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WO/2023/062866A1 |
This cutting device is configured to cut an object to be cut, with a blade. The cutting device comprises an imaging unit, and a control unit. The imaging unit is configured to move relatively to a dressing board, and image some region of...
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WO/2023/062973A1 |
In a processing machine 1, a Z-axis electric motor 39 moves a main shaft 37 in a Z direction. A Z-axis position sensor 69 detects a position of the main shaft 37 in the Z direction. A rotation sensor 71 detects rotation of the main shaft...
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WO/2023/061510A1 |
A grinding method, being used for grinding at least one intersecting line in a valve cavity. The grinding method comprises: obtaining coordinates of M first sampling points on one intersecting line in the at least one intersecting line; ...
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WO/2023/058285A1 |
An information processing device (5) comprises: an information acquisition part (500) for acquiring crack generation state information that includes crack state information indicating a crack state at a time when crack has been generated...
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WO/2023/058107A1 |
A machining device (1, 201) for machining a workpiece (W), which is supported by a workpiece supporting member (20, 30, 40, 60, 220, 230, 240), with a tool (T, T2), the machining device (1, 201) comprising a processing unit (3, 203) that...
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WO/2023/051960A1 |
The invention relates to a machine for machining sheet metal parts, comprising a brush unit (70) having at least one horizontally rotating polishing brush (71) for brushing the surface of the sheet metal parts to be machined. In order to...
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WO/2023/047682A1 |
The present invention relates to a polishing device, a substrate processing apparatus, and a polishing method. This polishing device comprises a polishing unit 22. The polishing unit 22 comprises: a holding and rotating unit 35 that rota...
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WO/2023/047683A1 |
The present invention relates to a polishing method, and a substrate processing apparatus. This polishing method comprises: a rotation step for rotating a substrate W in a horizontal posture; an etching step for supplying an etching liqu...
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WO/2023/047437A1 |
In a processing device (2, 302) for processing a workpiece (W) with a tool (T, T2), a processing estimation device (3, 5, 303) estimates at least one among the condition of the workpiece (W) or the tool (T, T2), the shape of the workpiec...
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WO/2023/047684A1 |
A substrate processing apparatus 1 comprises: an indexer robot that takes a substrate W into and out of a carrier; a polishing unit 22 that polishes a back surface of the substrate while heating the substrate W; and a substrate transport...
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WO/2023/042602A1 |
The present invention provides a processing machine in which a machine body drives at least one of a workpiece and a tool to process the workpiece using the tool. A processing chamber houses the workpiece, the tool, and a nozzle while is...
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WO/2023/038183A1 |
One embodiment of the present invention provides a technology for automatically performing a polishing process by using a robot and controlling the polishing process in real time by monitoring a current value of a spindle in real time. A...
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WO/2023/036903A1 |
A surface processing apparatus (500) comprises: - a surface processing device (200) to process a surface (SRF1), - a robot (ROBO1 ) to move the surface processing device (200) with respect to the surface (SRF1 ), - an electromagnetic act...
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WO/2023/026723A1 |
The present invention relates to a polishing device. The polishing device comprises: a plurality of window members (50) that transmit infrared rays, and a plurality of infrared radiation thermometers (51) that are disposed under the plur...
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WO/2023/022818A1 |
Exemplary slurry delivery assemblies may include a slurry fluid source. The assemblies may include a flurry delivery lumen having a lumen inlet and a lumen outlet. The lumen inlet may be fluidly coupled with an output of the slurry fluid...
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WO/2023/018428A1 |
A robotic sharpening system and method for rapidly and accurately sharpening or resharpening cutting tools is provided. The inventive system employs a robotic arm that grasps each cutting tool by its cutting blade instead of by its handl...
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WO/2023/013509A1 |
A wire saw (1) abnormality diagnosis device comprises: a diagnostic mode execution unit (51), a data group acquisition unit (52), a deviation information calculation unit (54), and a determination unit (55). The diagnostic mode execution...
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WO/2023/013146A1 |
The present invention enables accommodating diced workpieces in a tubular container while eliminating use of a moving mechanism for moving a processing table and comprises: a processing table which holds a workpiece; a first holding mech...
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WO/2023/013559A1 |
A robot system 100 comprises: a robot 1 for machining a machining portion B of an object W; a storage unit 32 for keeping an image of the object W, and three-dimensional information; a designation device 9 for designating the machining p...
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WO/2023/013339A1 |
In the present invention, a polishing end point is detected with high accuracy even if there is a change in polishing frictional force. This polishing device comprises a polishing table for holding a polishing pad, a holding unit for h...
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WO/2023/007356A1 |
An abrading operation monitoring system is presented that includes a particle tracking system that receives, from a particle position retriever, a position of an abrasive particle on an abrasive article surface. The system also includes ...
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WO/2023/283525A1 |
A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier hea...
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WO/2023/283559A1 |
A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a motor to generate relative motion between the platen and the c...
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WO/2023/283526A1 |
A chemical mechanical polishing apparatus includes a platen, a polishing pad supported on the platen, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and t...
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WO/2023/283555A1 |
A chemical mechanical polishing apparatus includes a platen, a polishing pad supported on the platen, a carrier head to hold a surface of a substrate against a polishing surface of the polishing pad, and a motor to generate relative moti...
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WO/2022/263993A1 |
Diamond grinding wheel (1), for grinding and abrasion of stratified solid materials comprising a cutting unit (2.1) provided with a diamond crown (2.2) and: - a central tooth (3) adapted to remove plastic material or similar materials, p...
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WO/2022/259913A1 |
The present invention relates to techniques for calculating polishing rate responsiveness with respect to a change in the pressure with which a workpiece used for manufacturing a semiconductor device, such as a wafer, a substrate, or a p...
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WO/2022/259813A1 |
In the present invention, the optimal value for an inter-plate distance is calculated on the basis of relationship data indicating the relationship between the flatness of a workpiece and an inter-plate distance which is the distance bet...
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WO/2022/256059A1 |
The present disclosure describes an apparatus for chemical-mechanical polishing of a semiconductor wafer. Some embodiments of the present disclosure include a pad, a slurry introduction mechanism, a wafer carrier (e.g., carrying a wafer ...
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WO/2022/253627A1 |
The invention relates to a method comprising: - detecting (S3), using an optical sensor, an intrinsic optical feature of a lens member to be positioned on a manufacturing apparatus configured to apply an optical lens manufacturing operat...
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WO/2022/254856A1 |
The present invention provides a double-side polishing device for a workpiece that, during double-side polishing, can end the double-side polishing at a timing at which the shape of the entire workpiece and the outer circumferential port...
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WO/2022/256157A1 |
A method and apparatus for determining a polishing pad thickness profile are described herein. A set of displacement sensors, including an arm displacement sensor and one or more conditioning disk displacement sensors are utilized to det...
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WO/2022/256465A1 |
Exemplary semiconductor processing systems may include a substrate support defining an aperture therethrough. The processing systems may include a light assembly having a light source that emits an optical signal that is directed toward ...
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WO/2022/250208A1 |
An embodiment of the present invention provides a method for processing a wafer, the method comprising the steps of: preparing a wafer that has a notch portion formed on one side thereof; aligning the wafer by analyzing image information...
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WO/2022/249787A1 |
According to the present invention, the wear amount of a polishing pad is measured using a simple structure. This substrate processing device 1000 comprises: a table 100 for supporting a substrate WF having a surface to be polished tha...
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WO/2022/251274A1 |
A workpiece separator system including a gripper, a heat source in thermal communication with the gripper, the heat source configured to heat a block of the workpiece causing separation of an alloy puck from the block. A method for separ...
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WO/2022/239376A1 |
A method for creating correlational expression for polishing condition determination, the method comprising: polishing a semiconductor wafer on the basis of a plurality of polishing conditions including a plurality of polishing parameter...
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WO/2022/240330A1 |
A floor grinder (100) for processing a concrete surface (101), the floor grinder comprising one or more rotatable abrasive tool holders (150) arranged in a plane (P) to hold respective abrasive tools (210, 510), at least one power source...
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WO/2022/234469A1 |
A manufacturing system (1) and a method for manufacturing articles made of compacted ceramic powder (MCP), the system (1) comprising: a supply assembly (3) to supply ceramic powder (CP); a compaction device (5) to obtain a layer of compa...
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WO/2022/232290A1 |
A chemical mechanical polishing apparatus includes a platen having a top surface to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad during a polishing process, a temperature monit...
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WO/2022/230646A1 |
The present invention relates to a polishing device and a polishing method. A polishing device comprises an operation control unit (9) for individually controlling the pressure of each of a plurality of pressure chambers. The operation c...
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WO/2022/224508A1 |
The present invention pertains to a polishing method and polishing device for polishing a substrate such as a wafer while also pressing the substrate up against a polishing surface of a polishing pad, and, in particular, to a polishing m...
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WO/2022/216554A1 |
An apparatus and method for to monitoring slurry buildup is disclosed. A substrate polishing apparatus includes a surface coated at least in part with a fluorescent material, a light source configured to illuminate the surface, an image ...
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WO/2022/215628A1 |
The present invention suppresses a decrease in dimensional accuracy. This method for manufacturing a glass substrate supports a semiconductor device, and generates a glass mother plate, measures the thickness, thickness deviation, and wa...
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WO/2022/209081A1 |
The present invention reduces the time required for alignment work and comprises: a rotatable cutting table 2A, 2B that holds a sealed substrate W that has an alignment mark AM provided thereupon; a cutting mechanism 4 that cuts the seal...
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WO/2022/201650A1 |
[Problem] To provide a processing system that can process a workpiece with good precision. [Solution] A processing system 1 is configured so as to comprise: a tilting device that can tilt a rotational axis 3a of a chuck 3 retaining a wor...
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WO/2022/203781A1 |
A method and apparatus for polishing a substrate is disclosed herein. More specifically, the apparatus relates to an integrated CMP system for polishing substrates. The CMP system has a polishing station configured to polish substrates. ...
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WO/2022/198739A1 |
An arrayed grinding method based on active pressure modulation, the method comprising: preparing grinding tools; performing measurement to obtain error distribution of a mirror to be processed, and calculating a residence time of a singl...
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WO/2022/201660A1 |
This cutting device configured so as to form a half cut groove in a cutting object comprises a table, a spindle part to which a blade is attached, a detection part, and a control part. The table holds the cutting object. The blade moves ...
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WO/2022/196132A1 |
The present invention provides a method for manufacturing a semiconductor device equipped with a semiconductor substrate, the method comprising: an attachment step for attaching a protective tape on a first surface of a semiconductor sub...
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