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WO/2018/101109A1 |
A cutting device (1) cuts a workpiece (W) on the basis of a target value for dimensions of the workpiece (W) determined according to a design value for the dimensions of the workpiece (W) and a corrected value for the design value. A gri...
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WO/2018/091989A1 |
Disclosed is a method for detection, control and automatic compensation of pressure during polishing, comprising the following steps: detecting the pressure between a polishing wheel (10) and a polished workpiece (11) by means of a detec...
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WO/2018/077327A1 |
The invention relates to a method for producing bearing components for forming a roller or slide bearing (40), wherein at least two production lines (1, 1a, 1b, 1c, 1d) are used and operated synchronously. A dimension of a first bearing ...
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WO/2018/079319A1 |
Provided is a grinder that facilitates manual grinding work requiring careful operation. A grinder 1 has: a grindstone 4 that grinds a workpiece; a nozzle 71 through which a cooling liquid is jetted out to the workpiece; hand-feed handle...
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WO/2018/074041A1 |
This surface property measuring device for a polishing pad measures surface properties, such as surface shape and surface state, of a polishing pad to be used for the purpose of polishing substrates, such as a semiconductor wafer. The su...
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WO/2018/074091A1 |
A local polishing system is provided with: a particle estimation unit (30) which estimates a film thickness distribution of a wafer; a local polishing region setting unit (11) which sets a local polishing region of the wafer on the basis...
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WO/2018/075260A1 |
An apparatus for chemical mechanical polishing includes a support for a polishing pad having a polishing surface, and an electromagnetic induction monitoring system to generate a magnetic field to monitor a substrate being polished by th...
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WO/2018/059144A1 |
A CMP equipment polishing head wafer falling detection method and system. The method comprises: monitoring, in a vacuum wafer grabbing process and a wafer carrying and conveying process of a polishing head, the vacuum adsorption pressure...
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WO/2018/058238A1 |
An apparatus for positioning a feed finger of a saw sharpening machine with a saw blade mounted in the saw sharpening machine includes a tooth detection unit which is used to detect the position of a tooth of the saw blade relative to th...
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WO/2018/052816A1 |
Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) of substrates. In one embodiment, a carrier head for a CMP apparatus is disclosed herein. The carrier head includes a body, a retaining ring, a...
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WO/2018/053023A1 |
During polishing of a substrate a first signal is received from a first in-situ monitoring system and a second signal is received from a second in-situ monitoring system. A clearance time at which a conductive layer is cleared and a top ...
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WO/2018/049790A1 |
Disclosed is a multi-angle two-dimensional ultrasonic vibration assisted grinding device of a nano-fluid minimum quantity lubrication type, comprising components, such as a workpiece clamp (I-9) for clamping a workpiece (I-12), a grindin...
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WO/2018/047652A1 |
The purpose is to provide a slicing device for hard, brittle material that can significantly shorten the time required to slice hard, brittle material and that can efficiently slice hard, brittle material. Provided is a slicing device fo...
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WO/2018/046543A1 |
The present invention relates to a machine for processing workpieces, having at least three stations and having a movably mounted table (1), wherein at least one clamping apparatus (2), which, in particular, is driveable in a rotating fa...
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WO/2018/042864A1 |
This method for producing a semiconductor substrate comprises the following steps. While measuring the outer diameter of a wire wherein diamond abrasive grains are fixed to a core wire, a semiconductor is sliced with the wire. A conditio...
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WO/2018/039031A1 |
A system and method for manufacturing and/or reconditioning side frames and bolsters for railway cars includes at least one robot adapted to access positions along the length of the part. A map of the part dimensions, which may be obtain...
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WO/2018/039537A1 |
An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a pad conditioner including a conductive b...
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WO/2018/034308A1 |
The present invention relates to a polishing method for polishing a substrate such as a wafer. The polishing method comprises: polishing a substrate (W) by pressing the substrate (W) against the surface of a polishing pad (3); changing t...
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WO/2018/030675A1 |
The present invention comprises: a holding jig for supporting a processing object; a brush rotating/driving portion arranged on the holding jig so as to rotate a brush such that the processing object is polished; an X-axis direction driv...
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WO/2018/024769A2 |
The present invention relates to a device for sanding surfaces of a workpiece, preferably at least portions of which are made of wood, a manufactured wood product, plastic, or such like. The invention further relates to a sanding machine...
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WO/2018/026075A1 |
The present embodiments provides a mechanism in which the thickness of a scanned wafer shape is calculated to determine a profile, and a calculated PV value and a set predictive PV value for each profile are used such that a delta correc...
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WO/2018/012313A1 |
The present invention is a wire saw device that includes: a wire feed reel that lets out wire; wire rows formed of the wire spirally wound around a plurality of wire guides; a wire winding reel on which the wire is wound; and a workpiece...
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WO/2018/002123A1 |
Machining apparatus (2), in particular wide-belt sander for machining preferably board-type workpieces (W) preferably made at least in part of wood, engineered wood and/or plastic, comprising at least one light signal display device (10)...
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WO/2018/003765A1 |
A polishing device (10) is provided with a first arm (13) which has a polishing member (30) at the tip end of the arm for polishing a work (40) and which linearly reciprocates the polishing member (30), and a second arm (13) which has a ...
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WO/2017/215943A1 |
This document provides a method of operating a floor grinding machine 100. The method comprises providing a grinding machine 100 comprising a frame 101, a motor 102 and at least one grinding element 1, causing the motor to drive the grin...
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WO/2017/218921A1 |
In described examples, a chemical mechanical polishing (CMP) system (200) includes a platen (214), a conduit (202) having a heating segment (205) and a delivery outlet (212), and a heater (206) coupled to the heating segment (205) of the...
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WO/2017/201059A1 |
A method includes: sensing a defect on a cast strip surface, the cast strip being cast from molten metal or alloy by a casting system, determining an adjustment amount and/or direction of a casting system component based on the identifie...
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WO/2017/188239A1 |
The present invention addresses the problem of providing a machine tool system capable of suitably measuring the shape of a workpiece, providing a machine tool system for suitably calculating the surface roughness of the workpiece and a ...
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WO/2017/160127A1 |
The present invention relates to a method and a device for polishing a laminated sheet and, more particularly, to a method and device for laminating to-be-polished sheets and polishing the same. The present invention provides a laminated...
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WO/2017/158955A1 |
According to the present invention, whether wafer polishing is completed is determined with high accuracy for each wafer. A wafer processing method according to the present invention comprises: a first step for acquiring the initial stat...
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WO/2017/160344A1 |
Systems and methods of in-situ calibration of semiconductor material layer deposition and removal processes are disclosed. Sets of test structures including one or more calibration vias or posts are used to precisely monitor processes su...
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WO/2017/154056A1 |
Provided is a gear grinding machine for grinding a gear by causing a gear that is to be ground and a grindstone to rotate in a meshed state, wherein the gear grinding machine makes it possible to suppress the generation of waviness durin...
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WO/2017/139663A1 |
Method and apparatus for sharpening a cutting tool ( 130, 160, 230). In some embodiments, a sharpener (100, 300) has a guide assembly (1 18) adjacent a moveable abrasive medium ( 1 12, 308). The medium is advanced at a first speed relati...
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WO/2017/138511A1 |
The respective diameters of a sphere to be measured that is partway through processing and of a reference sphere of the same material as the sphere being measured and having the target diameter for the sphere being measured are measured ...
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WO/2017/139079A1 |
Implementations of the present disclosure generally relate to planarization of surfaces on substrates and on layers formed on substrates, including an apparatus for in-situ temperature control during polishing, and methods of using the s...
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WO/2017/122580A1 |
To provide a polishing device capable of performing polishing by selecting a suitable polishing recipe on the basis of a state prior to the polishing, even in a situation where bevel portions have various shapes. A polishing device 100 h...
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WO/2017/123834A1 |
A chemical mechanical planarization (CMP) pad conditioner, a CMP pad conditioning system and a CMP pad conditioning method are provided. The CMP pad conditioner includes an adaptor configured to receive an abrasive member and a sensing c...
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WO/2017/108851A1 |
The invention relates to a grinding device for grinding a cutting contour (7) of a knife (1), comprising a base frame (5), a knife holder (6), and one or more driven grinding means (2), wherein the knife holder (6) is rigid and the grind...
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WO/2017/098696A1 |
The present invention is a polishing method with a polishing step for polishing the surface of a wafer, which is held by a polishing head, by rubbing the wafer on the surface of a polishing fabric that is bonded to a surface plate while ...
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WO/2017/094462A1 |
A plate glass manufacturing method comprises a transportation step of transporting plate glass (G) in a prescribed transport direction. In the transportation step, a portion of a transport belt (6) is raised by a lifting and lowering dev...
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WO/2017/080535A1 |
The method of machining of rotary components (3), especially hard ceramic, metaloceramic or metallic coatings on the rotary component (3) with the length greater than 2 meters, whose essence consists in the fact that the equipment is def...
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WO/2017/077691A1 |
A wafer polishing method of the present invention is characterized by having: a measuring step for measuring the depth PDt of a recessed section of a template after taking out a polishing-completed wafer, said measuring step being to be ...
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WO/2017/073265A1 |
A method for polishing both sides of a semiconductor wafer according to the present invention comprises: detecting a load current value of a sun gear or a load current value of an internal gear when both sides of the semiconductor wafer ...
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WO/2017/067884A1 |
An apparatus (1) for dressing a grinding wheel (2) mounted thereon by creating structures (12) on the surface of a, in particular cylindrical, grinding surface (3) of the grinding wheel (2), the apparatus (1) comprising: - a dressing too...
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WO/2017/058769A1 |
A method and apparatus for evaluating performance of a bonded abrasive article during a cutoff grinding operation including an abrasive assembly holding a bonded abrasive article, a workpiece assembly holding a workpiece and a measuring ...
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WO/2017/056636A1 |
The present invention relates to a method and a device for polishing the surface of a substrate having film thickness unevenness in the circumferential direction of the substrate. Disclosed is a polishing method whereby: film thickness d...
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WO/2017/053502A1 |
Systems and methods for conditioning blades are provided. A method may include, for example, obtaining a cutting device, measuring various characteristics of the cutting edge of the cutting device, creating a current edge profile based o...
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WO/2017/039544A1 |
An instrumented tool for surface finishing of a work-piece, the instrumented tool comprising: a tool configured to be spun and brought into contact with the work-piece while spinning; a spindle configured to provide a spinning torque to ...
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WO/2017/035557A1 |
A control system for controlling operation of a fluid delivery system that includes at least a first pump (14) for delivering a first fluid and a second pump (24) for mixing a second fluid with the first fluid. The control system include...
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WO/2017/035190A1 |
A measuring device includes a rotatable stage configured to receive and rotate an object long a rotational axis of the object. A housing is located adjacent to the rotatable stage and is movable along the rotational axis of the object. T...
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