Title:
MEMS MICROPHONE
Document Type and Number:
WIPO Patent Application WO/2016/180262
Kind Code:
A1
Abstract:
An MEMS microphone comprises a substrate (100), a support portion (200), a superimposed layer (600), an upper plate (300) and a lower plate (400). The substrate (100) is provided with an opening (120) penetrating the middle thereof; the lower plate (400) is arranged above and spanning the substrate (100); the support portion (200) is fixed on the lower plate (400); the upper plate (300) is attached on the support portion (200); an accommodation cavity (500) is formed from the support portion (200), the upper plate (300) and the lower plate (400); the superimposed layer (600) is attached on an intermediate region of the upper plate (300) or the lower plate (400), and insulation is achieved between the upper plate (300) and a lower plate (400).
Inventors:
HU YONGGANG (CN)
Application Number:
PCT/CN2016/081062
Publication Date:
November 17, 2016
Filing Date:
May 05, 2016
Export Citation:
Assignee:
CSMC TECHNOLOGIES FAB1 CO LTD (CN)
International Classes:
H04R19/04
Foreign References:
CN101189910A | 2008-05-28 | |||
CN104105040A | 2014-10-15 | |||
CN103731783A | 2014-04-16 | |||
CN102415108A | 2012-04-11 | |||
US5146435A | 1992-09-08 |
Other References:
See also references of EP 3297294A4
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
广州华进联合专利商标代理有限公司 (CN)
广州华进联合专利商标代理有限公司 (CN)
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