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WO/2019/176586A1 |
Provided is a current collecting member for a cylinder body plating apparatus, which is used at the base end of the spindle of a chuck cone, thereby making it possible to plate a sliding surface without oiling and to prevent efficiently ...
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WO/2019/175270A1 |
The present invention relates to electroplated products having a combination of layers used to provide a diffusion barrier layer under a precious metal top layer on a substrate comprising a copper based material and/or a copper based und...
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WO/2019/177281A1 |
The present invention relates to an electroplated bead wire having excellent oxidation resistance, of which the oxidation resistance and the aging adhesive strength with tire rubber are enhanced by formation of a copper- and cobalt-plate...
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WO/2019/173282A1 |
A floating metallized element assembly and method of manufacturing thereof are disclosed. The floating metallized element assembly includes a work piece of a plateable resin and a non-plateable resin including a front side and a back sid...
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WO/2019/164445A1 |
Method of manufacturing a spectrally selective surface. The method 200 comprises cleaning 202 an outside of a tubular substrate, e.g. by sonicating in acetone, polishing 204 the cleaned outside, and depositing 210 a Co-Cr coating on the ...
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WO/2019/163256A1 |
A porous metal body which has a three-dimensional network structure, and which is provided with a skeleton that forms the three-dimensional network structure and a cover layer that has fine pores and covers the skeleton. The three-dimens...
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WO/2019/164920A1 |
Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. An inert anode (or an auxiliary electrode that can act as inert anode when needed)...
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WO/2019/159531A1 |
Provided is a tire having: a steel cord having a plated film; and a rubber covering said steel cord, wherein the plated film contains Cu and Zn, an adhesive layer containing Cu2S and CuS is provided on a side closer to the rubber than th...
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WO/2019/159794A1 |
[Problem] To provide: a surface-treated steel sheet for battery containers, which exhibits excellent processability, while maintaining the battery characteristics and liquid leakage resistance. [Solution] A surface-treated steel sheet fo...
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WO/2019/156007A1 |
Provided is a plating film that can exhibit a high gloss and a low contact resistance value. The plating film according to the present invention is a plating film that contains a noble metal matrix and nanodiamond particles dispersed in ...
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WO/2019/152555A1 |
Systems for cleaning electroplating system components may include a seal cleaning assembly incorporated with an electroplating system. The seal cleaning assembly may include an arm pivotable between a first position and a second position...
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WO/2019/151421A1 |
Provided is a plated layered body for an electromagnetic wave shield, the plated layered body comprising a cobalt plating layer and a nickel plated layer that is formed over the cobalt plating layer, and being configured such that: the r...
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WO/2019/151487A1 |
The present invention relates to a surface treatment device and a surface treatment method. Electrodes (30) of a surface treatment device (10) comprise a first electrode (36) and a second electrode (38). The first electrode (36) is inser...
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WO/2019/148107A1 |
Electroplating systems according to the present technology may include a two-bath electroplating chamber including a separator configured to provide fluid separation between a first bath configured to maintain a catholyte during operatio...
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WO/2019/138818A1 |
The electroplating device according to one embodiment of the present invention has: a mounting part 21 which, when mounted to a box-like object 13, forms a sealed space 22 together with the box-like object 13; a plating solution containe...
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WO/2019/137724A1 |
The present invention relates to ureylene additives, a method for their preparation, a use of said ureylene additives favorably as additive in metal or metal alloy deposition composition, preferably in a copper or copper alloy deposition...
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WO/2019/131092A1 |
Provided is a copper foil for heat dissipation having superior heat dissipation properties. The copper foil for heat dissipation has a copper foil base material and a plated layer on at least any one main surface of the copper foil base ...
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WO/2019/131093A1 |
Provided is a copper foil for heat dissipation, which has excellent heat dissipation characteristics. A copper foil for heat dissipation, which comprises a copper foil base material and a polymer film that is arranged on at least one mai...
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WO/2019/132288A1 |
Provided are an ultra-high strength high manganese zinc plated steel plate having excellent spot weldability and a method for manufacturing same. The present invention relates to an ultra-high strength high manganese zinc plated steel pl...
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WO/2019/133305A1 |
In one example, an electroplating system comprising a bath reservoir having a first inlet for feeding fresh electrolyte solution into the bath reservoir and a first outlet for bleeding used electrolyte solution out of the bath reservoir,...
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WO/2019/122026A1 |
The invention discloses a coating (1) for a component (2), in particular an electrical component, wherein the coating comprises tin (10), characterized in that the coating comprises aluminium (11) and/or magnesium (12). Further, the inve...
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WO/2019/121582A1 |
This invention relates to a method for electroplating uncoated blackplate with a plating layer and an improvement thereof. The invention also relates to a method wherein the coated blackplate is further coated on one or both sides by a f...
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WO/2019/121092A1 |
An aqueous composition comprising tin ions and at least one compound of formula (I) wherein X1, X2 are independently selected from a linear or branched C1-C12 alkanediyl, which may optionally be interrupted by O or S, R11 is a monovalent...
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WO/2019/116633A1 |
This method for producing a porous metallic body comprises: a step for obtaining an electroconductive porous resin body having an electroconductive layer by making conductive the surface of a skeleton of a sheet-shaped porous resin body,...
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WO/2019/114011A1 |
A process for preparing an ionic polymer/metal dendritic interface. In the process, an ionic polymer is used as a matrix membrane material, a metal complex is used as a main salt, and an ionic polymer metal composite having a dendritic i...
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WO/2019/116632A1 |
This method for producing a porous metallic body comprises: a step for obtaining an electroconductive porous resin body having an electroconductive layer by making conductive the surface of a skeleton of a sheet-shaped porous resin body,...
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WO/2019/116631A1 |
This method for producing a porous metallic body comprises: a step for obtaining an electroconductive porous resin body having an electroconductive layer by making conductive the surface of a skeleton of a sheet-shaped porous resin body,...
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WO/2019/111914A1 |
This surface-treated copper foil has, on at least one surface of a copper foil substrate, a surface treatment coating film that comprises a roughening layer which is provided with roughening particles. If a cross-section of this surface-...
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WO/2019/111556A1 |
This electricity storage device (1, 1A, 1B, 1C) is provided with a laminate (2) of a bipolar electrode (3), which comprises a steel sheet (S) and a plating layer (30) that is provided on the surface of the steel sheet (S). The plating la...
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WO/2019/106284A1 |
The invention relates to an electric circuit, for example of the printed circuit type, for the production of a module intended to be integrated into a card such as a chip card. The module comprises electric contact pads - or connectors (...
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WO/2019/097044A1 |
A cobalt electrodeposition composition comprising cobalt ions, and particular leveling agents comprising X1-CO-O-R11, X1-SO2-O-R11, X1-PO(OR11)2, X1-SO-O-R11 functional groups, wherein X1 is a divalent group selected from (i) a chemical ...
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WO/2019/093494A1 |
[Problem] The purpose of the present invention is to provide a novel composite copper foil. [Solution] A composite copper foil in which a metal layer comprising a metal layer other than copper is formed on at least part of the surface of...
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WO/2019/089282A1 |
Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating s...
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WO/2019/087926A1 |
The anticorrosive terminal material has a base material made of copper or a copper alloy and a coating film laminated on the base material. The coating film has: a first coating film which is formed by laminating a zinc layer comprising ...
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WO/2019/082884A1 |
A tin or tin alloy plating solution containing (A) a soluble salt including at least a first tin salt, (B) an acid selected from an organic acid and an inorganic acid or a salt thereof, (C) a phenyl-type surfactant comprising a polyoxyet...
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WO/2019/079990A1 |
Disclosed are a metal wire, a manufacturing method therefor, and a tire. The metal wire is manufactured by twisting monofilaments; an outer peripheral surface of each monofilament is covered with a Cu-M-Zn alloy coating; the outer periph...
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WO/2019/082885A1 |
This tin or tin-alloy plating liquid contains (A) a soluble salt including at least a first tin salt, (B) an acid selected from organic acids and inorganic acids or a salt thereof, (C) a system surfactant, and (D) a leveling agent. In ad...
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WO/2019/075898A1 |
A three-step pre-wetting method in through-silicon-via electroplating, comprising: immersing and soaking a through-silicon-via wafer of a seed copper layer in a wetting liquid, to obtain a preliminarily wetted wafer when the through-sili...
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WO/2019/078229A1 |
The present invention addresses the problem of providing a method capable of plating various kinds of objects to be plated at predetermined positions without any pretreatment. The problem can be solved by a method for plating an object t...
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WO/2019/079193A1 |
Various embodiments herein relate to methods and apparatus for electroplating material onto substrates. Often the substrate is a semiconductor substrate. Various techniques described herein utilize a number of different electroplating st...
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WO/2019/078712A1 |
The invention relates to a method for applying a layer on a substrate surface, comprising applying the layer on a plating part of the substrate surface by plating to which end the plating part is brought into contact with an electrolyte....
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WO/2019/077918A1 |
Provided is a gravure printing seamless sleeve (10) with which it is possible to perform seamless continuous printing and to replace a plate in a short period of time, and which is easily processed. The gravure printing seamless sleeve (...
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WO/2019/074102A1 |
A zinc-based electroplated steel sheet wherein a zinc-based electroplated layer comprises a rough part (A) and a smooth part (B). The rough part (A) includes a region having an average surface roughness RaA greater than 200 nm and at mos...
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WO/2019/067841A1 |
The present disclosure relates to a reflective layer manufacturing apparatus which forms a reflective layer on a reflective surface of an insulation mold, and a reflector manufacturing method using the same. The present disclosure provid...
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WO/2019/058860A1 |
Provided are a surface-treatment device and a surface-treatment method capable of improving surface-treatment quality when an object undergoes surface-treatment. The surface-treatment device is used to treat the surface of an object at l...
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WO/2019/059423A1 |
The present invention relates to a method for producing a porous nanostructure and, in more detail, comprises: a preparation step for preparing an electrically conductive substrate; a foam forming step wherein an electrochemical depositi...
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WO/2019/055962A1 |
Various embodiments herein relate to methods and apparatus for electroplating material onto a semiconductor substrate. The apparatus includes an ionically resistive element that separates the plating chamber into a cross flow manifold (a...
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WO/2019/053120A1 |
An aqueous bath for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy, the bath comprising - a source of nickel ions, and optionally a source of ions of at least one alloying metal, - at least...
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WO/2019/054769A1 |
The present invention relates to a steel sheet used for outer panel materials of automobiles, home appliances, and the like and, specifically, to: a steel sheet which has excellent image clarity after coating by controlling the microstru...
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WO/2019/047086A1 |
A plating chuck for holding a substrate during plating processes, wherein the substrate has a notch area (3031) and a patterned region (3032) adjacent to the notch area (3031). The plating chuck comprises a cover plate (3033) configured ...
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