Title:
SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE PLATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/255335
Kind Code:
A1
Abstract:
Provided is a surface-treated copper foil having excellent humidity resistance and discoloration resistance. The surface-treated copper foil includes a copper foil substrate (1) and a silane coupling agent layer (3) that is provided to at least one surface of the copper foil substrate (1) and formed from a silane coupling agent. The ratio MB/MA of the amount MA of silicon atoms included in the silane coupling agent layer (3) and the amount MB of silicon atoms included in the silane coupling agent layer (3) after washing with pure water for 30 seconds is 0.700-1.000. The amounts MA and MB of silicon atoms are measured by analyzing the surface of the silane coupling agent layer (3) by fluorescent X-ray analysis.
Inventors:
SHINOZAKI JUN (JP)
NAKATSUGAWA TATSUYA (JP)
SANO JUNRO (JP)
KATAHIRA SHUSUKE (JP)
NAKATSUGAWA TATSUYA (JP)
SANO JUNRO (JP)
KATAHIRA SHUSUKE (JP)
Application Number:
PCT/JP2022/022052
Publication Date:
December 08, 2022
Filing Date:
May 31, 2022
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C25D7/06; C23C26/00; C23C28/00; C25D5/10; C25D5/16; H05K3/38
Domestic Patent References:
| WO2007040196A1 | 2007-04-12 |
Foreign References:
| CN111519216B | 2021-05-18 | |||
| JP2020122190A | 2020-08-13 | |||
| JPH0851281A | 1996-02-20 | |||
| JP2018121085A | 2018-08-02 |
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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