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WO/2019/063193A1 |
A supercontinuum radiation source comprises: a radiation source, an optical amplifier and a non-linear optical medium. The radiation source is operable to produce a pulsed radiation beam. The optical amplifier is configured to receive th...
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WO/2019/063245A1 |
A method for determining one or more optimized values of an operational parameter of a sensor system configured for measuring a property of a substrate is disclosed the method comprising: determining a quality parameter for a plurality o...
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WO/2019/061714A1 |
A manufacturing method of a TFT array substrate comprises: providing a substrate; sequentially depositing, on a surface of the substrate, a gate metal layer, an insulation layer and a metal oxidation layer; forming a first metal layer on...
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WO/2019/060276A1 |
Aspects of the disclosure relate to augmented reality devices for generating a composite scene including a real-world test environment and an augmented reality overlay visually representing a test area of the environment. Some devices ca...
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WO/2019/059102A1 |
In the present invention, a silicon carbide semiconductor substrate (10) that is formed of silicon carbide monocrystals having a main surface in which an off-angle is disposed at the (0001) plane and having an off-direction of <11-20> is...
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WO/2019/060275A1 |
Aspects of the disclosure relate to demarcation templates for demarcating a test area on a test surface and for providing visual guidance to a user to precisely and accurately swab the test surface in order to determine the presence and/...
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WO/2019/052746A1 |
Methods and associated apparatus for reconstructing a free-form geometry of a substrate, the method comprising: positioning the substrate on a substrate holder configured to retain the substrate under a retaining force that deforms the s...
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WO/2019/048198A1 |
A lithographic apparatus comprising an illumination system for providing a beam of radiation, a support structure for supporting a patterning device, the patterning device serving to impart the radiation beam with a pattern in its cross-...
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WO/2019/048216A1 |
Disclosed herein is a target formed on a substrate, the target comprising: an alignment structure; and a metrology structure; wherein the alignment structure comprises structures that are arranged to generate a beat pattern when the alig...
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WO/2019/040299A1 |
Methods are provided that, in some embodiments that provide alignment of a first layer of a printing plate on a chuck. For example, in one embodiment, images of reference marks on a chuck are captured to determine the initial positions o...
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WO/2019/038400A1 |
A method for mounting one or more printing plate segments (402-407) on a carrier sheet (302). The method comprises importing a file into a computer (528) associated with a mounting unit (305, 350). For each printing plate segment (402-40...
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WO/2019/037672A1 |
A mask transfer system and transfer method, comprising an inner mask store (1) used for storing masks, a rotating mechanical arm used for moving the masks, and a mask fork (3) connected to the rotating mechanical arm and used for picking...
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WO/2019/039173A1 |
The present invention simplifies manufacture of an alignment mark of a semiconductor device. Provided is a semiconductor device that is provided with a semiconductor substrate, an epitaxial layer, and an alignment mark. The epitaxial lay...
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WO/2019/040582A1 |
In accordance with a method of forming a waveguide in a polymer film disposed on a substrate, a plurality of regions on a polymer film are selectively exposed to a first dosage of radiation. The polymer film is formed from a material hav...
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WO/2019/034318A1 |
An apparatus for determining a characteristic of a feature of an object comprises: a measurement radiation source; a measurement radiation delivery system; a measurement system; a pump radiation source; and a pump radiation delivery syst...
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WO/2019/015899A1 |
The present disclosure describes an apparatus (160) for determining information relating to at least one target alignment mark (114) in a semiconductor device substrate (110). The target alignment mark (114) is initially at least partial...
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WO/2019/011608A1 |
An inspection tool for inspecting a semiconductor substrate is described, the inspection tool comprising: - an substrate table configured to hold the substrate; - an electron beam source configured to project an electron beam onto an are...
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WO/2019/012495A1 |
[Problem] To improve the throughput performance and/or economy of a measurement apparatus. [Solution] This measurement apparatus is equipped with a first determination device, a second determination device, a first substrate stage config...
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WO/2019/011606A1 |
An inspection tool for inspecting a semiconductor substrate is described, the inspection tool comprising: - a substrate table configured to hold the substrate; - an electron beam source configured to project an electron beam onto an area...
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WO/2019/012499A1 |
A photomask alignment method for a manufacturing process of an integrated circuit in a semiconductor material wafer (20), the method envisaging: at a first level, defining, by means of a single photolithography process, at least one alig...
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WO/2019/011531A1 |
The present invention provides a method to obtain a height map of a substrate having alignment marks, the method comprising the steps: determining a height of one or more locations or areas of the substrate, and determining the height ma...
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WO/2019/007590A1 |
The invention relates to a method for revealing sensor targets on a substrate covered with a layer, said method comprising the following steps: determining locations of first areas on the substrate with yielding target portions and of se...
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WO/2019/001871A1 |
A method for determining substrate deformation has the steps: (a) obtaining (402) first measurement data (X i ) associated with mark position, from measurements of a plurality of substrates; (b) obtaining (404) second measurement data (X...
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WO/2019/005542A1 |
Methods and apparatuses are provided that determine an offset between actual feature/mark locations and the designed feature/mark locations in a maskless lithography system. For example, in one embodiment, a method is provided that inclu...
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WO/2019/001412A1 |
An optical path compensation device, comprising a wedge plate group (100), a driving mechanism (200) and a pre-tightening unit, wherein the wedge plate group includes a movable wedge plate (120) and a fixed wedge plate (100); the movable...
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WO/2018/224293A1 |
A system comprises a topography measurement system configured to determine a respective height for each of a plurality of locations on a substrate; and a processor configured to: determine a height map for the substrate based on the dete...
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WO/2018/226198A1 |
Apparatus (1600, 2900) and method (500, 2100) for aligning a rotatable substrate to a support mechanism (102, 1702) such as a turntable. The substrate has a circumferentially extending timing pattern (200, 1300, 1400, 1800, 1900, 2000, 2...
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WO/2018/224251A1 |
A method for determining a characteristic of a feature in an object, the feature being disposed below a surface of the object is disclosed. The surface of the object is irradiated with a pulsed pump radiation beam so as to produce an aco...
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WO/2018/219944A1 |
The invention relates to a method for aligning a second film (3) using a first code (1), which first code (1) is applied to an object (13), wherein the position of the first code (1) is defined by at least one detectable first code point...
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WO/2018/218214A1 |
Systems, apparatus, and methods for double-sided imprinting are provided. An example system includes first rollers for moving a first web including a first template having a first imprinting feature, second rollers for moving a second we...
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WO/2018/215703A1 |
The invention relates generally to a method for nanoimprint lithography making it possible to achieve high-precision alignment by automatically controlling all or some of the patterns of a structured mould (6) and a structured substrate ...
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WO/2018/215173A1 |
An alignment mark for determining a two-dimensional alignment position of a substrate is discussed. The alignment mark includes an array of patterns. The array of patterns includes a first set of patterns and a second set of patterns arr...
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WO/2018/210557A1 |
Methods and apparatus for measuring a target formed on a substrate are disclosed. The target comprises an alignment structure and a metrology structure. In one method, a first measurement process is performed that comprises illuminating ...
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WO/2018/210505A1 |
Disclosed is a metrology sensor apparatus comprising: an illumination system operable to illuminate a metrology mark on a substrate with illumination radiation; an optical collection system configured to collect scattered radiation, foll...
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WO/2018/206227A1 |
An overlay metrology target (600, 900, 1000) contains a plurality of overlay gratings (932-935) formed by lithography. First diffraction signals (740(1)) are obtained from the target, and first asymmetry values (As) for the target struct...
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WO/2018/206177A1 |
Disclosed is a metrology sensor apparatus and associated method. The metrology sensor apparatus comprises an illumination system operable to illuminate a metrology mark on a substrate with illumination radiation having a first polarizati...
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WO/2018/202394A1 |
Methods and apparatus for measuring a parameter of interest of a target structure formed on substrate are disclosed. In one arrangement, the target structure comprises a first sub-target and a second sub-target. The first sub-target comp...
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WO/2018/202414A1 |
A method including illuminating a product test substrate with radiation from a component, wherein the product test substrate does not have a device pattern etched therein and yields a non-zero sensitivity when illuminated, the non-zero s...
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WO/2018/196838A1 |
Disclosed is a silicon wafer processing device; a pre-aligned optical assembly (3) and an edge exposure assembly (5) are provided on a synchronous bi-directional motion module (4), reducing the occupied space of the device and saving the...
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WO/2018/192723A1 |
A metrology system includes a radiation source configured to generate measurement radiation having a plurality of temporally separated different wavelengths, an optical system configured to direct the measurement radiation towards a subs...
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WO/2018/172036A1 |
The invention relates to a metrology target. The invention further relates to a method and to a device for characterizing a structured element in the form of a wafer, a mask, or a CGH. According to one aspect, a metrology target has a pe...
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WO/2018/166738A1 |
A sensor mark (17) comprising: a substrate (200) having: a first deep ultra violet (DUV) absorbing layer (310, 320, 330) comprising a first material which substantially absorbs DUV radiation; a first protecting layer (600) comprising a s...
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WO/2018/169201A1 |
The present invention relates to an imprint device and an imprint method. The imprint device comprises: a transfer part for transferring a film-shaped mold in one or another direction, the film-shaped mold having a pattern formed on the ...
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WO/2018/166717A1 |
Disclosed is a method and control system for determining stress in a substrate. The method comprises determining a measured position difference between a measured position of at least one first feature and a measured position of at least...
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WO/2018/166462A1 |
A vertical control method for use in a lithography machine, comprising the following steps: step 1: before scanning exposure, controlling a vertical measurement sensor (5) to measure a material (6) to acquire data of the overall shape of...
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WO/2018/166444A1 |
Disclosed are a photoetching apparatus and method. The photoetching apparatus comprises at least two sets of exposure apparatus and one set of substrate apparatus, wherein the substrate apparatus comprises a substrate table (10) and a su...
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WO/2018/160778A1 |
A process control system includes a controller configured to generate a reference overlay signature based on one or more overlay reference layers of a sample, extrapolate the reference overlay signature to a set of correctable fields for...
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WO/2018/153711A1 |
A method, involving determining a first distribution of a first parameter associated with an error or residual in performing a device manufacturing process; determining a second distribution of a second parameter associated with an error...
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WO/2018/153671A1 |
Methods of measuring variation across multiple instances of a pattern on a substrate or substrates after a step in a device manufacturing process are disclosed. In one arrangement, data representing a set of images is received. Each imag...
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WO/2018/149777A1 |
The invention concerns a lithography process on a sample (2) comprising at least one structure (1) and covered by at least a lower layer (3) of resist and a upper layer (4) of resist the process comprising: thanks to an optical device (8...
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