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WO/2023/033038A1 |
A terminal material that has a plating film and that can be used as a terminal for electrical connection or as a contact element for a connector, the terminal material comprising: a base material made of copper or a copper alloy; and a p...
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WO/2023/030764A1 |
The invention relates to a method for joining a first component (1) with a second component (2) in order to form an assembly (12) of a process automation field device, having the steps of: - placing a first joint zone (4) of the first co...
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WO/2023/033615A1 |
An embodiment of the present invention provides a frame nanoparticle having a porous structure, the frame nanoparticle being characterized by comprising: an overall ring frame including a platinum-containing nanoring inner fame and a gol...
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WO/2023/028983A1 |
The present application provides a metal foil, the metal foil comprising a first metal layer and a metal base layer, which are stacked. The roughness Rz of the surface of the metal base layer facing the first metal layer is α1 μm, and ...
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WO/2023/032191A1 |
One purpose of the present invention is to reduce the time during which a substrate holder is lifted while also reducing the amount of excess plating solution which is taken from a plating tank. A method for plating a substrate, said m...
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WO/2023/033118A1 |
Provided is a surface-treated metal sheet for a battery. This surface-treated metal sheet for a battery is characterized in that the base material of the surface-treated metal sheet for a battery is an iron-based or nickel-based metal sh...
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WO/2023/028015A1 |
Exemplary methods of electroplating include contacting a patterned substrate with a plating bath in an electroplating chamber, where the pattern substrate includes at least one opening having a bottom surface and one or more sidewall sur...
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WO/2023/028090A1 |
Exemplary methods of electroplating may include providing a patterned substrate having at least one opening, where the opening includes one or more sidewalls and a bottom surface. The methods may also include plating a first portion of r...
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WO/2023/016607A1 |
The invention relates to an electrode (10), a rechargeable battery (100) and corresponding manufacturing processes. According to the invention, a silicon substrate (2) having a length (1) of 156 mm or more is provided, and a porous silic...
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WO/2023/013054A1 |
A production method for a fastener chain (1) or fastener stringers (2a, 2b) comprising: a step for applying a voltage between at least one anode (20) and at least one cathode (10) at least partially immersed in an electrolyte solution in...
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WO/2023/001868A1 |
The present invention relates to a silver electrolyte and to a corresponding method for galvanic deposition of silver on conductive substrates. The silver electrolyte is characterized by specific additives which help to prevent a foaming...
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WO/2023/000904A1 |
The present application relates to the technical field of surface treatments, and in particular to an electroplating device. The electroplating device is used to deliver a substrate in a length direction of the substrate, and forms a pla...
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WO/2023/286697A1 |
The present invention provides: a lead frame material which exhibits excellent adhesion to a resin even in the cases where the lead frame material is used in a high-temperature high-humidity environment for a long period of time, and whi...
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WO/2023/286604A1 |
According to the present invention, a control unit outputs control signals so as to control a plating-solution supply unit and an energizing unit and thus perform a first electrolytic plating treatment by electrifying a treatment surface...
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WO/2023/286692A1 |
According to the present invention, a protective film (50) is formed so as to cover a part of a surface electrode (40) and to extend beyond the surface electrode toward the outer edge of a semiconductor substrate (10); and the protective...
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WO/2023/281759A1 |
This surface-treated copper foil has a copper foil and a surface-treated layer formed on at least one surface of the copper foil. The surface-treated layer has an Sku of 2.50-4.50 and an Str of 0.20-0.40.
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WO/2023/281778A1 |
This surface-treated copper foil comprises a copper foil and a surface-treatment layer formed on at least one surface of the copper foil. The amount of change in Sk given by formula (1) for the surface-treatment layer is 0.180-0.600 µm....
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WO/2023/281777A1 |
Provided is a surface-treated copper foil including a copper foil and a surface-treated layer formed on at least one surface of the copper foil. The surface-treated layer has an Sk rate of change, represented by formula (1) below, of 23....
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WO/2023/281776A1 |
A surface-treated copper foil that has a copper foil and a surface-treatment layer formed on at least one surface of the copper foil. The amount of Vmp change, represented by formula (1), in the surface-treatment layer is 0.0010–0.0110...
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WO/2023/281775A1 |
This surface-treated copper foil has a copper foil and a surface-treated layer formed on at least one surface of the copper foil. The surface-treated layer has an Spk change amount represented by formula (1) below of 0.02 to 0.24 µm. ...
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WO/2023/281774A1 |
The present invention provides a surface-treated copper foil which comprises a copper foil and a surface treatment layer that is formed on at least one surface of the copper foil. The surface treatment layer has a change ratio of Vmc of ...
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WO/2023/281773A1 |
The present invention provides a surface-treated copper foil which comprises a copper foil and a surface treatment layer that is formed on at least one surface of the copper foil. The surface treatment layer has an Sku of 2.50 to 4.50 an...
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WO/2023/276507A1 |
Provided are a silver-plated material having improved wear resistance compared to the past while maintaining a high hardness, and a method for manufacturing the silver-plated material. The present invention is a method for performing ele...
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WO/2023/272492A1 |
A vapor chamber having high heat absorption properties, comprising a substrate layer. The vapor chamber further comprises a protective layer; the protective layer is adhered and solidified on the outer surface of the substrate layer, is ...
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WO/2023/276324A1 |
A composite material, wherein an oxygen-containing silver-based coating layer comprising silver is formed on a blank formed from copper or copper alloy, and oxygen is present in the proximity of the surface said layer.
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WO/2023/275215A1 |
The invention is directed to the use of electrolytic bronze deposits as substitutes for the noble metal electroplating of electronic circuits, e.g. for use in electronic payment cards and identity cards. The invention also relates to a n...
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WO/2022/271568A1 |
Metal may be electroplated on a semiconductor substrate in an electroplating chamber with a micro inert anode array positioned proximate to the semiconductor substrate having one or more die. The micro inert anode array includes a plural...
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WO/2022/271390A1 |
A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and blind micro-vias with copper. The method includes the steps of: (1) preparing an electronic substrate to. re...
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WO/2022/271443A1 |
Assemblies and optical connectors including one or more optical fibers laser-bonded to a substrate, as well as methods for fabricating the same, are disclosed. In one embodiment, an assembly includes a substrate having a surface, an opti...
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WO/2022/259927A1 |
An electroplated wire (1) for a saw wire comprises a core wire (10) formed from tungsten or a tungsten alloy. The tensile strength of the electroplated wire (1) for a saw wire is 4800 MPa or greater. The straightness per 500 mm length of...
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WO/2022/257559A1 |
A full star grille structure and a processing method therefor, applied to a front part of an automobile, and comprising: receiving design information concerning a full star grille, and electroplating surfaces of a first number of square ...
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WO/2022/255420A1 |
Provided is a roughened copper foil simultaneously achieving excellent transmission characteristics and high peel strength when used in a copper-clad laminated board or a printed wiring board. This roughened copper foil has a roughened s...
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WO/2022/253114A1 |
The present invention belongs to the technical field of signal transmission, and particularly relates to a method for preparing a bright high-conductivity graphene/copper composite material. In view of the technical problem of bright hig...
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WO/2022/254486A1 |
The present invention improves the efficiency of a cleaning process and a degassing process for a treated surface of a substrate. This pre-wetting module 200 comprises: a stage 220 configured to hold a rear surface of a substrate WF wh...
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WO/2022/255421A1 |
Provided is a roughened copper foil having excellent transmission characteristics and circuit linearity and capable of achieving high peel strength when used in a copper clad laminate or a printed wiring board. This roughened copper foil...
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WO/2022/255422A1 |
Provided is a roughened copper foil which, when used in a copper-clad laminate board or a printed circuit board, is capable of attaining both excellent transmission properties and high peel strength. This roughened copper foil has a roug...
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WO/2022/255335A1 |
Provided is a surface-treated copper foil having excellent humidity resistance and discoloration resistance. The surface-treated copper foil includes a copper foil substrate (1) and a silane coupling agent layer (3) that is provided to a...
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WO/2021/221887A9 |
A contact for providing a connection to a substrate in a substrate plating system includes a body having an arcuate shape. The arcuate shape of the body is configured to conform to a shape of at least a portion of a substrate arranged on...
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WO/2022/244828A1 |
Provided is a roughened copper foil capable of achieving both excellent transmission characteristics and a high shear strength in the processing of a copper-clad laminate or in the production of a printed wiring board. This roughened cop...
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WO/2022/244827A1 |
Provided is a roughened copper foil capable of achieving both excellent transmission characteristics and high shear strength in processing of a copper-clad laminate or manufacturing of a printed wiring board. This roughened copper foil h...
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WO/2022/244826A1 |
Provided is a roughened copper foil capable of realizing both excellent transmission properties and high shear strength, in the processing of a copper-clad laminate or the production of a printed wiring board. This roughened copper foil ...
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WO/2022/243462A1 |
The present invention relates to an electrolyte composition for depositing graphene–doped copper onto semiconductor substrates. This electrolyte has a pH ranging from 7.0 to 11.0 and comprises copper ions at a concentration ranging fro...
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WO/2022/241088A1 |
Hysteretic current-voltage mediated void-free superconformal and bottom-up filling of recessed features includes providing an electrodeposition composition with a hysteretic cyclic voltammogram; providing the substrate controlling applie...
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WO/2022/235219A1 |
A round wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself is a silver-based wire core, wherein the coating layer is a double-layer comprised of a 1 ...
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WO/2022/231922A1 |
An atmospheric plasma treatment station is integrated in a semiconductor process tool. The atmospheric plasma treatment station directly interfaces with a deposition chamber of the semiconductor process tool without adding to the footpri...
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WO/2022/231143A1 |
The present specification relates to an apparatus for manufacturing a metal thin film, the apparatus comprising: a titanium rotating plate in which titanium plates are connected in one direction; a plurality of electrolytic cells corresp...
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WO/2022/231009A1 |
[Problem] To provide a surface treated steel foil which is for a current collector and which has hydrogen barrier properties suitable for a battery using a hydrogen occluding alloy. [Solution] This surface treated steel foil is for a cur...
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WO/2022/231008A1 |
[Problem] To provide a surface-treated steel foil for current collectors, the surface-treated steel foil having suitable hydrogen barrier properties. [Solution] A surface-treated steel foil for current collectors, the surface-treated ste...
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WO/2022/231007A1 |
[Problem] To provide a surface-treated steel foil endowed with hydrogen barrier properties suitable for a bipolar battery. [Solution] A surface-treated steel foil having a first surface and a second surface positioned on the opposite sid...
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WO/2022/224683A1 |
The purpose of the present invention is to provide a novel system for producing a composite copper member. The present invention provides a system having a first device for partially coating the surface of a copper member with a silane c...
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