Title:
PLATING APPARATUS AND PLATING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/118431
Kind Code:
A1
Abstract:
Provided is a plating apparatus that is capable of shielding specified portions of a wafer at a prescribed timing. The plating apparatus comprises: a plating bath 410 for accommodating a plating solution; an anode 430 disposed in the plating bath 410; a wafer holder 440 for holding a wafer Wf in a state in which a surface to be plated is oriented downwards; a rotation mechanism 447 for rotating the wafer holder 440; and a shielding mechanism 460 that moves a shielding member 482 between the anode 430 and the wafer Wf according to the rotational angle of the wafer holder 440.
Inventors:
CHANG SHAO HUA (JP)
SEKI MASAYA (JP)
SEKI MASAYA (JP)
Application Number:
PCT/JP2020/045051
Publication Date:
June 09, 2022
Filing Date:
December 03, 2020
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
C25D17/06; C25D7/12
Foreign References:
| US6027631A | 2000-02-22 | |||
| JP2016211010A | 2016-12-15 | |||
| JPH05295589A | 1993-11-09 | |||
| JP2005089812A | 2005-04-07 | |||
| JP2020533792A | 2020-11-19 | |||
| JP2018119219A | 2018-08-02 | |||
| JP2019525000A | 2019-09-05 |
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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