Title:
整列したウェーハ・ペアを取り扱うための装置およびシステム
Document Type and Number:
Japanese Patent JP6785062
Kind Code:
B2
Abstract:
An industrial-scale apparatus, system, and method for handling precisely aligned and centered semiconductor wafer pairs for wafer-to-wafer aligning and bonding applications includes an end effector having a frame member and a floating carrier connected to the frame member with a gap formed therebetween, wherein the floating carrier has a semi-circular interior perimeter. The centered semiconductor wafer pairs are positionable within a processing system using the end effector under robotic control. The centered semiconductor wafer pairs are bonded together without the presence of the end effector in the bonding device.
Inventors:
Hale Johnson
Gregory George
Gregory George
Application Number:
JP2016097183A
Publication Date:
November 18, 2020
Filing Date:
May 13, 2016
Export Citation:
Assignee:
Suss MicroTec Lithography GmbH
International Classes:
H01L21/677; H01L21/02
Domestic Patent References:
| JP2013162029A | ||||
| JP9205127A |
Attorney, Agent or Firm:
Takuji Yamada
Mitsuo Tanaka
Hiroshi Okabe
Mitsuo Tanaka
Hiroshi Okabe