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Patent Searching and Data


Title:
CERAMIC SUBSTRATE AND METHOD FOR PRODUCING CERAMIC SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2024/062975
Kind Code:
A1
Abstract:
Provided are: a ceramic substrate which, even upon reception of a thermal shock, can be prevented from suffering a defect in the heat dissipation member or the ceramic layers or from suffering a defect around the interface between the heat dissipation member and a ceramic layer and can be inhibited from deteriorating in bending strength; and a method for producing the ceramic substrate. This ceramic substrate (1) comprises: a multilayer structure (10) comprising a plurality of superposed ceramic layers (11) and having an accommodation part (20) inside; and a heat dissipation member (30) disposed in the accommodation part (20). Along a direction (H) in which the heat dissipation member (30) extends, there is a first cavity (41) between at least some of the outer surface (31) of the heat dissipation member (30) and the inner wall surface (21) of the accommodation part (20).

Inventors:
KISHIMOTO ATSUSHI (JP)
KATO TOMOKI (JP)
INAOKA MASATO (JP)
NISHIKAWA HIROSHI (JP)
Application Number:
PCT/JP2023/033191
Publication Date:
March 28, 2024
Filing Date:
September 12, 2023
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/02; H01L23/12; H01L23/36; H05K3/46
Foreign References:
JPH1126942A1999-01-29
US20060269753A12006-11-30
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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