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WO/2023/160836A1 |
According to one embodiment, a substrate support assembly for supporting a substrate is provided. The substrate support assembly, includes a table body having a surface configured to face the substrate; a table frame coupled to the table...
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WO/2023/158007A1 |
The present invention relates to a vessel holder, used for microscopes and the like, fixed by means of a conical screw. More specifically, the vessel holder can be closely attached to a stage by means of a single screw while being accura...
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WO/2023/158227A1 |
A plasma generation device according to one embodiment may comprise: a chamber in which plasma is generated; at least one sensor arranged inside the chamber; a voltage application unit for applying, to the sensors, three or more sinusoid...
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WO/2023/156117A1 |
A vacuum layer deposition apparatus comprising a vacuum coating chamber with an inner space; a material source constructed to generate electrically positively charged particles of a material to be deposited on a substrate in said inner s...
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WO/2023/155969A1 |
The invention relates to a circuit arrangement (10) for providing direct current for a plasma source, in particular for generating non-thermal arcs and glow discharges, and a plasma source as well as a method for operating the circuit ar...
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WO/2023/158006A1 |
The present invention relates to a stage assembly having a vent structure for preventing condensation and, more particularly, to a stage assembly having a vent structure for preventing condensation in which a flow channel is formed in a ...
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WO/2023/158675A1 |
A layered assembly for use in a controlled atmosphere chamber includes a plurality of substrates and an electrically functioning layer embedded between two adjacent substrates of the plurality of substrates, the electrically functioning ...
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WO/2023/158005A1 |
The present invention relates to a Scotch yoke-type stage assembly. More specifically, the Scotch yoke-type stage assembly simplifies the structure and reduces parts so that all operational parts can be mounted within a space that is sma...
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WO/2023/158491A1 |
A method for reducing variability between features of a substrate is described. The method includes generating, by a single radio frequency (RF) generator, an RF signal. The method further includes modifying, by the single RF generator, ...
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WO/2023/155078A1 |
A method of in-line inspection of a substrate is described. The method includes scanning a primary electron beam (105) over a first surface portion of a substrate, the substrate being a large area substrate with a grain structure, partic...
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WO/2023/158490A1 |
Systems and methods for central frequency tuning are described. One of the methods includes receiving a voltage signal from an output of a match coupled to a low frequency (LF) radio frequency (RF) generator and a high frequency (HF) RF ...
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WO/2023/158582A1 |
Exemplary semiconductor processing methods may include providing a fluorine-containing precursor and a hydrogen-containing precursor to a processing region of a semiconductor processing chamber. A substrate may be disposed within the pro...
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WO/2023/158478A1 |
Disclosed herein is a method for determining the endpoint of an etch operation used for forming high aspect ratio features and/or over low open area (<1 %) on a substrate in a processing chamber. The method begins by obtaining a referenc...
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WO/2023/154114A1 |
An edge ring for use in a plasma chamber includes a first pair of edge ring segments with each one of the first pair of edge ring segments having a first thickness and a second pair of edge ring segments with each one of the second pair ...
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WO/2023/154663A1 |
Various embodiments herein relate to apparatuses and methods for evaluating plasma uniformity using computer vision. In some embodiments, a method comprises obtaining signals from one or more camera sensors optically coupled to one or mo...
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WO/2023/154115A1 |
A confinement ring for use in a process chamber includes a tubular extension that is configured to surrounds a process region in the process chamber. An upper end of the tubular extension is configured to connect to a showerhead of the p...
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WO/2023/152305A1 |
The invention relates to a method for producing perforated metal strips having a metallic coating, wherein metal strips and in particular steel sheet strips with a perforation or a hole pattern are fed to a coating device and are passed ...
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WO/2023/153822A1 |
A substrate treatment apparatus according to an embodiment of the present invention comprises: a chamber which has a side wall; a susceptor on which a substrate is mounted in the chamber; an upper dome which covers the top surface of the...
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WO/2023/154613A1 |
Systems and methods for material processing using wafer scale waves of precisely controlled electrons in a DC plasma is presented. A surface floating potential of a substrate placed atop a stage in a positive column of the DC plasma is a...
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WO/2023/154233A1 |
A balun transformer for use in powering an electrode coil of a semiconductor chamber is provided. In one example, the balun transformer includes a primary coil having a primary winding between a primary first end and a primary second end...
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WO/2023/152978A1 |
The present invention suppresses a reduction in resolution that is likely to occur when a scanning region is expanded in a charged particle beam device equipped with an aberration corrector. A charged particle source (ES) generates charg...
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WO/2023/150542A1 |
The present disclosure provides to electron microscopy grids and methods, kits, and systems for using and fabricating thereof. More particularly, the present disclosure provides electron microscopy grids comprising a single first layer c...
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WO/2023/150026A1 |
The dual focused ion beam and scanning electron beam system includes an electron source that generates an electron beam and an ion source that generates an ion beam. The electron beam column directs an electron beam at a normal angle rel...
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WO/2023/147941A1 |
A multi-beam charged particle microscope (1), comprising: at least a first collective raster scanner (110) for collectively scanning a plurality of J primary charged particle beamlets (3) over a plurality of J image subfields (31.mn); a ...
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WO/2023/148095A1 |
A heterogeneous ion cluster (10) having a target element (61) and at least one detection element (62) is disclosed, wherein the detection element has an atomic optical transition and/or X-ray transition. The ion cluster (10) is focused a...
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WO/2023/150006A1 |
Electrostatic chucks and method for forming the same are described herein. The electrostatic chucks include a backside gas passage having a ceramic porous plug secured therein by a ceramic body of the chuck with a ceram ic-to-ceramic bod...
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WO/2023/150188A1 |
An antenna includes an inner structure, an outer structure, and a plurality of interconnecting structures coupling the inner structure to the outer structure. The plurality of interconnecting structures is axisymmetric with respect to a ...
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WO/2023/149960A1 |
A method for reducing reflected radio frequency (RF) power is described. The method includes receiving a voltage signal from an output of a match. The method further includes dividing the voltage signal into a plurality of bins and ident...
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WO/2023/150029A1 |
In some examples, a multi-station process tool comprises a plurality of process chambers, each process chamber located at a station of the multi-station process tool; and a RF power path component associated with each station of the mult...
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WO/2023/147814A1 |
The invention relates to a process reactor (10) for plasma-etching (ALE), with atomic precision, a substrate (12) to be machined and/or for plasma-assisted deposition of atom layers on the substrate (12). The process reactor (10) compris...
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WO/2023/146665A1 |
Bias supplies and plasma processing systems are disclosed. One bias supply comprises an output node, a return node, and a switch network and at least one power supply coupled to the output node and the return node. The switch network and...
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WO/2023/146778A1 |
A process kit is provided. The process kit includes: a substrate support; and one or more electrical connectors, each electrical connector attached to the substrate support, each electrical connector including: a tube; a shaft including ...
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WO/2023/146864A1 |
Electrostatic chuck (ESC) apparatuses and systems are provided. An ESC may have one or more chucking electrodes and a blocking electrode that surrounds the chucking electrodes. The blocking electrode may reduce non-uniformities in semico...
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WO/2023/143094A1 |
Provided in the embodiments of the present application is a semiconductor processing apparatus. An air intake assembly of the semiconductor processing apparatus is arranged on the top end of a medium sleeve in a covering manner, and the ...
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WO/2023/142497A1 |
A plasma processing apparatus. The apparatus comprises: a vacuum reaction cavity internally provided with a movable lower electrode assembly; a movable grounding ring disposed at the bottom of the movable lower electrode assembly; a fixe...
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WO/2023/146742A1 |
A heater assembly that that is effective at maintaining heating lamps at acceptable temperatures is disclosed. The heater assembly utilizes radiative heat transfer to transfer unwanted heat buildup in the heating lamps to a cooling base....
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WO/2023/143860A1 |
Disclosed is a multi-beam generating unit of a multi-beam charged particle imaging system with reduced sensitivity to drift and extended lifetime. Drifts due to x-ray irradiation and thermal loads are minimized by a combination of at lea...
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WO/2023/146194A1 |
The present invention relates to a substrate processing device comprising: a first source supply unit for supplying a first source gas; a second source supply unit for supplying a second source gas; a first supply line for connecting the...
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WO/2023/143719A1 |
A method of operating a coating system provided in a vacuum chamber is described. The coating system includes a coating drum for transporting a substrate, at least one electron beam gun for evaporating a coating material, and an electron...
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WO/2023/146076A1 |
The present invention relates to a plasma chamber for wafer etching and a wafer etching method using the plasma chamber. The plasma chamber of the present invention comprises: a housing having a reaction space therein to etch a wafer thr...
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WO/2023/143858A1 |
The invention relates to a multi-beam charged particle microscope system with a mirror mode of operation, a method for operating a multi-beam charged particle microscope system with a mirror mode of operation and an associated computer p...
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WO/2023/146663A1 |
Bias supplies and plasma processing systems are disclosed. One bias supply comprises an output node, a return node, and a switch network and at least one power supply coupled to the output node and the return node. The switch network and...
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WO/2023/146921A1 |
A show effect system may include a plasma tube configured to generate an electric arc within the plasma tube and a light strip extending along the plasma tube. The light strip may include a plurality of light emitters configured to outpu...
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WO/2023/147356A1 |
A cell deactivation device includes a cell deactivation container. The cell deactivation container includes a plurality of microfluidic channels, a lid covering the plurality of microfluidic channels, the lid having a thickness of less t...
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WO/2023/144970A1 |
Provided is a charged particle beam inspection system capable of deriving an optimal observation condition by using an image prediction model obtained by means of machine learning of simulation results. The inspection system is character...
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WO/2023/147108A1 |
An ion source 110 has an arc chamber 116 defining an arc chamber volume 140. A reservoir 144 is coupled to the arc chamber, defining a reservoir volume 146. The reservoir receives a source species to define a liquid 114 within the reserv...
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WO/2023/147406A2 |
Methods and systems for calibrating a transmission electron microscope are disclosed. A fiducial mark on the sample holder is used to identify known reference points so that a current collection area and a through-hole on the sample hold...
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WO/2023/146664A1 |
Bias supplies and plasma processing systems are disclosed. One bias supply comprises an output node, a return node, and a power section coupled to the output node and the return node. A resonant switch section is coupled to the power sec...
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WO/2023/145015A1 |
In the present invention, film qualities of deposited semiconductor film, insulating film, and the like are inspected in a non-contact manner. This inspection device (1) for inspecting the film quality of a film formed on a sample (16) h...
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WO/2023/141145A1 |
Embodiments of the present disclosure generally relate to composite PVD target. The target has a diameter, a connection face, a substrate face opposite the connection face, a thickness between the connection face and the substrate face, ...
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