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WO/2014/174352A1 |
The present invention is a method for accurately detecting a pattern formation position in a maskless exposure device. This maskless exposure device is equipped with a position detection unit having first and second photosensor groups th...
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WO/2014/155830A1 |
This lithographic device is provided with: an acquisition unit for acquiring coordinate data indicating first locations constituting the designed locations of a plurality of reference marks furnished on an exposed substrate, coordinate d...
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WO/2014/146906A2 |
A lithographic apparatus includes an alignment sensor including a self-referencing interferometer for reading the position of a mark comprising a periodic structure. An illumination optical system focuses radiation of different colors an...
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WO/2014/139855A1 |
The invention provides a patterning device, for use in forming a marker on a substrate by optical projection, the patterning device comprising a marker pattern having a density profile that is periodic with a fundamental spatial frequenc...
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WO/2014/134888A1 |
Provided are a substrate alignment mark and a manufacturing method therefor, and a substrate. The substrate alignment mark comprises a first alignment mark pattern (1) and a second alignment mark pattern (2) which are located on differen...
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WO/2014/127568A1 |
A preparation method for a multi-film layer substrate comprises: forming a first film layer on a substrate and forming a set of alignment marks in an alignment area of the first film layer; and successively forming a plurality of subsequ...
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WO/2014/123030A1 |
Provided are a photomask capable of suppressing the incidence of exposure flaws even when deformation occurs during the exposure process, a method for manufacturing the photomask, and an exposure apparatus. Pattern regions on which a pre...
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WO/2014/120082A1 |
A positioning system having a flat base comprising (i) a X-axis assembly having a X-axis linear actuator means arranged orthogonal to the Y-axis; (ii) a Y-axis assembly having a pair of Y-axis linear actuator means mounted onto the flat ...
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WO/2014/106557A1 |
The chuck for aligning a first planar substrate, e.g. a wafer, in parallel to a second planar substrate, e.g. a mask, comprises: a top plate having a top surface for arrangement of the first planar substrate, a bottom plate, at least one...
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WO/2014/089895A1 |
A method and clamp for gluing a detection board assembly. The method for gluing a detection board assembly includes: ① setting an ultraclean workroom and an ultraclean workbench; ② wiping a reference board protective glass cover (6) ...
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WO/2014/076009A2 |
A grating for a position measurement system, the grating including a first array of grating lines in a first direction and a second array of grating lines in a second direction. The first and second arrays diffract a measurement beam inc...
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WO/2014/067148A1 |
A method and apparatus for post-printing processing of post-printing transfer or composite sheet cutting, comprising: printing a machine visual identification mark (212) either around patterns (211, 214, and 215) that are to be retained ...
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WO/2014/068116A1 |
A lithographic apparatus includes a sensor, such as an alignment sensor including a self-referencing interferometer, configured to determine the position of an alignment target comprising a periodic structure. An illumination optical sys...
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WO/2014/066997A1 |
A method for fabricating an anti-fuse memory cell having a semiconductor structure with a minimized area. The method includes providing a reference pattern for the semiconductor structure, and applying a reverse OPC technique that includ...
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WO/2014/070444A1 |
In accordance with an embodiment of the disclosure, a method of patterning can include dividing an image into a set of frame sections; determining a tip pattern for a respective portion of an image to be patterned by each tip of the tip ...
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WO/2014/064290A1 |
The invention relates to a substrate (12, 513) comprising an optical position mark (100) for being read-out by an optical recording head (500) for emitting light of predetermined wavelength, preferably red or infra-red light, more in par...
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WO/2014/060149A1 |
A sensor system to measure a physical quantity, the system including a parallel detection arrangement with multiple detectors to allow measurements in parallel at different spatial locations, wherein the multiple detectors share a noise ...
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WO/2014/059811A1 |
Disclosed is an off-axis alignment system, which comprises a lighting module (10), an interference module (20) and a detection module (30) in sequence in accordance with a beam propagation path, wherein the interference module (20) compr...
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WO/2014/057246A1 |
There is herein described a method and apparatusfor positioning a phototool. More particularly, there is described a method and apparatus for accurately positioning a phototool capable of photoimaging a substrate (e.g. a web) covered wit...
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WO/2014/056708A2 |
An apparatus to measure the position of a mark, the apparatus including an illumination arrangement to direct radiation across a pupil of the apparatus, the illumination arrangement comprising an illumination source to provide multiple-w...
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WO/2014/053334A1 |
An apparatus to measure the position of a mark, the apparatus including an objective lens to direct radiation on a mark using radiation supplied by an illumination arrangement; an optical arrangement to receive radiation diffracted and s...
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WO/2014/048211A1 |
Disclosed are a position matching structure and a position matching method for a two-sided stepper. The position matching structure comprises a primary "+" shaped position matching mark (10), and some secondary position matching marks (2...
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WO/2014/034161A1 |
Provided are: a substrate base provided with a surface for supporting, in a flat state or a curved state having a prescribed curve, a flexible and transmissive substrate to be optically treated; and a film formed on the surface of the su...
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WO/2014/032833A1 |
A deformation pattern recognition method including providing one or more deformation patterns, each deformation pattern being associated with a deformation of a substrate that may be caused by a processing device; transferring a first pa...
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WO/2014/027289A1 |
The present invention relates to handling misalignment in differential phase contrast imaging. In order to provide an improved handling of misalignment in X-ray imaging systems for differential phase contrast imaging, an X-ray imaging sy...
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WO/2014/027483A1 |
In the present invention, coordinate data indicating the first positions in a design of a plurality of reference marks that are provided to a substrate to be exposed, coordinate data indicating a drawing pattern to be drawn on the substr...
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WO/2014/027484A1 |
In the present invention, the first positions in a design of a plurality of reference marks that are provided to a substrate, a drawing pattern to be drawn on the substrate that is set using the first positions as a reference, and coordi...
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WO/2014/027333A1 |
The present invention relates to differential phase contrast imaging and the aspects in relation with misalignment. In order to provide differential phase contrast imaging with reduced sensitivity to slight unwanted displacement of the d...
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WO/2014/026819A2 |
A lithographic apparatus includes an alignment sensor including a self-referencing interferometer for reading the position of an alignment target comprising a periodic structure. An illumination optical system for focusing radiation into...
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WO/2014/019846A2 |
An apparatus for measuring positions of marks on a substrate, includes an illumination arrangement for supplying radiation with a predetermined illumination profile across a pupil of the apparatus, an objective lens for forming a spot of...
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WO/2014/016139A1 |
An EUV light source (2) for a projection exposure apparatus (1) for EUV projection lithography comprises a first electron beam device in the form of an electron beam supply device (2a). The light source (2) furthermore includes an EUV ge...
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WO/2014/010593A1 |
A method for forming a mark includes: a step for forming a resist mark containing a concave section on the basis of a mark image exposed on a wafer; a step for applying a polymer layer containing a block copolymer in the concave section ...
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WO/2014/010233A1 |
A composite variable (Xc = αX2 + βX1) is found using gains (or transmission coefficients) (α, β) that correspond to measurement results (X2, X1) of first and second measuring instruments, and a composite control variable (Xmix = F1(X...
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WO/2014/002794A1 |
The purpose of the present invention is to provide a method for manufacturing a thin film laminated element, wherein alignment marks having less damage can be used for the purpose of aligning a photomask at the time of performing etching...
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WO/2013/185605A1 |
An alignment mark and a fabrication method thereof. The alignment mark is fabricated by using an anisotropic etching technology. Because the etching rates of anisotropic etching on different crystal planes of a wafer are inconsistent, a ...
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WO/2013/182562A1 |
The technology disclosed relates to patterning of flexible substrate. One implementation can be applied for production of flexible displays and other electronic devices on flexible substrates. The substrate may be plastic film typically ...
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WO/2013/177874A1 |
An alignment identifier comprises N alignment marks. The N alignment marks are disposed on N mask plates respectively. A first alignment mark (7) comprises a first sub-mark (11) and a second sub-mark (12). The first sub-mark (11) and the...
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WO/2013/170725A1 |
Provided is a fabrication method for a semiconductor device (10). The method comprises: a deposition step of a dielectric layer (112, 121) of a plurality of functional layers (110, 120), a formation step of a contact hole (114) or a thro...
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WO/2013/160016A1 |
A lithography apparatus and device manufacturing methods are disclosed. A lithography apparatus includes a support stage (16), and a measurement system (12-14) including a sensor part (13) and a reference part (12, 14), the measurement s...
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WO/2013/150007A2 |
A method for measuring a distance (d) between a reference plane (1) and a measurement plane (3) parallel to the reference plane (1) is specified, in which at least one axial focus (5) which is inclined at an angle α in relation to an ax...
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WO/2013/145798A1 |
An exposure writing device is provided with: a first exposure means for writing a circuit pattern on a first face by exposure of the first face of a printed wiring board arranged on a stage; a mark forming means, arranged in a manner so ...
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WO/2013/145986A1 |
Provided are an exposure writing device and an exposure writing method whereby degradation of the quality of marks provided for the purpose of positional alignment of the front and rear faces, caused by warping or floating etc. of the en...
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WO/2013/146184A1 |
A substrate processing device is provided with: a rotational cylindrical member (DR) that has a cylindrical support surface curved at a fixed radius from a prescribed center line (AX2) and feeds a substrate (P) in the longitudinal direct...
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WO/2013/137358A1 |
The present invention can easily measure the resolution of an image sensor for adjusting and exposure position in an exposure device. A mask for calibration is provided with: a mask part provided with an image acquisition window for acqu...
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WO/2013/126153A1 |
Forming an alignment mark on a semiconductor structure using an optical lithography to form a metal alignment mark on a substrate of the structure, using the formed metal alignment mark to form a first feature of a semiconductor device b...
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WO/2013/110664A1 |
A method of calculating an overlay correction model in an apparatus for the fabrication of a wafer comprising a structural pattern on a substrate and having first overlay marks generated in a first layer and second overlay marks in a sec...
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WO/2013/107698A1 |
The invention relates to a sample positioning device (23, 24, 25) with a sample holder (14, 22) on which a sample (5) can be mounted, wherein the sample holder can be rotated about a first axis (1a) by means of a first rotational device ...
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WO/2013/105317A1 |
In a substrate processing device, the pattern of a mask (M) is formed on the light sensitive layer of a bendable elongated substrate (S). The substrate processing device is provided with: a mask holding unit (52) which is cylindrically f...
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WO/2013/102351A1 |
A transparent and clamped pre-alignment machine comprises a base (1), a clamping jaw (2) installed on the base (1) and a sensor (4) to detect the notch (13) on a round wafer (12). The clamping jaw (2) consists of at least two clamping ja...
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WO/2013/087431A2 |
Disclosed is a device manufacturing method, and accompanying inspection and lithographic apparatuses. The method comprises measuring on the substrate a property such as asymmetry of a first overlay marker and measuring on the substrate a...
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