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WO/2024/089972A1 |
The present invention addresses the problem of providing a silver plating film that has high electrical conductivity and wear resistance even in high-temperature environments, and an electric contact that comprises said silver plating fi...
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WO/2024/090570A1 |
The present invention provides an Ni-plated steel sheet which comprises a steel sheet and an Fe-Ni diffusion layer that is formed on at least one surface of the steel sheet, wherein: the average crystal grain size in the outermost surfac...
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WO/2024/082755A1 |
The present application relates to the technical field of alloy materials, and in particular, to a tin plate and a manufacturing method therefor. According to the provided manufacturing method for the tin plate, a component design of low...
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WO/2024/085554A1 |
Disclosed are a plating apparatus for manufacturing an integrated circuit (IC) chip, a plating method for manufacturing an IC chip, and an IC chip manufacturing method using same. The disclosed plating apparatus for manufacturing an IC c...
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WO/2024/081584A1 |
A copper electrolyte comprising a copper salt, a source of halide ions, and a reaction product of an amine or sulfur-containing compound with 2,3-epoxy-1-propanol for producing a nanotwinned copper deposit, optionally in combination with...
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WO/2024/081507A1 |
Examples are disclosed that relate to irrigating an ion exchange membrane in an electrodeposition system. In one example, the electrodeposition system comprises a fluid distribution system comprising a membrane assembly that comprises a ...
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WO/2024/075698A1 |
A composite material obtained by forming, on a material, a composite film comprising a silver layer containing carbon particles, wherein the crystallite size of the silver in the composite film is greater than 40nm and no greater than 70...
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WO/2024/070245A1 |
Provided is a surface-treated copper foil having a copper foil and a surface-treatment layer formed on at least one surface of the copper foil. The surface-treatment layer has a peak material volume Vmp of 0.010-0.080 µm3/µm2 and has a...
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WO/2024/070246A1 |
Provided is a surface-treated copper foil including a copper foil and a surface-treated layer formed on at least one surface of the copper foil. The average depth Svk in valley parts in the surface-treated layer is 0.35 to 0.63 μm.
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WO/2024/067514A1 |
The present application relates to the technical field of photovoltaics, and discloses a solar cell electroplating device and a solar cell electroplating method. A first conductive assembly and a second conductive assembly are respective...
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WO/2024/070247A1 |
Provided is a surface-treated copper foil that has a copper foil and a surface-treated layer which has been formed on at least one surface of the copper foil. The peak material volume Vmp of the surface-treated layer is 0.022-0.060 μm3/...
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WO/2024/068704A1 |
An apparatus for electrolytically coating metal wires arranged in a web also called a 'plating section' is presented. Compared to prior art plating sections, the apparatus is provided with one or more ultrasound emission boxes that hang ...
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WO/2024/072389A1 |
A method of preparing a non-conductive substrate to allow metal plating thereon and a two-part gel coating composition. The method includes the steps of a) contacting the non- conductive substrate with a conditioner comprising: a high mo...
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WO/2024/070248A1 |
Provided is a surface-treated copper foil comprising a copper foil and a surface-treated layer formed on at least one surface of the copper foil. The actual volume Vmc of a core portion of the surface-treated layer is 0.35 to 0.55 μｍ3...
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WO/2024/068552A1 |
Porous metal plate material and process for producing such a material. The material comprises a perforated metal base plate and an electrodeposited layer with pin-shaped protrusions on at least one side of the perforated base plate made ...
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WO/2024/062909A1 |
This terminal material comprises, in the following order, a base material which comprises copper or a copper alloy, one or more underlayers which are constituted by one or more element selected from the group consisting of Ni, Co, and Fe...
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WO/2024/051152A1 |
A flexible foil production system, relating to the technical field of water plating. The system comprises first liquid accumulation rollers, tension rollers, first electrical conduction rollers and second electrical conduction rollers, w...
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WO/2024/053668A1 |
This plated member has a plating film, which contains at least chromium, carbon and oxygen, while having chromium that is precipitated from a trivalent chromium bath as a main component, on the outer surface; the plating film contains 60...
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WO/2024/053640A1 |
A plated member, the outer surface of which has a plating film thereon which contains at least chromium, carbon and oxygen and has chromium which uses a trivalent chromium bath as a main component thereof, wherein: the plating film conta...
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WO/2024/046395A1 |
Embodiments of the present application provide a leveling agent, particularly a polypyridine compound. The polypyridine compound comprises a structural unit as shown in formula (I) or a protonation product of the structural unit as shown...
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WO/2024/046450A1 |
Provided in the present invention is a metal plating composition, comprising a leveling agent, wherein the leveling agent is the compound of formula (I), where R1 is selected from hydrogen, an alkyl and an aralkyl; R2 is selected from an...
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WO/2024/046447A1 |
The present invention provides a metal electroplating composition used for electrolytic copper coating, comprising a chip copper interconnect electroplating additive, the chip copper interconnect electroplating additive being selected fr...
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WO/2024/042700A1 |
To measure the state of a substrate serving as an object subject to plating. This substrate state measurement device comprises: a stage constituted so as to support a substrate having a seed layer and a resist layer formed on the seed ...
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WO/2024/041968A1 |
The invention relates to a method for controlling the chromium feed in an electrolysis process for producing a chromium layer by means of direct current and use of an anode (44, 144, 244) and a cathode (48, 148, 248), comprising, during ...
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WO/2024/042914A1 |
This conductive material has, in the following order: a base material composed of copper or a copper alloy; a base layer that is at least one layer made of at least one selected from the group consisting of Ni, Co, and Fe; a Cu-Sn alloy ...
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WO/2024/040888A1 |
The present application relates to the processing field of circuit boards. Disclosed are a method for plating edge connectors on a circuit board with gold, and a circuit board. The method comprises the following steps: filling gaps betwe...
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WO/2024/036411A1 |
Disclosed herein are methods for producing a radium or barium target. The methods include providing an organic-aqueous electrolyte bath solution comprising radium or barium ions, exposing a deposition surface of a target substrate to the...
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WO/2024/037008A1 |
Disclosed in the present invention are a cathode conductive device and electroplating equipment. The cathode conductive device comprises: a conductive section rack; an upper conductive tank assembly which comprises an upper conductive ta...
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WO/2024/033966A1 |
The present invention achieves a small pre-wet module that is capable of performing different pre-processes. This pre-wet module 200 includes: a stage 220 configured so as to hold a rear surface of a substrate WF having a surface WF-a ...
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WO/2024/027968A1 |
The invention relates to a process of manufacturing an electrocatalyst for alkaline water electrolysis, the method comprising the steps of: (i) producing an aqueous electrolyte comprising suspended graphene and graphite nanoplatelet stru...
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WO/2024/028973A1 |
A plating method for performing a plating process on a substrate by means of a plating apparatus provided with a substrate holder including a contact member that comes into contact with the substrate so as to enable electrical conduction...
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WO/2024/022979A1 |
The present invention provides an aqueous composition comprising tin ions, optionally alloy metal ions selected from silver, copper, indium, and bismuth ions and at least one additive of formula L1 (L1) wherein RL1 is, for each group RL1...
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WO/2024/022201A1 |
The present disclosure provides an electroplating apparatus, a multi-channel electroplating apparatus group, and an electroplating reaction system. The electroplating apparatus comprises: a cathode control member, a cathode chamber frame...
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WO/2024/022535A1 |
An electroplated part, which contains hardly any organic residues and has a uniform electroplated layer. An electroplating method for manufacturing the electroplated part is also provided. By means of controlling the ratio of the length ...
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WO/2024/018005A1 |
The invention concerns a treated copper foil for use in a secondary battery with a first side and a second side opposite to the first side. The treated copper foil comprises a copper foil with two opposite surfaces and a treatment stack ...
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WO/2024/014450A1 |
Provided is a sliding member having excellent peeling resistance against a plating layer even when sliding under high surface pressure exceeding 1.5 GPa in terms of hertzian surface pressure. A sliding member (1) comprises: a substrate (...
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WO/2024/009698A1 |
Provided is a contact material comprising silver-containing film, wherein: the silver-containing film includes a silver-containing layer which includes not less than 50 mass% silver and particles which comprise a plurality of non-conduct...
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WO/2024/007630A1 |
A water electroplating apparatus with a double-sided coating function. The water electroplating apparatus comprises a plating tank and a film conveying mechanism, wherein a first main roller and a second main roller are arranged in the p...
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WO/2024/003123A1 |
The disclosure relates to a polymeric article, comprising a thermoplastic polymer composition, wherein the thermoplastic polymer composition includes (i) a copolymer (A) comprising polymeric units derived from a vinyl aromatic monomer, a...
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WO/2024/003975A1 |
The present invention improves the in-plane uniformity of a plating film that is formed on a polygonal substrate. A plating apparatus according to the present invention is provided with: a plating bath; a substrate holder which is conf...
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WO/2023/246676A1 |
Disclosed in the present invention are a low-copper-salt weakly-alkaline electronic copper electroplating liquid and a use thereof. The low-copper-salt weakly-alkaline electronic copper electroplating liquid is composed of deionized wate...
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WO/2023/246731A1 |
A composite current collector, and a preparation method therefor and a use thereof, relating to the technical field of new materials. The composite current collector comprises a polymer substrate layer and a diamond-like carbon layer arr...
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WO/2023/244075A1 |
The present invention relates to a steel sheet that can be used for automobiles, etc., and relates to a steel sheet that can ensure improved plating characteristics, and a manufacturing method therefor.
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WO/2023/243394A1 |
Provided is a composition containing: (A) a compound represented by general formula (1); (B) a compound represented by general formula (2); and (C) a silver compound. (In the formula, R1 and R2 each independently represent a hydrogen ato...
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WO/2023/243170A1 |
Provided is a metal pipe for an oil well, the metal pipe comprising a Zn-Ni alloy plating layer having excellent seizure resistance. A metal pipe (1) for an oil well according to the present disclosure comprises a pipe body (10) includ...
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WO/2023/243078A1 |
Provided is a technique for determining the presence or absence of a plating liquid leak to a region where a contact member is disposed. The leakage determination method comprises: a discharge step 120 for discharging a washing liquid ...
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WO/2023/238572A1 |
The present invention relates to a plating apparatus and a plating method, by each of which at least one main surface of a rectangular substrate is plated. A plating apparatus according to the present invention is provided with: a proces...
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WO/2023/239209A1 |
The present invention relates to: a hot-dip plated steel sheet having excellent plating quality; a steel sheet for plating, for manufacturing same; and respective methods for manufacturing same. A steel sheet for hot press forming, accor...
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WO/2023/239211A1 |
The present invention relates to a hot-dip galvanized steel sheet having excellent plating quality, a steel sheet for plating for producing same, and a method for manufacturing same. A steel sheet for plating according to one aspect of t...
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WO/2023/239208A1 |
The present invention relates to a high-strength hot-dip galvanized steel sheet having excellent plating quality, a steel sheet for plating to manufacture same, and methods for manufacturing same. The steel sheet for plating, according t...
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