transducer substra...
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WO/2020/113698A1 |
Disclosed are a combined sensor (100) and an electronic device. The combined sensor (100) comprises a cover (10), a substrate (30), an environment sensor (50) and an acoustics sensor (70), wherein the substrate (30) and the cover (10) en...
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WO/2020/113696A1 |
A combined sensor, the combined sensor comprising: a substrate (100), the substrate having an upper surface (110) and a lower surface; a first MEMS chip (310) and a first ASIC chip (320), the first MEMS chip (310) and the first ASIC chip...
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WO/2020/112769A2 |
A diaphragm for use in a transducer, the diaphragm including a flexible layer configured to deflect in response to changes in a differential pressure. The flexible layer includes a lattice grid. The lattice grid includes a first pluralit...
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WO/2020/106637A1 |
A MEMS transducer for a microphone includes a closed chamber, an array of conductive pins, a dielectric grid, and a diaphragm. The closed chamber is at a pressure lower than atmospheric pressure. The array of conductive pins is in a fixe...
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WO/2020/101093A1 |
The present invention relates to a directional microphone device comprising: a first substrate including a first sound hole; a first MEMS transducer positioned at the first substrate to correspond to the first sound hole, and outputting ...
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WO/2020/102492A1 |
A method of forming an ultrasonic transducer device includes forming an insulating layer having topographic features over a lower transducer electrode layer of a substrate; forming a conformal, anti-stiction layer over the insulating lay...
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WO/2020/094412A1 |
A method of manufacturing a semiconductor transducer device comprises providing a semiconductor body (1), forming a sacrificial layer (5) above a surface of the semiconductor body (1), applying a diaphragm (10) on the sacrificial layer (...
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WO/2020/097524A1 |
An acoustic transducer for generating electrical signals in response to acoustic signals includes a transducer substrate, a back plate, and a diaphragm assembly. The diaphragm assembly includes a first diaphragm and a second diaphragm co...
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WO/2020/083791A1 |
A sensor includes a substrate; and a corrugated diaphragm offset from the substrate. The corrugated diaphragm is configured to deflect responsive to a sound wave impinging on the corrugated diaphragm. A cavity is defined between the corr...
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WO/2020/086819A2 |
A microphone assembly includes a substrate and a microelectromechanical systems (MEMS) die. The substrate comprises a top layer and a bottom layer. The top layer comprises a layer of solder mask material spanning across at least a portio...
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WO/2020/080353A1 |
This control circuit is provided with: a voltage output circuit control unit which, when a detection control signal is at a first level, controls a voltage output circuit such that voltage corresponding to an output control signal and de...
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WO/2020/073358A1 |
Disclosed are a microphone and an electronic device, comprising a housing having an internal chamber and a microphone unit disposed in the internal chamber of the housing; and further comprising an acoustically sealed electret film and a...
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WO/2020/073357A1 |
An MEMS sensor comprises: a substrate (2) and a vibration diaphragm (1) supported above the substrate (2) by means of a spacing portion (4), the substrate (2), the spacing portion (4), and the vibration diaphragm (1) enclosing to form a ...
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WO/2020/076637A1 |
The present disclosure relates to compact hearing aids, components thereof, and support systems therefor, as well as methods of insertion and removal thereof. The compact hearing aids generally include a sensor, such as a microphone, an ...
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WO/2020/072920A1 |
A microphone device includes a base and a microelectromechanical system (MEMS) transducer and an integrated circuit (IC) disposed on the base. The microphone device also includes a cover mounted on the base and covering the MEMS transduc...
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WO/2020/072904A1 |
An acoustic transducer for generating electrical signals in response to acoustic signals, comprises a first diaphragm having a first corrugation formed therein. A second diaphragm has a second corrugation formed therein, and is spaced ap...
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WO/2020/071052A1 |
An electrostatic electroacoustic transducer according to the present invention suppresses the distortion of sound waves caused by uneven vibration of a diaphragm.　The present invention is a signal processing circuit 12 for an electrost...
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WO/2020/062144A1 |
An MEMS sound sensor, comprising: a back plate (100), which is provided with a plurality of sound holes (110); a diaphragm (200), which is arranged opposite the back plate, with a gap (10) between same and the back plate, the diaphragm a...
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WO/2020/064428A1 |
A micro-electro-mechanical system, MEMS, microphone assembly comprises an enclosure (10) defining a first cavity (11), and a MEMS microphone (20) arranged inside the first cavity (11). The microphone (20) comprises a first die (21) with ...
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WO/2020/045843A1 |
By attaching a support plate to a support and forming an anchor supporting a diaphragm at the edge region of the support plate, a MEMS capacitive microphone of the present invention is capable of being realized as a microphone having exc...
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WO/2020/041358A1 |
An improved loudspeaker that has a plurality of stacks of cards having electrostatic transducers, in which a low capacitance PCB stator is utilized within the cards. The stators have metal that is not energized and thus exhibit low capac...
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WO/2020/037198A1 |
A micro-electro-mechanical system (MEMS) sensor can comprise a substantially rigid layer having a center. The MEMS sensor can further comprise a movable membrane that can be separated by a gap from, and be disposed substantially parallel...
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WO/2020/033772A1 |
A digital microphone includes built-in self-test features. The features may include capability to apply different bias voltages to a MEMS capacitor sensor of the digital microphone, simulating application of different sound pressures to ...
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WO/2020/033534A1 |
Described are micro electrostatic transducers and methods of making such devices. The micro electrostatic transducer is an integrated component transducing device fabricated from materials allowing for low cost, high volume manufacturing...
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WO/2020/029360A1 |
Disclosed in the present invention is a sensor, wherein a detection structure comprises a first magnet, a second magnet, and a magnetoresistive sensor disposed in a common magnetic field formed by the first magnet and the second magnet. ...
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WO/2020/033761A1 |
A digital microphone compresses a large voltage swing signal from a MEMS capacitor to a signal suitable for processing by integrated circuitry. The compression may be performed in an analog domain by selectively coupling adjustment capac...
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WO/2020/033445A1 |
This disclosure provides systems, methods, and apparatus related to acoustic transducers.
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WO/2020/023317A1 |
Microphone devices and methods for manufacturing microphone devices that include a substrate having a first surface and a second surface, a cover secured to the first surface of the substrate to form an enclosed back volume, an applicati...
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WO/2020/014839A1 |
Provided in an embodiment of the present invention are a housing assembly and an electronic device. The housing assembly comprises a housing main body having a sound hole and a sound-guiding channel. One end of the sound-guiding channel ...
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WO/2020/000691A1 |
Provided in an embodiment of the present invention are an electret (21)-based microphone, an acoustic vibration detection device, and a racing remote control car. The electret (21)-based microphone provided in the embodiment of the prese...
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WO/2020/000649A1 |
An MEMS condenser microphone, comprising a first substrate (1) and a vibration diaphragm (2) supported above the first substrate (1) by means of a spacing portion (3), the first substrate (1), the spacing portion (3) and the vibration di...
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WO/2020/000651A1 |
Provided is a MEMS microphone, comprising a first substrate (1) and a diaphragm (2) supported on the first substrate (1) by means of a partition (3). The first substrate (1), the partition (3), and the diaphragm (2) enclose and form a va...
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WO/2020/000647A1 |
Disclosed is a microphone. The microphone comprises a first substrate having an inner cavity with one end having an opening, and further comprises a vibrating diaphragm and at least one cantilever located on the first substrate and suspe...
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