Title:
MEMS MICROPHONE ENCAPSULATION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2016/176993
Kind Code:
A1
Abstract:
Provided is a MEMS microphone encapsulation structure, comprising a closed inner chamber formed by an encapsulation housing, and a MEMS chip (3) and ASIC chip (2) located in the closed inner chamber; sound holes (10) allowing sound to flow in are arranged on said encapsulation housing; the MEMS chip (3) comprises a base plate (33) and a diaphragm (30) and back electret (32) arranged on the base plate (33); the diaphragm (30) divides the closed inner chamber into a front chamber (5) and a back chamber (6); the back chamber (6) is internally provided with a sound-absorbing structure. Incident acoustic waves enter the front chamber (5) of the MEMS microphone via the sound holes on the encapsulation housing; the majority of direct acoustic waves reaching the diaphragm (30) are used for inducing the diaphragm to fluctuate, while a small portion of said acoustic waves pass through an air-guiding hole (31) on the diaphragm (30) and enter the back chamber (6), where they are absorbed by the sound-absorbing structure located in the back chamber (6); thus said acoustic waves do not reflect again, eliminating the effect on the diaphragm (30) of acoustic waves reflecting in the back chamber (6), and thereby improving the sensitivity and signal-to-noise ratio of the MEMS microphone.
Inventors:
ZHENG GUOGUANG (CN)
Application Number:
PCT/CN2015/096912
Publication Date:
November 10, 2016
Filing Date:
December 10, 2015
Export Citation:
Assignee:
GOERTEK INC (CN)
International Classes:
H04R1/04; H04R19/04
Domestic Patent References:
| WO2007007929A1 | 2007-01-18 |
Foreign References:
| CN104822118A | 2015-08-05 | |||
| CN204559882U | 2015-08-12 | |||
| CN202364373U | 2012-08-01 | |||
| US20130216068A1 | 2013-08-22 | |||
| US20070205499A1 | 2007-09-06 | |||
| CN203933949U | 2014-11-05 | |||
| CN1813490A | 2006-08-02 | |||
| CN101198235A | 2008-06-11 |
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