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WO/2003/042721A2 |
A method for fabricating a trilayered beam MEMS device includes depositing a sacrificial layer (310) on a substrate and depositing and removing a portion of a first conductive layer on the sacrificial layer (310) to form a first conducti...
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WO/2003/043095A2 |
An anchor system for securing a MEMS device (10) to a substrate comprising multiple anchors (30). A MEMS structure, built in accordance with the one embodiment of the invention, comprises a flexible beam (15) suspended over a substrate (...
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WO/2003/043042A1 |
MEMS device (100) having an electrothermal actuator (126) and release and a method for fabrication. According to one embodiment, a microscale switch (100) is provided and can include a substrate (102) and a stationary electrode (106) and...
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WO/2003/040338A2 |
A micro-scale interconnect device with internal heat spreader and method for fabricating same. The device includes first and second arrays of generally coplanar electrical communication lines. The first array is disposed generally along ...
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WO/2003/041133A2 |
Electrothermal Self-Latching MEMS Switch and Method. According to one embodiment, a microscale switch (100) having a movable microcomponent (108) is provided and includes a substrate (102) having a stationary contact (104). The switch (1...
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WO/2003/034457A2 |
A high life cycle and low voltage MEMS device. In an aspect of the invention, separate support posts (26) are disposed to prevent a suspended switch pad (12) from touching the actuation pad (16) while permitting the switch pad (12) to gr...
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WO/2003/032349A1 |
A micromechanical switch (1) is disclosed together with a method of manufacturing the same. The micromechanical switch comprises a beam (13) at least partially suspended above a planar substrate (10); two control electrodes (12, 19), one...
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WO/2003/032092A1 |
A method of planarizing a circuit surface is disclosed. The basic idea is to use the photoresist mask for etching as the mask for lift-off, i.e. after the substrate is patterned with photoresist and dry etched, metal is directly deposite...
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WO/2003/028059A1 |
A micro-electromechanical system (MEMS) switch (124) formed on a substrate (110), the switch comprising a transmission line (114) formed on the substrate, a substrate electrostatic plate (120) formed on the substrate, and an actuating po...
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WO/2003/028058A1 |
A micromechanical switch is disclosed comprising a conductive beam (14, 14') partially suspended above a substrate (10), at least one contact electrode (12, 12') adjacent the conductive beam and at least one control electrode (13, 13') a...
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WO2002010684A9 |
A three axis MEM tunneling/capacitive sensor and method of making same. Cantilevered beamstructures for at least two orthogonally arranged sensors and associated mating structures aredefined on a first substrate or wafer, the at least tw...
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WO/2003/023805A1 |
A MEMS (Micro Electro Mechanical System) electrostatically operated high voltage switch or relay device is provided. These devices can switch high voltages while using relatively low electrostatic operating voltages. The MEMS device comp...
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WO/2003/021613A2 |
Electromechanical circuits, such as memory cells, and methods for making same are disclosed. The circuits include a structure having electrically conductive traces (104) and supports (102) and nanotube ribbons (105) suspended by the supp...
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WO/2003/017722A2 |
The organic MEMS according to the present invention comprises a polymeric substrate (12) comprising a substrate surface (16) including a first region (2) and a second region (24). A polymer coating (26) is applied to the first region to ...
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WO/2003/015128A2 |
A micro-electro-mechanical (MEM) switch (100) formed on a substrate (120) allows switching of various types of electrical conductor structures. The switch (100) contains a tilting cantilever arm (116), which tilts around central points o...
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WO/2003/012811A1 |
An array apparatus has a micromachined SOI structure (22), such as a MEMS array, mounted directly on a class of substrate (24), such as low temperature co-fired ceramic, in which is embedded electrostatic actuation electrodes (26-29) dis...
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WO2001088837A9 |
The present invention provides a pressure based fingerprint image capture device that includes an array of cantilevers or simply suspended bridges, with each pressure based sensor having a cantilever or a simply suspended bridge in conta...
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WO2002096166A9 |
A phased-array antenna system and other types of radio frequency (RF) devices and systems using microelectromechanical switches ("MEMS") and low-temperature co-fired ceramic ("LTCC") technology and a method of fabricating such phased-arr...
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WO/2002/099929A1 |
Method and apparatus for actuating switches in a reconfigurable antenna array. Micro electro-mechanical system (MEMS) switches span gaps between antenna elements disposed on an antenna substrate. An integrated optic waveguide network whi...
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WO/2002/096796A2 |
A micro-electro-mechanical switch (10, 110, 210) is known as a MEMS, and includes a base section (13, 14, 17-18) having two spaced conductive posts (17, 18), A conductive part (22) is provided between the posts, and is covered by a diele...
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WO2002058089A9 |
A bistable structure provided by the invention is characterized as including a deflection element that has mechanically constrained end points and a compliant span between the end points that is substantially free to deflect between two ...
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WO/2002/091556A1 |
The invention concerns an electrostatic actuator produced in part of a wafer made of conductive material (1) comprising a comb of parallel mobile blades (3) extending orthogonal to the upper surface of the wafer, and a comb of fixed blad...
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WO/2002/089251A1 |
A method and apparatus for reconfiguring an antenna array by optical control of MEMSswitches. A light source is provided to direct light to individual optically sensitive elementswhich control delivery of actuating bias voltage to the ME...
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WO2002063657A9 |
A microelectronic mechanical systems (MEMS) switch includes a vane formed over a substrate for electrically coupling an input line to an output line formed on the substrate. The vane includes flexible hinges, which support the vane from ...
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WO/2002/079077A1 |
Characteristics of micro electromechanical switches can be canged according to the invention by applying a control signal which either changes one or more parameters of the micro electromechanical switches or which controls beam movement...
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WO/2002/080207A1 |
A micro-machined radio frequency (RF) switch is described. The micro-machined RF switch includes a substrate, a moveable micro-machined cantilever supported by the substrate, and an actuation mechanism that causes the cantilever to switc...
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WO/2002/079078A1 |
A micro electromechanical switch structure with a continuously controllable beam. The beam is continuously controllable by adding an actuation electrode proximate to, but outside a beam projection. The beam projection is onto and perpend...
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WO/2002/079079A1 |
A micro electromechanical N-way switch comprising normally open micro electromechanical switches and normally closed micro electromechanical switches arranged in up to 2?c¿ rows with C columns of a logical functions matrix. Each row of ...
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WO/2002/079076A1 |
MEMS devices include a substrate, an anchor attached to the substrate, and a multilayer member attached to the anchor and spaced apart from the substrate. The multilayer member can have a first portion that is remote from the anchor and ...
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WO/2002/073691A1 |
An in-situ cap for an integrated circuit device (10) such as a micromachined device and a method of making such a cap (40) by fabricating an integrated circuit element (122) on a substrate (14) ; forming a support layer (124) over the in...
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WO/2002/073645A1 |
A torsion spring for an electro-mechanical switch is presented. The torsion spring comprises a set of tines including at least one tine extending from the free end of the armature of a switch. A terminus portion is rotatably suspended be...
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WO/2002/061781A1 |
A switch (10) for connecting a first terminal and a second terminal electrically. The switch (10) comprises a first terminal (46), a second terminal (26) and a third terminal (28) facing the first terminal (46), means (70) for driving th...
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WO/2002/059977A2 |
Apparatus for a micro-electro-mechanical switch that provides single pole, double throw switching action. The switch comprises a single RF input line and two RF output lines. The switch additionally comprises two armatures, each mechanic...
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WO/2002/055431A2 |
RF MicroElectroMechanical Systems (MEMs) circuitry (15) on a first high resistivity substrate (17) is combined with circuitry (11) on second low-resistivity substrate (13) by overlapping the first high resistivity substrate (17) and MEMs...
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WO/2002/054528A1 |
Disclosed is a device comprising a capacitor (200) having a varying capacitance t C (U) for modifying the impedance of a section of a co-planar wave guide, which can be especially used as a high-frequency microswitch. A mass line (110, 1...
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WO/2002/044033A2 |
A MEMS device (400) and method of making same is disclosed. In one embodiment, a micro-switch includes a base assembly (220) comprising a movable structure (230) bearing a contact pad (234). The base assembly (220) is wafer-scale bonded ...
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WO/2002/039472A1 |
A MEM relay device includes a flexible multi-point contact system with a self-aligning structure. The inventive relay includes a first signal contact electrically connected to a first set of flexible electrically conductive signal teeth ...
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WO/2002/033777A1 |
The invention relates to a device comprising a capacitor (200) for altering the impedance of a section of a coplanar waveguide, whereby the capacitance of the capacitor (200) can be altered. The capacitor (200) comprises, at least in par...
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WO/2002/029364A1 |
The invention relates to a sensor device, especially a threshold value sensor device comprising a sensor system for detecting an external measuring quantity, a switching system being provided for connecting a load circuit. Until now, the...
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WO/2002/017342A1 |
The microswitch is produced from a mainly sheet-like substrate and comprises at least the following components: a contact piece (7, 9) fixed to the substrate, a movable contact piece (6), which electrically contacts the fixed contact pie...
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WO2001003208A9 |
Electrical devices comprised of nanoscopic wires are described, along with methods of their manufacture and use. The nanoscopic wires can be nanotubes, preferably single-walled carbon nanotubes. They can be arranged in crossbar arrays us...
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WO/2002/012114A2 |
A microelectromechanical structure having a ceramic substrate formed from low temperature co-fired ceramic sheets. A low loss photodefinable dielectric planarizing layer is formed over one surface of the ceramic substrate. This layer can...
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WO/2002/010063A2 |
A method of making a micro electo-mechanical switch or tunneling sensor. A cantilevered beamstructure and a mating structure are defined on an etch stop layer on a first substrate or wafer;and at least one contact structure and a mating ...
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WO/2002/011188A2 |
A method of making a micro electro-mechanical switch or tunneling sensor. A cantilevered beamstructure and a mating structure are defined on a first substrate or wafer; and at least one contactstructure and a mating structure are defined...
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WO/2002/011232A1 |
The invention relates to a device comprising a capacitor (200) for altering the impedance of a section of a coplanar waveguide. According to the invention, the capacitance of the capacitor (200) can be altered, the signal line (120) of t...
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WO/2002/011189A2 |
A method of making a micro electro-mechanical switch or tunneling sensor. A cantilevered beam structure and a mating structure are defined on a first substrate or wafer; and at least one contact structure and a mating structure are defin...
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WO/2002/009224A1 |
An RF phase shifter circuit includes first and second RF ports (104, 106), and a switch circuit comprising a plurality of micro-electro-mechanical ('MEM') switches (50A-50D) responsive to control signals. The switch circuit is arranged t...
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WO/2002/001584A1 |
A microelectomechanical switch (600) is disclosed comprising a conductor (104), a dielectric layer (108) disposed on the conductor, a metal cap (110) disposed on the dielectric layer and a bridge (102) disposed proximate to the metal cap...
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WO/2001/082467A2 |
Several MEMS-based methods and architectures which utilize vibrating micromechanical resonators in circuits to implement filtering, mixing, frequency reference and amplifying functions are provided. A method and apparatus are shown for g...
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WO/2001/082476A2 |
Several MEMS-based methods and architectures which utilize vibrating micromechanical resonators in circuits to implement filtering, mixing, frequency reference and amplifying functions are provided. For example, a method and apparatus fo...
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