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WO/2022/129230A1 |
The invention relates to a method for joining nanolaminates by means of electrodeposition, the nanolaminate being constructed of at least two layers containing different metals or metal alloys and having a joining point in which multiple...
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WO/2022/130897A1 |
Provided are: a method that is for forming a metal body and that is capable of quickly forming a metal body in which the occurrence of whiskers due to external stress is inhibited; a metal body; and a mating-connection terminal comprisin...
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WO/2022/123681A1 |
The present invention achieves a substrate holder with high substrate holding reliability. According to the present invention, a plating module includes a plating tank for containing a plating solution, a substrate holder 440 for holdi...
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WO/2022/124825A1 |
The present invention relates to a high-strength hot-dip galvanized steel sheet having excellent plating quality, a steel sheet for plating for manufacturing same, and methods for manufacturing the steel sheets. The steel sheet for plati...
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WO/2022/123648A1 |
Provided is technology that is capable of suppressing a degradation in wafer plating quality due to process gas retained on the bottom surface of a diaphragm. A plating apparatus 1000 comprises: a plating bath 10 in which an anode 11 i...
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WO/2022/125831A1 |
A method and an electrocatalytic electrode for electrochemically reducing carbon dioxide to methanol are provided. An exemplary electrocatalytic electrode includes copper (I) oxide crystals electrodeposited over an atomically smooth copp...
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WO/2022/118431A1 |
Provided is a plating apparatus that is capable of shielding specified portions of a wafer at a prescribed timing. The plating apparatus comprises: a plating bath 410 for accommodating a plating solution; an anode 430 disposed in the p...
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WO/2022/116509A1 |
Disclosed are a device and method for preventing a conductive roller from being plated with copper, belonging to the technical field of the manufacturing of electroplated copper films. The conductive roller and an electroplating anode ar...
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WO/2022/116454A1 |
Provided in the present application is a method for reducing the discharge of a gantry line tank liquid in circuit board electroplating, comprising the steps: placing a circuit board into a medicine liquid tank to perform an immersion el...
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WO/2022/113806A1 |
The present invention provides a roughened copper foil which has excellent adhesion to a resin, and is capable of producing a printed wiring board that has little transmission loss, while being not susceptible to the occurrence of a shor...
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WO/2022/110845A1 |
Embodiments of the present application provide an electroplating method and an electroplating device. The electroplating method comprises: before a wafer is placed in an electroplating solution to perform an electroplating process on sam...
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WO/2022/111210A1 |
The present invention discloses a plating apparatus. The plating apparatus comprises a multiple electrodes. The multiple electrodes include a main electrode and at least two second electrodes. The main electrode and the at least two seco...
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WO/2022/107551A1 |
Provided in a jet-type plating device is a plating process that sufficiently achieves the benefits of an insoluble anode. The present invention is a plating device comprising a plating tank that has an opening, a liquid feed tube, an ins...
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WO/2022/108841A1 |
Exemplary methods of electroplating may include forming a first mask layer on a semiconductor substrate. The methods may include forming a seed layer overlying the first mask layer. The methods may include forming a second mask layer ove...
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WO/2022/102119A1 |
The present invention improves, in each part of a plate, the accuracy of porosity and/or the degree of freedom in adjusting porosity. This plate is disposed between a substrate and an anode in a plating tank, the plate comprising a hol...
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WO/2022/101474A1 |
The present invention refers to a method for preparing an electroplated product by depositing an underlayer, a barrier diffusion layer and a top layer on a surface of a substrate comprising or consisting of copper or a copper or copper a...
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WO/2022/096800A1 |
The main conductive member (38) disclosed is intended to be incorporated in an electric machine and comprises a first active portion (32), intended to be received in an internal space delimited by a yoke of the electric machine, and a pa...
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WO/2022/089232A1 |
Disclosed are manufacturing equipment and a manufacturing method for lead frame surface roughness. The manufacturing equipment for lead frame surface roughness comprises: a material dispensing apparatus, a cleaning apparatus, a copper el...
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WO/2022/082933A1 |
A production method for an ultrathin high-strength electronic copper foil, comprising the following steps: preparing an electrolyte, adding a mixed additive, manufacturing an isolation layer by using a copper foil having the thickness of...
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WO/2022/086891A1 |
Exemplary methods of electroplating may include delivering a current from a power supply through a plating bath of an electroplating chamber for a first period of time. The current delivered may be or include a pulsed current at a duty c...
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WO/2022/080735A1 |
The present disclosure relates to a metal air filter including: a filter which is formed of a metallic material by electrodeposition and has a nano branch structure; an ionizer which conducts particles to be captured by the filter with n...
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WO/2022/080191A1 |
This tin or tin alloy plating solution at least contains (A) a first tin compound, (B) an acid or salt thereof selected from an organic acid and an inorganic acid, and (C) a surfactant. The plating solution contains polypropylene glycol ...
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WO/2022/081080A1 |
A wire comprising a silver-based wire core having a double-layer coating comprised of a 1 to 100 nm thick inner layer of palladium or nickel and an adjacent 1 to 250 nm thick outer layer of gold, wherein the wire exhibits at least one of...
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WO/2022/074221A1 |
The invention relates to a process for fabricating a 3D–NAND flash memory comprising a first step of electrodepositing an alloy of copper and of a dopant metal selected from manganese and zinc followed by a second step of annealing the...
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WO/2022/072390A1 |
A chamber in a substrate processing system comprises a substrate holder configured to support a substrate, a nozzle arranged above the substrate, the nozzle configured to inject a pre-wetting liquid onto a surface of the substrate during...
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WO/2022/069829A1 |
An aspect of the invention relates to a method for manufacturing a conductor of a winding of a coil, comprising: a step (E1, E1') of manufacturing a heat-sink preform comprising a phase-change material, a step (E2, E2', E2") of depositin...
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WO/2022/061948A1 |
The present invention relates to an insoluble anode methyl sulfonic acid coating low-lead content tin plate production method. The method comprises the following steps: step 1: an alkaline washing process section, first performing electr...
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WO/2022/057335A1 |
Provided are a device and a method for air leakage detection and a wafer electroplating method. Before performing a wafer electroplating process, an airtightness state of a reaction chamber in a wafer electroplating equipment is pre-test...
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WO/2022/057703A1 |
A diamond drill bit production electroplating device, comprising a bottom plate, an outer barrel being provided on the bottom plate, and an electroplating barrel being provided within the outer barrel; a circular first rotary disc which ...
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WO/2022/054953A1 |
The present invention provides: a plated material which has low insertion force (low friction) and durability at high temperatures; and an electronic component. A plated material which is provided with: a base plating layer that is compo...
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WO/2022/054873A1 |
The present invention discloses a method for producing a wiring board, said method comprising: a step wherein the surface of a metal layer that is exposed in an opening is pretreated by being brought into contact with a pretreatment liqu...
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WO/2022/050001A1 |
The purpose of the present invention is to provide a copper foil, with which a wiring board capable of exhibiting both RF characteristics and a high peeling strength can be fabricated using a resin base material made of LCP. The copper f...
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WO/2022/041533A1 |
Disclosed in the present invention is a production method for a high heat-resistant electrodeposited copper foil, comprising the following steps: raw foil manufacturing, pickling and water washing, primary coarsening and water washing, s...
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WO/2022/044451A1 |
Provided is a shock absorber, and a manufacturing method thereof, in which trivalent chromium is used and in which both a high degree of hardness and low friction are achieved at a high level without utilizing hexavalent chromium that ca...
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WO/2022/039060A1 |
Provided is a plating device for producing a highly precise plating layer. This plating device (10) is provided with a plating vessel (9), cathodes (1a to 1f), a holding mechanism (2), an anode (3), and a rotation mechanism (4). In the p...
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WO/2022/033990A1 |
The invention comprises a process for the galvanic nickel plating of a fin wall (FW), which has at least one wall part (FW') which is formed from a number of tubes R1, R2, …, R5) running alongside one another in a longitudinal directio...
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WO/2022/030644A1 |
[Problem] To provide: a copper-clad layered body which, when applied to a flexible circuit board, is capable of suppressing transmission loss and achieving good volume resistivity and high adhesion between a low-dielectric resin film and...
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WO/2022/028072A1 |
Provided is a housing structure, a preparation method therefor, and an electronic device. The housing structure comprises an appearance effect layer, a metal layer, a connecting layer and a non-metal layer, which are arranged in a lamina...
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WO/2022/032048A1 |
A process for producing a cube textured foil is described. The process includes providing a cube textured metal foil M. The process further includes electroplating an epitaxial layer of an alloy on the foil M, whereby the epitaxial layer...
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WO/2022/030645A1 |
[Problem] To provide a copper-clad laminate capable of simultaneously achieving good volume resistivity in an electroless copper plating layer of a low dielectric resin film and suppression of transmission loss when applied to a flexible...
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WO/2022/018896A1 |
This terminal material for connectors comprises: a substrate having at least a surface made of copper or a copper alloy; and a silver-nickel-potassium alloy plating layer formed on at least a portion of the substrate, wherein the silver-...
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WO/2022/019059A1 |
[Problem] To provide a sliding member comprising an overlay capable of realizing good fatigue resistance while preventing peeling between layers. [Solution] A sliding member comprising an overlay formed by a Bi-Sb alloy plating film, whe...
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WO/2021/245766A9 |
The present invention provides technology for improving the filling properties of micropores in intermittent electroplating. This intermittent electroplating method is for performing intermittent electroplating of a plated object havin...
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WO/2022/014647A1 |
Provided is a manufacturing method for a copper-clad laminate in which a copper foil and a resin are bonded with high heat-resistant adhesive strength while using a fluororesin, which is a thermoplastic resin having a low dielectric cons...
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WO/2022/012932A1 |
The present invention provides an acidic aqueous composition for copper electroplating comprising (a) copper ions; (b) bromide ions; and (c) at least one additive of formula (S1) wherein XS1 is selected from a linear, branched or cyclic ...
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WO/2022/012993A1 |
The present invention relates to an electrolyte and its use in a process for fabricating copper interconnects. The electrolyte of pH greater than 6.0 comprises copper ions, manganese or zinc ions, and ethylenediamine which complexes the ...
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WO/2022/014316A1 |
A plating electrode (100) comprises a nozzle (1) and a retaining part (2). The nozzle (1) includes a tip section (1e). The nozzle (1) is for supplying a plating solution (PS) through the tip section (1e). The retaining part (2) covers th...
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WO/2022/014648A1 |
Provided is a copper-clad laminate plate for which a copper foil and a resin are joined together with high heat-resistant adhesion strength while using a fluororesin which is a thermoplastic resin having a low dielectric constant. This c...
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WO/2022/009675A1 |
A flexible printed wiring board according to an aspect of the present disclosure comprises a base film and a plurality of wires that are disposed on the surface of the base film, wherein each of the wires has an end surface along the lon...
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WO/2022/007505A1 |
Disclosed in the present invention is a cleaning method used for replacing phosphating for thermal diffusion electroplated wire, where a phosphorus-free cleaning solution is used to clean a steel wire, the phosphorus-free cleaning soluti...
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