Title:
MARK, METHOD FOR FORMING SAME, AND EXPOSURE APPARATUS
Document Type and Number:
WIPO Patent Application WO/2014/010593
Kind Code:
A1
Abstract:
A method for forming a mark includes: a step for forming a resist mark containing a concave section on the basis of a mark image exposed on a wafer; a step for applying a polymer layer containing a block copolymer in the concave section of the region where the resist mark is formed; a step for forming a self-assembling region using annealing on the polymer layer; a step for selectively removing a portion of the self-assembling region using etching; and a step for forming a wafer mark on the wafer using the partially removed self-assembling region. When forming a circuit pattern using the self-assembly of the block copolymer, marks can be formed in parallel.
Inventors:
SHIBA YUJI (JP)
FUJIWARA TOMOHARU (JP)
MAGOME NOBUTAKA (JP)
FUJIWARA TOMOHARU (JP)
MAGOME NOBUTAKA (JP)
Application Number:
PCT/JP2013/068752
Publication Date:
January 16, 2014
Filing Date:
July 09, 2013
Export Citation:
Assignee:
NIKON CORP (JP)
International Classes:
H01L21/027; B82Y40/00; G03F9/00
Foreign References:
| JP2008311571A | 2008-12-25 | |||
| JP2009147317A | 2009-07-02 | |||
| JP2011249817A | 2011-12-08 | |||
| JP2011238919A | 2011-11-24 | |||
| JP2010098008A | 2010-04-30 |
Attorney, Agent or Firm:
OMORI SATOSHI (JP)
Omori 聡 (JP)
Omori 聡 (JP)
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