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WO/2024/103747A1 |
Embodiments of the present application relate to the technical field of chip packaging, and specifically relate to an electronic component and a manufacturing method therefor, a mainboard, and an electronic device. The embodiments of the...
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WO/2024/103727A1 |
The present disclosure relates to the field of semiconductor materials. Disclosed are a silicon carbide epitaxial wafer, and a preparation method therefor and a use thereof. The silicon carbide epitaxial wafer provided by the present dis...
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WO/2024/106184A1 |
The present invention suppresses the occurrence of false detection as to whether or not a lid of a container is normally closed. A load port 4 comprises a base 41, a placement portion 44 on which a FOUP 100 is placed, and a door mechan...
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WO/2024/107370A1 |
A method of determining an operational status of a semiconductor manufacturing assembly uses internal vibrations of an in-situ assembly to detect defects. The method may include initiating a first test vibration in an internal structure ...
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WO/2024/103199A1 |
The nitride-based semiconductor device includes a first nitride-based semiconductor layer, a second nitride-based semiconductor layer, a doped III-V semiconductor layer, and a gate electrode. The second nitride-based semiconductor layer ...
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WO/2024/107246A1 |
A method includes providing a first bonding surface on a first substrate, the first bonding surface including a bonding layer that is thermally curable or photocurable. The method includes providing a second bonding surface on a second s...
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WO/2024/103650A1 |
A liquid-source supply apparatus and method, and a semiconductor process system. The liquid-source supply apparatus comprises a liquid storage unit (100), a buffer unit (200), a gas supply unit (300), a gas-liquid separation unit (400), ...
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WO/2024/104594A1 |
The invention relates to a method and device for bonding substrates. Fig 1a Nothing to translate
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WO/2024/106183A1 |
The present invention effectively checks whether a lid on a container has been properly closed without exposing the internal space of the container to gas in the external space of the container. A load port 4 opens and closes a FOUP 10...
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WO/2024/105515A1 |
Provided is a semiconductor device that can be easily miniaturized. Provided is a semiconductor device in which parasitic capacitance is reduced. This semiconductor device comprises a transistor, a first insulation layer, and a second in...
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WO/2024/104782A1 |
An object holder is configured to support an object. The object holder (20) comprises a core body (21) comprising a plurality of burls (22) having distal ends (23) in a support plane (24) for supporting the object. The object holder furt...
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WO/2024/106219A1 |
This semiconductor device comprises a first electrically conductive layer, a first semiconductor element, a second electrically conductive layer, a second semiconductor element, first gate wiring, a first terminal, and a first conducting...
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WO/2024/106229A1 |
The present invention provides a semiconductor device processing composition compound, a method for producing a modified substrate, and a method for producing a semiconductor device, that make it possible to form a coating film that is h...
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WO/2024/106052A1 |
Each of M second constant-current sources (2a, 2b) or M variable resistances (71, 72) causes a current to flow in an amount of 1/M the sum of currents from N first constant-current sources (1a-1h). Each of N first probes (53a-53h) connec...
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WO/2024/060263A9 |
A display panel, a display device and a tiled display device. The display panel comprises a substrate, a driving circuit layer, a plurality of first binding electrodes, and a plurality of connecting leads. The substrate comprises a first...
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WO/2024/106298A1 |
The present invention addresses the problem of providing: a bonding paste which uses silver particles and enables pressureless bonding, while achieving excellent bonding strength and being suppressed in decrease of the bonding strength a...
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WO/2024/106200A1 |
[Problem] To automate supply/recovery of a conveyance container to/from a conveyance means, to thereby reduce the number of manipulators and the work amount required for device management, while enabling unmanned automatic operation. [So...
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WO/2024/103252A1 |
The present disclosure provides a nitride-based semiconductor integrated circuit (IC) chip including at least one transistor and a built-in bypass diode configured for bypassing reverse current flowing through the transistor. The built-i...
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WO/2024/107592A1 |
A FeFET transistor (600) is disclosed that has a source electrode (602), a drain electrode (602), and a channel structure (604). The first portion (606) is disposed parallel to the source electrode along the first length. The second port...
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WO/2024/105724A1 |
This bipolar transistor comprises a collector layer (103) formed on a substrate (101), a base layer (104) formed on the collector layer (103), an emitter layer (105) formed on the base layer (104), and an emitter cap layer (106) formed o...
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WO/2024/106711A1 |
[Abstract] The invention of the present application relates to a rinse solution composition for extreme ultraviolet photolithography and a pattern formation method using same. The rinse solution composition for extreme ultraviolet photol...
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WO/2024/104702A1 |
The present invention relates to a cleaning apparatus (44) for cleaning pot-shaped hollow bodies (12), wherein the cleaning apparatus (44) comprises at least one side wall (46), which delimits a cleaning space (50), wherein the side wall...
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WO/2024/103220A1 |
A bonding jig for compensating for an amount of bonding deformation, applied to assisting in the bonding of an object to be bonded, and comprising an upper jig and a lower jig. The upper jig has an upper working surface having a raised c...
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WO/2024/106266A1 |
This substrate processing method for processing a substrate includes: grinding of a first surface of the substrate and a second surface of the substrate; performing liquid processing of the first surface in a first liquid processing devi...
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WO/2024/107365A1 |
A semiconductor substrate carrying container, such as a front opening unified pod or shipping box, that includes a container shell having a plurality of walls, a front, and a rear, the plurality of walls defining an interior space that i...
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WO/2024/103281A1 |
The present disclosure provides a memory device that includes a film stack having functional tiers stacked in a first direction. Each functional tier includes a first dielectric layer and a conductive layer. The memory device also includ...
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WO/2024/106248A1 |
A substrate processing device comprises: a plurality of polishing modules (1A-1D) that are disposed in a polishing level and that polish a substrate; a post-processing lane (2A, 2B) that is disposed in a post-processing level and that pe...
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WO/2024/103531A1 |
The present disclosure relates to the technical field of semiconductors, and provides a semiconductor structure and a manufacturing method therefor, a chip packaging structure, and a circuit module. The semiconductor structure comprises:...
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WO/2024/107514A1 |
A module includes an assembly of a semiconductor device die (110), a lead frame (120, 130) connected to the semiconductor device die, and a substrate (112) connected to the lead frame. The substrate includes at least one plated-through h...
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WO/2024/104834A1 |
The invention relates to a method for producing a substrate for epitaxial growth of a semiconductor layer sequence. The method comprises providing a starting substrate. The starting substrate has a base substrate and a semiconductor laye...
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WO/2024/103691A1 |
The present application relates to a trench isolation structure, a manufacturing method therefor, and a semiconductor structure. The bottom of the trench isolation structure is located in a substrate (110), and the trench isolation struc...
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WO/2024/106110A1 |
Provided is a wafer end surface polishing device that makes it possible to give an end surface of a wafer an appropriate shape, even when the gap between a first roller and a second roller in the thickness direction of the wafer is made ...
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WO/2024/106283A1 |
This film forming method, which selectively grows a second insulating film on a first insulating film, comprises: a step in which a substrate having the first insulating film and a metal film is prepared; a step in which a plasma is gene...
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WO/2024/107450A1 |
A cleaning apparatus for cleaning a substrate wherein the substrate is contacted with ozonated water and irradiating the substrate and the ozonated water with UV electromagnetic radiation from a UV lamp within a cleaning chamber; wherein...
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WO/2024/066279A9 |
Provided in the present application are a wafer defect detection method, device and apparatus, and a computer-readable storage medium. The wafer defect detection method comprises: acquiring structure feature information of the surface of...
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WO/2024/107467A1 |
A high electron mobility heterostructure and a method of fabricating the heterostructure, wherein the high electron mobility heterostructure comprises a substrate, a buffer on the substrate, a doped charge compensation layer on the buffe...
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WO/2024/106371A1 |
The present invention provides: a method for manufacturing a modified substrate with which it is possible to perform ALD processing and manufacture a modified substrate on which an ALD film is formed with good selectivity in a predetermi...
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WO/2024/106356A1 |
The purpose of the present invention is to provide a coating agent composition which does not interfere with the resolution of a resist even when a substrate containing a nitrogen atom is used, can produce a satisfactory resist shape eve...
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WO/2024/105004A1 |
An electronic device (10) in the form of a field effect transistor comprising a substrate (15) and a dielectric layer (20) on the substrate (15). The dielectric layer (20) comprises a polymeric dielectric layer (22) with a cyclic olefin ...
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WO/2024/107965A1 |
A substrate processing system includes an optical transmission system configured to output light onto a substrate in a processing chamber and to measure transmission through the substrate at a first location. A controller is configured t...
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WO/2024/106263A1 |
The present invention pertains to a polishing device. This polishing device comprises a sensor structure (100) for detecting a polishing amount of a peripheral edge section of a substrate (W). The sensor structure (100) comprises: a sens...
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WO/2024/103588A1 |
Disclosed are a semiconductor structure manufacturing method, a semiconductor structure, and a memory. The method comprises: forming an initial conductive layer on an initial semiconductor structure; at least etching the initial conducti...
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WO/2024/107583A2 |
An apparatus and method for efficiently routing power signals across a semiconductor die. In various implementations, an integrated circuit uses Cross field effect transistors (FETs) with a first device, such as n-type device, having a f...
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WO/2024/106256A1 |
This plasma processing device comprises a chamber, a substrate-supporting part, a high-frequency power source, and a bias power source. The substrate-supporting part is provided inside the chamber. The high-frequency power source is conf...
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WO/2024/104550A1 |
The invention relates to a method for separating a first substrate layer (1) along at least one separating line, comprising: – providing the first substrate layer (1), and – separating the first substrate layer (1) along the separati...
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WO/2023/109307A9 |
The present disclosure relates to a gas switching system and a semiconductor processing method related thereto. In one embodiment of the present disclosure, a gas switching system is applicable to providing a gas switching function for a...
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WO/2024/104265A1 |
A gas feeding nozzle device and a plasma etching machine. The gas feeding nozzle device is used for supplying a process gas to a reaction chamber; the gas feeding nozzle device comprises a gas feeding nozzle and a nozzle seat sealingly c...
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WO/2024/106791A1 |
The present invention relates to an X-ray chip counter operation system. The system relates to an X-ray chip counter operation system which can be linked to an existing X-ray chip counter and has a label attachment function, and may comp...
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WO/2024/106684A1 |
The present invention provides a photovoltaic wafer defect detection system comprising: a photographing device that obtains a target image of a photovoltaic wafer; and a defect detection device that identifies the presence or absence of ...
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WO/2024/103626A1 |
Provided in the embodiments of the present disclosure are a package structure and a manufacturing method therefor. The package structure comprises: a substrate; an interposer, which is located above the substrate; a first chip, which is ...
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