REMOVER COMPOSITION FOR LIGHT IRRADIATION REMOVAL, MULTILAYER BODY, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE

Title:

REMOVER COMPOSITION FOR LIGHT IRRADIATION REMOVAL, MULTILAYER BODY, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE

Document Type and Number:

WIPO Patent Application WO/2024/062974

Kind Code:

A1

Abstract:

This remover composition for light irradiation removal contains a solvent and at least either a polymer or a compound that has a structure represented by formula (1) and a carbon content of 80% or less. (In formula (1), each of R1 and R2 independently represents a hydrogen atom, a cyano group, a phenyl group, an alkyl group having 1 to 13 carbon atoms, a halogen atom, -COOR11 (wherein R11 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms) or -COO-;　R3 represents a methoxy group, an alkyl group having 1 to 13 carbon atoms, or a halogen atom;　n1 represents an integer of 0 to 4; n2 represents 0 or 1; provided that the sum of n1 and n2 is 4 or less;　X1 represents an ether bond or an ester bond;　X2 represents an ether bond or an ester bond; and　the symbol * represents a bonding hand.)

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Inventors:

YAGYU MASAFUMI (JP)
SHINJO TETSUYA (JP)

Application Number:

PCT/JP2023/033176

Publication Date:

March 28, 2024

Filing Date:

September 12, 2023

Export Citation:

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Assignee:

NISSAN CHEMICAL CORP (JP)

International Classes:

H01L21/02; B32B27/36; C08G59/14; C08G63/00; C09D5/00; C09D167/00; C09D171/12; C09J7/30; C09J7/40; C09J201/00; H01L21/304; H01L21/683

Domestic Patent References:

WO2022102691A1	2022-05-19
WO2022186231A1	2022-09-09
WO2021256386A1	2021-12-23
WO2019088103A1	2019-05-09
WO2022210238A1	2022-10-06
WO2023100506A1	2023-06-08

Foreign References:

JP2006521567A	2006-09-21
JP2017082196A	2017-05-18
JP2013235962A	2013-11-21

Attorney, Agent or Firm:

TAKAOKA Ryoichi et al. (JP)

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