Title:
ROUGHENED COPPER FOIL, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/113806
Kind Code:
A1
Abstract:
The present invention provides a roughened copper foil which has excellent adhesion to a resin, and is capable of producing a printed wiring board that has little transmission loss, while being not susceptible to the occurrence of a short circuit due to migration, and the like. This roughened copper foil has a roughened surface, which is provided with a plurality of roughening particles (1), in at least one surface; and the surfaces of the roughening particles (1) are provided with recesses and projections. The expanded area ratio Sdr of the interface of the roughened surface is from 1,000% to 5,000% and the arithmetic mean roughness Sa of the roughened surface is from 0.04 μm to 0.6 μm as determined with use of a three-dimensional white light interferometric microscope.
Inventors:
KATAHIRA SHUSUKE (JP)
SHINOZAKI JUN (JP)
KASAHARA MASAYASU (JP)
SANO JUNRO (JP)
TAKAZAWA RYOJI (JP)
NAKASAKI RYUSUKE (JP)
SHINOZAKI JUN (JP)
KASAHARA MASAYASU (JP)
SANO JUNRO (JP)
TAKAZAWA RYOJI (JP)
NAKASAKI RYUSUKE (JP)
Application Number:
PCT/JP2021/041954
Publication Date:
June 02, 2022
Filing Date:
November 15, 2021
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C25D5/16; C25D5/48; C25D7/06; H05K1/09
Domestic Patent References:
| WO2019188712A1 | 2019-10-03 | |||
| WO2018211951A1 | 2018-11-22 | |||
| WO2020031721A1 | 2020-02-13 |
Foreign References:
| JP2018141229A | 2018-09-13 | |||
| JP2017208461A | 2017-11-24 |
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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