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WO/2017/030839A1 |
One method of processing microphone input in an ADC to determine microphone configuration is to process the microphone input signals in two processing paths, in which one processing path processes a difference between differential input ...
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WO/2017/027509A1 |
A device includes a first microelectromechanical systems (MEMS) transducer, a second MEMS transducer and a summing device. A first dimension of the first MEMS transducer is predefined to configure the first MEMS transducer to have a firs...
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WO/2017/027295A1 |
A first MEMS motor and s second MEMS motor share a common back volume and a common support structure, and the common support structure is configured to support a first diaphragm and the first back plate, and the common support structure ...
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WO/2017/027242A1 |
A surface-mountable MEMS microphone comprising a MEMS microphone die and an application-specific integrated circuit (ASIC) mounted inside a surface-mountable package housing, and fully enclosed therein. The surface-mountable package is a...
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WO/2017/018645A1 |
A speaker apparatus includes a speaker unit including a magnet configured to provide a magnetic field; and a membrane disposed in the magnet field, configured to be vibratable in a first direction, and configured to emit a sound in a sec...
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WO/2017/019463A1 |
A microphone device is comprises a first micro electro mechanical system (MEMS) device and a second MEMS device with difference size of pierce holes in the diaphragms. Signal outputs from the first and second MEMS devices are selectively...
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WO/2017/019434A1 |
Speaker driver devices (1101) including a diaphragm (1102) and one or more electrode (1103) are provided herein. The diaphragms (1102) and electrodes (1103) of the speaker driver devices may each include carbon nanotubes and/or graphene....
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WO/2017/015516A1 |
Various embodiments relating to microphone with integrated sensor are disclosed herein. In one implementation, a sensor is disposed in, on, integrated with, and/or at the lid of a micro electro mechanical system (MEMS) microphone. In ano...
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WO/2017/015503A1 |
The present application describes bone conduction microphone (BCM) systems and applications thereof. An example apparatus includes: (a) an enclosing structure having a cavity therein, wherein a first portion of the enclosing structure is...
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WO/2017/012122A1 |
The embodiments of the present invention relate to a silicon microphone device, comprising a silicon microphone body and a protective unit. The silicon microphone body comprises: a printed circuit board, a housing, and a silicon micro-el...
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WO/2017/009769A1 |
A microphone circuit including a JFET or MOSFET transistor, a terminal of an input-impedance-network connected to the transistor's gate, one terminal of a source resistor connected to the transistor's source, and another terminal connect...
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WO/2017/011266A1 |
A capacitive transducer includes first and second fixed outer plates, each having fixed electrodes positioned on inner surfaces, and a center plate assembly positioned between the fixed outer plates. The center plate assembly includes a ...
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WO/2017/006250A1 |
An acoustic transducer including a transducer including a first rigid conductive grid, a second rigid conductive grid, and an elastic conductive diaphragm located between the first rigid conductive grid and the second rigid conductive gr...
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WO/2017/002746A1 |
A composition for acoustic wave probes, which contains a polysiloxane mixture containing at least a polysiloxane having a vinyl group and a phenyl group, a polysiloxane having two or more Si-H groups in each molecule chain, and zinc oxid...
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WO/2017/002997A1 |
A microphone package is disclosed. The microphone package according to the present invention comprises: a base substrate having an acoustic hole; a transducer positioned to cover at least a portion of the acoustic hole on the upper surfa...
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WO/2016/202790A2 |
The invention relates to a MEMS transducer for interacting with a volume flow of a fluid, comprising a substrate having a cavity, and an electromechanical transducer which is connected to the substrate in the cavity and has an element wh...
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WO/2016/202661A1 |
A MEMS microphone including a plurality of overtravel stops (OTS) connected to a perimeter of a membrane of the MEMS microphone. The OTS are released from a backplate layer during manufacturing and are configured to contact the backplate...
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WO/2016/199009A1 |
An electrostatic loudspeaker, or a diaphragm for an electrostatic loudspeaker, where the diaphragm includes a plurality of conductive parts and, at least one insulator part separating between the conductive parts, and where each of the p...
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WO/2016/192359A1 |
Disclosed is an MEMS microphone element, comprising: a substrate, a first hole and a second hole that penetrate the substrate vertically being provided on the substrate; a first capacitor and a second capacitor that are arranged above th...
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WO/2016/192373A1 |
Disclosed are an integrated structure of an MEMS microphone and a pressure sensor, and a manufacturing method thereof. The method comprises: sequentially depositing, on a shared substrate, an insulation layer, a first polysilicon layer, ...
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WO/2016/194208A1 |
This ultrasonic transducer element is configured by being provided with: a substrate; a lower electrode formed on a first main surface of the substrate; a first insulating film formed on the lower electrode; a first cavity layer formed o...
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WO/2016/194591A1 |
In a capacitive-detection-type ultrasonic transducer, variation in the film thickness of a membrane of each cell in a cell array of the ultrasonic transducer causes the device characteristics of cells in the cell array to be nonuniform. ...
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WO/2016/192358A1 |
Disclosed is a differential-capacitance type MEMS microphone, comprising: a circuit board, a first MEMS chip and a second MEMS chip; the first MEMS chip comprises a first substrate arranged on the circuit board, and a first capacitor arr...
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WO/2016/190534A1 |
A microphone package and a manufacturing method therefor are disclosed. The microphone package and the manufacturing method therefor, of the present invention, comprise: a base substrate having an electrode formed on the upper surface th...
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WO/2016/191256A1 |
A portable audio input/output device may include one or more openings that extend through a cover of the device and allow acoustic signals outside a housing of the device to reach a microphone disposed within the housing. The opening(s) ...
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WO/2016/187325A1 |
An improved compact electroacoustic transducer and loudspeaker system. The electroacoustic transducer (or array of electroacoustic transducers) can generate the desired sound by the use of pressurized airflow. The electroacoustic transdu...
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WO/2016/180262A1 |
An MEMS microphone comprises a substrate (100), a support portion (200), a superimposed layer (600), an upper plate (300) and a lower plate (400). The substrate (100) is provided with an opening (120) penetrating the middle thereof; the ...
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WO/2016/183494A1 |
A microphone includes a base and a microelectromechanical system (MEMS) die mounted to the base. The microphone also includes an integrated circuit fixed to the base. The microphone further includes a lid mounted to the base that enclose...
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WO/2016/180820A1 |
The present invention relates to a sound converter arrangement (1) having a first MEMS sound converter (21) for generating and/or detecting soundwaves in the audible wavelength spectrum which comprises a first cavity (41) and an ASIC (11...
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WO/2016/181346A1 |
A loudspeaker comprising at least three primary radiating heads (11) capable of radiating in a primary frequency range, and at least one secondary radiating head (13) capable of radiating in a secondary frequency range, the primary radia...
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WO/2016/179392A1 |
Digital data representing sound energy is received. The digital data is compressed and encoded into compressed and encoded digital data. The compressed and encoded digital data is inserted into a frame structure. The frame structure is t...
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WO/2016/176994A1 |
Provided is a MEMS microphone encapsulation structure, comprising an encapsulation base plate (1) an outer housing (4); said encapsulation housing (4) is arranged on the encapsulation base plate (1) and forms a sealed accommodating chamb...
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WO/2016/176993A1 |
Provided is a MEMS microphone encapsulation structure, comprising a closed inner chamber formed by an encapsulation housing, and a MEMS chip (3) and ASIC chip (2) located in the closed inner chamber; sound holes (10) allowing sound to fl...
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WO/2016/175050A1 |
The ultrasonic transducer according to the present invention is provided with: a plurality of piezoelectric elements for emitting an ultrasonic wave in response to the input of an electric signal, and converting an ultrasonic wave incide...
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WO/2016/175929A1 |
Offset cartridge microphones are provided that include multiple unidirectional microphone cartridges mounted in an offset geometry. Various desired polar patterns and/or desired steering angles can be formed by processing the audio signa...
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WO/2016/166763A2 |
According to some embodiments there is provided a sound and detection system comprising at least a digital sound reconstruction speaker apparatus, comprising a plurality of pressure-pulse producing elements, and at least a controlling un...
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WO/2016/161670A1 |
Disclosed are an MEMS silicon microphone and a manufacturing method therefor. By arranging a single crystal silicon vibrating diaphragm (2) above a multi-hole back plate silicon substrate (1), and separating same by a silicon dioxide lay...
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WO/2016/157828A1 |
Provided are a highly reliable probe including a light reflecting layer, which is resistant to the falling off of the light reflecting layer, and an information obtaining apparatus using the same. The probe includes: an element including...
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WO/2016/160327A1 |
A dual diaphragm microphone can be used to reduce or eliminate a component of the output signal due to acceleration of the microphone. The dual diaphragm microphone can include a first sound-detecting component including a first diaphrag...
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WO/2016/153851A1 |
An acoustic device includes a substrate that has a port. The acoustic device further includes a microelectromechanical system (MEMS) that converts sound energy into electrical energy. The MEMS is attached to the substrate over the port. ...
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WO/2016/153871A1 |
A Microelectromechanical System (MEMS) microphone includes a base printed circuit board (PCB), the base PCB having customer pads; at least one wall coupled to the base; a lid PCB coupled to the at least wall, the lid having a port extend...
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WO/2016/150487A1 |
A MEMS microphone with an improved sensitivity, e.g. reduced temperature dependence of the sensitivity, is provided. The microphone comprises a MEMS capacitor, charging circuit and a bias circuit. The bias circuit comprises a closed loop...
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WO/2016/150486A1 |
A charge pump assembly allowing MEMS microphones being temperature-compensated in a large temperature range and corresponding microphones are provided. An assembly comprises a charge pump and a bias circuit electrically connected to the ...
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WO/2016/143867A1 |
Provided is a technology that makes it possible to avoid damage to a vibrating electrode film by suppressing excessive deformation of the vibrating electrode film when acted upon by excessive pressure, while maintaining good frequency ch...
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WO/2016/134596A1 |
Disclosed are a digital microphone and audio device. The digital microphone comprises a shell body as well as a circuit board and a line spooling apparatus which are arranged inside the shell body; the line spooling apparatus comprises a...
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WO/2016/132199A1 |
A system for reception of at least audio signals of a predetermined quality from a remote location; said system comprising an at least first digital device incorporating a microphone located at a remote location; a master digital device ...
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WO/2016/133722A1 |
A microphone system includes a first transducer deployed at a first microphone; a second transducer deployed at a second microphone, the first microphone being physically distinct from the second microphone; a decimator deployed at the s...
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WO/2016/127119A1 |
An improved loudspeaker having pump cards that include an array of electrically conductive membrane transducers (such as polyester-metal membrane pumps). The array of electrically conductive membrane transducers combine to generate the d...
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WO/2016/120213A1 |
The application describes MEMS transducer having a flexible membrane and which seeks to alleviate and/or redistribute stresses within the membrane layer. A membrane having a first/active region and a second/inactive region is described.
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WO/2016/120214A1 |
The application describes MEMS transducer having a flexible membrane and which seeks to alleviate and/or redistribute stresses within the membrane layer. A membrane having a first/active region and a second/inactive region is described.
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