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WO/2018/106513A1 |
A microelectromechanical system (MEMS) device includes at least one substrate, a lid, a MEMS component, a sensor, and a power supply. The lid is coupled to the substrate so that the substrate and the lid cooperatively define an interior ...
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WO/2018/103208A1 |
Disclosed in the present invention are an MEMS microphone chip, and MEMS microphone. The microphone chip comprises a substrate, a back electrode, and a vibration diaphragm. The back electrode and vibration diaphragm respectively form two...
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WO/2018/106514A1 |
This disclosure provides methods, systems, and apparatuses, for a microelectromechanical (MEMS) acoustic microphone circuit. In particular, the circuit includes a high pass filter formed by a combination of a capacitive microphone and a ...
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WO/2018/102293A1 |
A MEMS may include a backplate comprising first and second electrodes electrically isolated from one another and mechanically coupled to the backplate in a fixed relationship relative to the backplate, and a diaphragm configured to mecha...
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WO/2018/100373A1 |
A MEMS transducer comprising: a flexible membrane, the flexible membrane comprising a first membrane electrode; a back plate, the back plate comprising a first back plate electrode; wherein the back plate is supported in a spaced relatio...
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WO/2018/102291A1 |
A MEMS microphone may include a backplate comprising first and second electrodes electrically isolated from one another and mechanically coupled to the backplate in a fixed relationship relative to the backplate and a diaphragm configure...
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WO/2018/094963A1 |
Provided are a micro-silicon microphone and a manufacturing method thereof for solving a technical problem in which sensitivity and a manufacturing process of a micro-silicon microphone are affected by stress of the micro-silicon microph...
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WO/2018/097086A1 |
Provided is an electrostatic type transducer (1) in which an electrostatic type unit (10) is formed so as to be flat and wound into a roll, from a first laminate sheet (110) and a second laminate sheet (120). The first laminate sheet (11...
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WO/2018/096130A1 |
A MEMS transducer system includes a MEMS transducer device for sensing at least one of pressure signal or acoustic signal. The MEMS transducer device includes first and second diaphragms. Formed between the diaphragms are a spacer, plate...
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WO/2018/091690A1 |
A microphone system includes first diaphragm element, second diaphragm element spaced apart from the first diaphragm element and connected to the first diaphragm element via a spacer. Disposed between the diaphragm elements is a plate ca...
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WO/2018/091644A1 |
A system includes a pressure sensor combined with a MEMS microphone. The pressure sensor and the MEMS microphone arranged side by side are formed on a same substrate.
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WO/2018/090343A1 |
Disclosed are a microphone, and a method and device for audio processing for improving sound receiving and processing quality. The microphone comprises: a first sound sensor (101) for receiving sound signals in a first sound pressure lev...
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WO/2018/089352A2 |
Methods and systems for synchronizing audio streams. The method includes tagging a first presentation time to a frame buffer of a first audio stream and a second presentation time to a frame buffer of a second audio stream. The second au...
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WO/2018/079145A1 |
Provided is an electrostatic transducer (1) which is small in size and has a large electrostatic capacitance, while having a durable constituent part of a conduction path, said constituent part being connected to an electrode. This elect...
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WO/2018/074674A1 |
In order to solve problems with an audio device that is difficult to machine and has an increased amount of wiring, the present invention provides an audio output device comprising: a first electrode layer including a plurality of rows o...
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WO/2018/065717A1 |
Electromechanical pressure sensor system, in particular microphone type, comprising: an electromechanical transducer, signal processing means, a substrate (1) for receiving at least one support (20, 30) of the electromechanical transduce...
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WO/2018/064803A1 |
The present invention discloses a MEMS microphone device and an electronics apparatus. The MEMS microphone device comprises: a substrate; a MEMS microphone element placed on the substrate; a cover encapsulating the MEMS microphone elemen...
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WO/2018/061395A1 |
This ultrasonic transducer has: a hollow section 110, which is formed between insulating films 104, 106 sandwiched between a lower electrode 103 and an upper electrode 107 that are formed on a substrate 101; and a membrane 120 comprising...
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WO/2018/061991A1 |
Provided are: a resin material for an acoustic wave probe, the resin material containing a polymer having (a) a structural unit having a specific polysiloxane bond and (b) at least one type of a structural unit having a specific partial ...
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WO/2018/052584A1 |
A microphone can include a cover having a series of slits and a nest. The nest can be configured to receive a first diaphragm, a second diaphragm, and a PCB in a stacked arrangement, such that the PCB is positioned between the first diap...
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WO/2018/041444A1 |
The invention relates to a method for producing a micromechanical sensor (100), comprising the following steps: providing an MEMS wafer (10) having an MEMS substrate (1), wherein a defined number of etched trenches is formed in the MEMS ...
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WO/2018/035669A1 |
A capacitive MEMS microphone (20,30,43) and an electronic apparatus are provided. The capacitive MEMS microphone (20,30,43) comprises: a diaphragm (21,31); and a substrate (24,34), wherein a cavity (23,33) is formed between the diaphragm...
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WO/2018/037205A1 |
The application describes a MEMS transducer comprising a layer of conductive material provided on a surface of a layer of membrane material. The layer of conductive material comprises first and second regions, wherein the thickness and/o...
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WO/2018/032466A1 |
An electret condenser microphone is provided. The electret condenser microphone comprises a diaphragm, a backplate with a metal layer on the side facing the diaphragm and an amplifier on the other side, the input of the amplifier electri...
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WO/2018/020214A1 |
The application describes MEMS transducers comprising a flexible membrane layer supported in a fixed relation relative to a substrate along at least one supporting edge, wherein a plurality of slits are provided through the membrane laye...
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WO/2018/020213A1 |
The application describes a MEMS transducer in which first and second conductive elements of a capacitor are both provided on the membrane. The membrane is shaped that the first and second conductive elements are displaced relative to ea...
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WO/2018/021096A1 |
Provided are a thin microphone, a packaging method to be used in manufacturing the microphone, and an electronic device. Microphones 1, 1A, 1B, 1C, 1D, 1E, 2, 3, and 4 are each provided with: a die 11 on which a transducer is mounted; a ...
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WO/2018/022209A1 |
Methods and devices are provided for a wireless microphone network whereby robustness for reception of audio information transmitted by one or more wireless microphones is enhanced. The system incorporates a dual stage network approach f...
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WO/2018/022773A1 |
Systems, apparatuses, and methods for manufacturing a microelectromechanical system (MEMS) device. The MEMS device includes a substrate, a cap, a microelectromechanical component, and a tag. The substrate defines a port. The cap is coupl...
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WO/2018/018002A1 |
A microphone assembly includes an acoustic transducer element configured to convert sound into a microphone signal in accordance with a transducer frequency response including a first highpass cut-off frequency. The microphone assembly a...
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WO/2018/010065A1 |
A condenser MEMS microphone comprises: a substrate (32); a bottom plate (12) placed on the substrate (32); and a top plate (11) placed above the bottom plate (12) and spaced from the bottom plate (12), wherein the top plate (11) is torsi...
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WO/2018/013571A1 |
An integrated circuit includes a first amplifier and a second amplifier. A first impedance matching circuit is coupled to the first amplifier, a first charge pump, and a single MEMS transducer. A second impedance matching circuit is coup...
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WO/2018/012448A1 |
A microphone unit having a microphone body built in a housing, the microphone unit detecting a sound entering the inside of the housing from a sound hole in the housing with the microphone body. An optical detector that detects light ent...
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WO/2018/008181A1 |
The present invention relates to an electrostatic capacitance type sensor manufactured using MEMS technology, and provides a technique which enables a high SN ratio to be obtained, and which enables an increase in resistance to input pre...
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WO/2018/009308A1 |
A microphone includes a microelectromechanical system (MEMS) die configured to sense an acoustic signal, a base, and a lid. The base has a top surface and a bottom surface. The bottom surface includes a first electrical pad and a second ...
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WO/2018/002595A1 |
The present application describes MEMS transducer having a membrane and a membrane electrode. The membrane and membrane electrode form a two-layer structure. The membrane electrode is in the form of a lattice of conductive material. The ...
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WO/2018/002566A1 |
The application describes MEMS transducer structures- comprising a membrane structure having a flexible membrane layer and at least one electrode layer. The electrode layer is spaced from the flexible membrane layer such that at least on...
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WO/2018/002565A1 |
A MEMS transducer structure comprises a substrate comprising a cavity. A membrane layer is supported relative to the substrate to provide a flexible membrane. A peripheral edge of the cavity defines at least one perimeter region that is ...
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WO/2018/005525A1 |
Pump systems having electrically conductive membranes are described. In embodiments of the invention, the electrically conductive membranes can be utilized as speakers to produce ultrasonic and audible sounds. The electrically conductive...
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WO/2018/002567A1 |
The application describes MEMS transducers comprising a flexible membrane supported at a supporting edge relative to a substrate and further comprising one or more unbound edges. The shape of the unbound edge is selected so that the flex...
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WO/2017/220419A1 |
The microphone and pressure sensor package comprises a carrier (1)with an opening (16),a microphone device (20) including a diaphragm (21) and a perforated back plate (22) arranged above the opening (16), an ASIC device (6),and a cover (...
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WO/2017/207953A1 |
A wafer for use in fabricating a plurality of individual transducer devices comprises a bracing structure for partitioning the wafer into a plurality of regions, and a plurality of transducer devices fabricated in one or more of the plur...
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WO/2017/206813A1 |
A MEMS microphone comprises a substrate (110), a lower electrode layer (120), a sacrificial layer (130), a stress layer (140), and an upper electrode layer (150). The substrate (110) is centrally provided with a first opening (111), and ...
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WO/2017/205533A1 |
A microphone device comprises a microphone die including a first microphone motor and a second microphone motor, an acoustic integrated circuit structured to process signals produced by the first microphone motor and the second microphon...
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WO/2017/195946A1 |
Disclosed are an electronic device capable of performing a function or an operation according to a voice command inputted through a microphone, and a control method therefor, the device comprising: a voice acquisition microphone for rece...
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WO/2017/196016A1 |
[Technical field/Problems to be solved] The present invention relates to a device for sensing an inputted sound and converting the same into corresponding light. [Means for solving problems] The present invention comprises: a wideband fi...
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WO/2017/194580A1 |
A MEMS sensor system and method of operation is provided. The MEMS sensor system comprises a sensor device having a movable member and a sensor circuitry communicatively coupled the sensor device to at least one or more terminals. The se...
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WO/2017/191874A1 |
The present invention relates to an electronic device and a control method thereof. The electronic device comprises: a microphone for acquiring sound; and a control unit for determining whether the acquired sound is a learned sound and o...
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WO/2017/189932A1 |
Microelectromechanical systems (MEMS) sensors and related bias voltage techniques are described. Exemplary MEMS sensors, such as exemplary MEMS acoustic sensors or microphones described herein can employ one or more bias voltage generato...
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WO/2017/180858A1 |
A microelectromechanical system (MEMS) device package for encapsulating a MEMS device a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms either side walls or a divider of the MEM...
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