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WO/2024/095997A1 |
This polishing device comprises: a polishing table that supports a polishing pad; a polishing head capable of pressing a substrate onto a polishing surface of the polishing pad; and a processor that estimates a polishing index of the pol...
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WO/2024/091709A1 |
A chemical mechanical polishing apparatus has a platen to support a polishing pad, a carrier head comprising a rigid housing and configured to hold a surface of a substrate against the polishing pad, a motor to generate relative motion b...
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WO/2024/091314A1 |
A chemical mechanical polishing apparatus has a platen to support a polishing pad, the platen having a recess, a carrier head to hold a surface of a substrate against the polishing pad and comprising a retaining ring to retain the substr...
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WO/2024/089912A1 |
The purpose of the present invention is to provide a device and a method for manufacturing a semiconductor crystal wafer, the device and the method being capable of easily and reliably manufacturing a semiconductor crystal wafer of high ...
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WO/2024/083536A1 |
The invention relates to a method for grinding a toothing of a workpiece (1) by means of a grinding tool, wherein the grinding tool is mounted on a tool spindle and the tool spindle is turned by means of a first drive motor, and wherein ...
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WO/2024/080081A1 |
A projection polishing system comprises: a shape measurement device (3) that measures a three-dimensional shape and orientation of an object material; a projection detection device (4) that detects a projection that is present on a surfa...
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WO/2024/080189A1 |
Provided is a top ring with which it is possible to improve uniformity of polishing. This top ring for holding a substrate comprises: a base member connected to a rotary shaft; a substrate suctioning member including a porous member ha...
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WO/2024/078567A1 |
Disclosed in the present invention is an eddy-current end-point detection apparatus. The apparatus comprises: a plurality of resonant circuits which are connected in series, wherein each resonant circuit generates a set frequency; a magn...
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WO/2024/079856A1 |
This communication device (100) comprises: a sensor (S) that is attached to an object (52, T) to be detected and outputs an analog detection signal (SA1); and a modulated laser generation device (103) that generates a modulated laser (SL...
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WO/2024/075284A1 |
This contact dynamic stiffness calculation system (130) calculates contact dynamic stiffness data (Ci, Ki) between a workpiece (W) and a tool (T) exhibited via contact between the workpiece (W) and the tool (T) when machining in a machin...
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WO/2024/075303A1 |
This workpiece mass determination device (131) is for calculating a workpiece mass (M'w(Z')) for analysis for analyzing the dynamic characteristics during machining in a machining device (2) for machining a workpiece (W) by means of a to...
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WO/2024/074951A1 |
The present invention relates to a method for machining small rotary cutting tools (10) by a grinding machine, comprising: a) mounting a workpiece (10a) in a spindle (20) of the grinding machine; b) machining a calibration portion (CP) o...
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WO/2024/076421A1 |
A polishing system includes a pressure system, a substrate carrier including a membrane, a first sensor, and a control system. A first compartment of the membrane is fluidly coupled to the pressure system. The first sensor is configured ...
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WO/2024/066957A1 |
A grinding machine and a control method therefor. The control method comprises: making a cross beam (41) of a cross beam and slider assembly (4) to slide relative to a fixing base (1); and/or making a slider (42) to slide relative to the...
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WO/2024/062064A1 |
The invention relates to a process for shaping an ophthalmic product (20) using a machining device (200) equipped with clamping means (202, 203), a machining tool (210) and a force sensor (234) adapted to measure a force that is related ...
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WO/2024/045493A1 |
A shape-controlled flexible polishing method for a microarray mold. The following solution is used: a magnet is mounted below a microarray mold (3), so that a prepared magnetic abrasive is attached to the surface of the microarray mold (...
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WO/2024/034171A1 |
This cutting device cuts an object to be cut. The cutting device comprises a table, a cutting mechanism, and an imaging device. The table holds the object to be cut. The cutting mechanism cuts the object to be cut held by the table. The ...
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WO/2024/030291A1 |
A chemical mechanical polishing apparatus has a heating system, a purge gas source, a purge liquid source, and a controller. The heating system includes a source of heated gas, an arm extending over a platen, and a manifold in the arm wi...
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WO/2024/029236A1 |
[Problem] To provide an information processing device that makes it possible to appropriately predict reliability information of a polishing end-point detection function, the reliability information indicating the reliability of an end-p...
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WO/2024/023876A1 |
A polishing tool (1) stores and holds, in a storage unit (52) of a polishing tool holder (4), a reference dimension (M) which is the initial dimension of a linear abrasive material (2), the number of polishing operations, and a wear patt...
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WO/2024/025816A1 |
Low-friction sanding assemblies and machines for sanding and/or grinding one or more portions of a part are provided. The low-friction sanding assemblies comprise a sanding pad, an abrasive device, and a constant-force assembly that main...
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WO/2024/018562A1 |
The purpose of the present invention is to provide a system and a program for enabling workpiece processing precision to be maintained even if a grinding material is worn down. A system comprising at least one computer device, the syst...
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WO/2024/015530A1 |
A chemical mechanical polishing system includes a support configured to hold a substrate face-up, a polishing article having a polishing surface smaller than an exposed surface of the substrate, a port for dispensing a polishing liquid, ...
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WO/2024/009588A1 |
Provided is a machining tolerance evaluating system capable of reducing, at least, reworking costs, by obtaining and displaying an appropriate tolerance range with which a metal machined product can be manufactured. The machining toler...
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WO/2024/007009A1 |
An alignment system configured for use in a skate sharpening system (200) can comprise: a securing component (202) configured to secure a skate blade (100) within a skate sharpening system (200); an alignment component (600) positioned w...
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WO/2024/002018A1 |
A device for automatically measuring a side length of a monocrystal after grinding may include a detection table, a first driver, a mechanical arm and a probe assembly, the detection table is used for placing the monocrystal to be detect...
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WO/2024/001389A1 |
A reciprocating abrasive flow polishing device based on a cavitation effect. A lower sealing plate (3) is hermetically connected to an opening at an upper end of a lower box body (1), and the lower sealing plate (3) can move up and down ...
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WO/2023/248088A1 |
An abrasive article evaluation system is presented that includes a detector that detects a nonvisual abrasive wear cue and an efficiency indication generator that, based on the abrasive wear cue, generates an indication of wear for the a...
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WO/2023/248086A1 |
An abrasive article evaluation system includes a detector that detects an abrasive wear cue. The system also includes an efficiency indication generator that, based on the abrasive wear cue, generates an indication of wear for the abrasi...
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WO/2023/248087A1 |
An abrasive article evaluation system is presented that includes a camera that images an abrasive article. The system includes an efficiency indication generator that, based on the image, generates an indication of abrasive efficacy for ...
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WO/2023/248960A1 |
A method, for polishing both sides of a workpiece made of a glass substrate, comprises: (1) a step for starting polishing of the workpiece; (2) a step for monitoring the rotational state of the workpiece in real time; and (3) a step for ...
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WO/2023/249678A1 |
A method of controlling a chemical mechanical polishing system includes receiving a respective time-varying test signal from an endpoint detection system for each of a plurality of test substrates, simultaneously visually displaying the ...
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WO/2023/249903A1 |
A robotic abrading system is presented that includes a robotic arm that causes a workpiece to contact an abrasive article according to a set of operational parameters for an abrasive operation. The system also includes a pre-operation to...
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WO/2023/242883A1 |
Position detection unit (10) for a sheet (200) having a perimeter edge (212), comprising a slider (11) and a detection device (13) provided with a detection member (14).
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WO/2023/242481A1 |
The present invention relates to a device (100) for moistening a polishing pad (203). The moistening device (100) comprises measuring means (103, 104, 105, 106, 107, 108, 109, 110) for measuring a physical quantity that is indicative of ...
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WO/2023/239393A1 |
Exemplary substrate electrochemical planarization apparatuses may include a chuck body defining a substrate support surface. The apparatuses may include a retaining wall extending from the chuck body. The apparatuses may include an elect...
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WO/2023/239419A1 |
A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a conditioner head to hold a conditioner disk in contact with the polishing pad, a motor to generate relative motion between the polishing pad and th...
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WO/2023/234974A1 |
A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier hea...
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WO/2023/235582A1 |
A chemical mechanical polishing apparatus, including a platen supporting a polishing pad; a carrier head to hold a surface of a substrate against the polishing pad; a motor to generate relative motion between the platen and the carrier h...
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WO/2023/233769A1 |
The present invention relates to a polishing device. This polishing device comprises a triaxial sensor that is disposed adjoining a head arm (20) and that detects information relating to triaxial-direction force applied to a polishing he...
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WO/2023/234973A1 |
A chemical mechanical polishing apparatus includes a platen supporting a polishing pad, a carrier head to hold a surface of a substrate against the polishing pad, an acoustic sensor supported on the platen, and a motor to generate relati...
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WO/2023/228591A1 |
The present invention pertains to a cylinder grinding machine that comprises: first and second detection means for detecting, in a non-contact manner, proximity between one end or the other end of a crystal rod and a spindle or a counter...
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WO/2023/228483A1 |
Provided are a roll grinder abnormal vibration predicting method and a roll grinder abnormal vibration predicting device capable of predicting abnormal vibration of a roll grinder corresponding to a natural frequency of an entire mechani...
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WO/2023/223959A1 |
Provided are a substrate polishing method, etc., for performing polishing accommodating substrates having various dimensions. Proposed is a substrate polishing method employing a polishing device comprising: a polishing table having a ...
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WO/2023/217805A1 |
The disclosure provides a method for manufacturing an ophthalmic device, comprising machining to provide a predetermined surface on a part and which corresponds to an initial ophthalmic surface, the machining comprising: - selecting (130...
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WO/2023/210073A1 |
The present invention relates to a device for initializing an elastic film, a polishing device, a method for initializing an elastic film, and a method for assessing the service life of an elastic film. This device (50) for initializing ...
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WO/2023/205258A1 |
A system (100) for identifying and repairing one or more defects on a surface of an object (102). The system can have a robotic paint repair apparatus (110) with a robotic arm (114) and a tool (120, 122) mounted to the robotic arm. The t...
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WO/2023/197157A1 |
A sensor (1), a detection device (100), and a detection system. According to the sensor (1), at least one coil group (20) for generating an electromagnetic field is provided on a carrier (10); a channel (30) allowing for the passage of a...
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WO/2023/189165A1 |
An information processing device (5) comprises: an information acquisition unit (500) that acquires operating status information including top ring status information, polishing table status information, polishing fluid supply nozzle sta...
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WO/2023/184727A1 |
A PCB grinding method, a PCB regrinding device, and a PCB. The PCB grinding method comprises: establishing a board thickness data model, the board thickness data model comprising the board thickness of each hole plugging area before hole...
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