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WO/2023/022185A1 |
Provided is an adhesive sheet that has an adhesive agent layer which is curable by active energy rays and in which a reduction in hardness is suppressed by including a curable component. The provided adhesive sheet comprises an adhesive ...
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WO/2023/022027A1 |
The purpose of the present invention is to provide a polarizing film equipped with an adhesive layer that has a separator, the film being conductive and achieving both a separator that can easily be separated and an adhesive layer that i...
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WO/2023/017831A1 |
The present invention relates to a method for expanding a pressure-sensitive adhesive sheet which comprises a substrate and a pressure-sensitive adhesive layer, wherein at least one layer included in the pressure-sensitive adhesive sheet...
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WO/2023/017832A1 |
The present invention relates to a method for manufacturing a semiconductor device using an adhesive sheet for semiconductor processing having a base material, an intermediate layer, and an adhesive layer in that order, one or more layer...
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WO/2023/013529A1 |
A connector manufacturing method with excellent production efficiency is provided. This connector manufacturing method involves processes 1 and 2 below. Step 1: a step in which a coating liquid for a conductive adhesive agent layer, wh...
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WO/2023/013387A1 |
A composition for bonding that comprises component (A), which is a first polymerizable monomer, component (B), which is a rubber component, component (C), which is a polymer component having a first reactive functional group, and compone...
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WO/2023/013651A1 |
A bonding method for bonding an adherend (120) with an adhesive (11) for high-frequency dielectric heating, the bonding method comprising a placement step in which the electrodes of a dielectric heater (50), the adherend (120), and a spa...
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WO/2023/013400A1 |
The present invention provides an adhesive that can obtain both a high refractive index and flexibility. Provided is an adhesive having a refractive index of 1.55 or more and a storage modulus G' (0°C) at 0°C in the range of 1.0×104 P...
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WO/2023/007982A1 |
The present invention provides: a novel phosphorus compound having an isocyanurate ring; a synthetic method for said phosphorus compound; a flame retardant containing said phosphorus compound; and a resin composition containing said phos...
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WO/2023/007947A1 |
This mold release film comprises a base material layer and an adhesive layer, wherein the thickness of the adhesive layer is 4-30% of the total thickness of the base material layer and the adhesive layer, and the thickness of the base ma...
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WO/2023/008542A1 |
The present invention aims to provide a curable resin composition that has excellent curing characteristics and a high refractive index for cured products. In addition, the present invention aims to provide a sealant for display elements...
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WO/2023/002981A1 |
The present invention provides: an adhesive composition which is capable of forming an adhesive layer that has a low dielectric constant and a low dielectric loss in a high frequency band, while having dielectric characteristics that are...
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WO/2023/002970A1 |
Provided is a curable adhesive composition comprising a binder resin (A) having a reactive functional group, a poly(phenylene ether) resin (B) having a vinyl group and a number-average molecular weight of 1,500 or higher but lower than 5...
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WO/2023/002982A1 |
Provided are: a pressure-sensitive adhesive agent composition capable of forming a pressure-sensitive adhesive agent layer that has low dielectric constant and dielectric loss at a high frequency band, that is unlikely to be affected by ...
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WO/2023/286576A1 |
The present invention aims to provide a novel polarizing plate that: has an adhesive layer formed from an adhesive that has sufficient pot life during production; and suppresses reduction in transmittance when exposed to high-temperature...
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WO/2023/286575A1 |
The purpose of the present invention is to provide a polarizing plate having a hard coat layer on the surface such that even when the polarizing plate and a transparent member are bonded together by a UV-curable silicone adhesive composi...
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WO/2023/286681A1 |
A tape laminate is provided which, when used to seal a flow path, enables suppressing gas leakage and contamination while not being prone to peeling due to gas generation. This tape laminate 1 is provided with: a first substrate 2; a f...
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WO/2023/286757A1 |
The present invention addresses the problem of providing an adhesive agent composition having excellent nanocellulose dispersing ability. Said problem can be solved by an adhesive agent composition containing nanocellulose and a resin th...
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WO/2023/281861A1 |
[Problem] To provide a protective sheet for semiconductor processing that sufficiently suppresses electrostatic charge generated during processing of a wafer, even if the wafer is being thinned by DBG or the like, and that inhibits crack...
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WO/2023/282008A1 |
The present invention provides a double-sided adhesive sheet that has excellent impact resistance and excellent reworkability. A double-sided adhesive sheet 1 comprises an adhesive layer 2. The thickness of the double-sided adhesive sh...
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WO/2023/281215A1 |
The invention relates to 1) a crosslinkable adhesive composition comprising: at least one polymer (A) comprising a hydrolysable alkoxysilane group; at least one tackifying resin (B); at least one fumed silica (C), preferably hydrophic; a...
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WO/2023/281860A1 |
[Problem] To provide: a protective sheet for semiconductor processing, the protective sheet being suppressed in breakage of a wafer when the protective sheet for semiconductor processing is removed therefrom even in cases where the wafer...
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WO/2023/281996A1 |
The present invention addresses the problem of providing an adhesive tape for wafer processing that combines tensile stress and uniform expandability suitable for a step of dividing an adhesive layer by expansion, and high shrinkability ...
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WO/2023/281859A1 |
[Problem] To provide a protective sheet for semiconductor processing, the protective sheet being suppressed in the occurrence of a crack in a chip when the protective sheet is removed from the chip even in cases where a wafer is processe...
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WO/2023/282310A1 |
The present invention provides an adhesive tape which is able to be removed by heating in a short time, while being capable of preventing thermal damage to an adherend, and which is removed by heating by an easy operation. The present ...
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WO/2023/281858A1 |
[Problem] To provide a protective sheet for semiconductor processing that sufficiently suppresses an electrostatic charge produced during processing of a wafer and suppresses cracking of chips during peel-off, even when the wafer is proc...
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WO/2023/282311A1 |
The present invention provides an adhesive tape which is able to be removed by heating in a short time, while being capable of excellently preventing thermal damage to an adherend. The present invention provides an adhesive tape which ...
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WO/2023/281216A1 |
The invention relates to: (1) A cross-linkable adhesive composition comprising: - at least one polymer (A) comprising a hydrolysable alkoxysilane group; - at least one tackifying resin (B); - at least one fumed silica (C), preferably hyd...
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WO/2023/276304A1 |
A polarizing plate according to the present invention includes at least an optical film, an adhesive layer, and a polarizer layer, wherein: the optical film contains at least a cycloolefin polymer having a polar group; the half width of ...
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WO/2023/276936A1 |
Provided is a polarizing film in which a transparent protective film is stacked on at least one surface of a polarizer with an adhesive layer therebetween, the polarizing film being characterized in that in at least part of the polarizer...
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WO/2023/277184A1 |
The present invention provides a star polymer which has an arm section derived from an arm polymer obtained by polymerizing a vinyl monomer, and a core section containing a structure derived from a polyfunctional alkenyl compound for cro...
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WO/2023/276931A1 |
Provided is a polarizing film in which a transparent protective film is laminated on at least one surface of a polarizer with an adhesive layer interposed therebetween. The polarizer has a non-polarizing part having a recess formed on on...
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WO/2023/276638A1 |
A method for producing a multilayer body that comprises two silicon substrates, the method comprising a novel process for bonding the two silicon substrates. A method for producing a multilayer body that comprises two silicon substrates,...
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WO/2023/276932A1 |
Provided is a polarizing film in which a first transparent protective film is layered on one surface of a polarizer via a first adhesive layer. A non-polarizing part is formed in at least a portion of the polarizer, and the polarizer sat...
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WO/2022/270502A1 |
The present invention provides an optical multilayer body which is obtained by stacking a reflective polarizer and an absorptive polarizer, and which has high image sharpness in a virtual reality display device to which this optical mult...
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WO/2022/271839A1 |
Some embodiments of the present disclosure are directed to a composite roofing membrane. In some embodiments, the composite roofing membrane comprises a roofing membrane and a roofing composite. In some embodiments, the roofing composite...
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WO/2022/271850A1 |
In some embodiments, roofing systems and methods thereof are disclosed. In some embodiments, the roofing system includes a roofing substrate comprising concrete and a top surface. In some embodiments, the roofing system includes a roofin...
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WO/2022/270556A1 |
This method for producing an optical multilayer body comprises: a step A for preparing a first optical sheet that has a first main surface having a relief structure; a step B for preparing an adhesive layer; and a step C for bonding the ...
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WO/2022/270008A1 |
Provided is an adhesive sheet for semiconductor element fabrication that can protect a semiconductor element from electrostatic destruction due to peeling electrification and frictional electrification even when the semiconductor element...
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WO/2022/265074A1 |
This adhesive film contains a thermoplastic resin, wherein the tanδ maximum peak temperature is 0-52°C, the shear storage elastic modulus at 20°C is 3×105 Pa or greater and the proportion of undissolved components when 1.0 g of an ea...
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WO/2022/265073A1 |
This adhesive film includes a thermoplastic resin, does not include a plasticizer or includes less than 20 parts by mass of a plasticizer per 100 parts by mass of the thermoplastic resin, has a shear storage modulus of 3×105 Pa or great...
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WO/2022/264860A1 |
The present invention provides an adhesive sheet with which concealment of an adherend and superior blocking of infrared rays is possible. Provided is an adhesive sheet having an adhesive layer. The adhesive layer includes an infrared ab...
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WO/2022/264546A1 |
This electroconductive sheet comprises a binder resin and electroconductive particles, and has a 70°C viscosity of 10-10,000 kPa·s and a 70°C elongation at break of 110% or higher.
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WO/2022/264560A1 |
The present invention is repair tape used to repair LED chips installed in a micro LED display, the repair tape comprising: an elongated first tape material 2 which can be wound into a roll shape and has, on one surface thereof, an adhes...
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WO/2022/259852A1 |
The present invention provides adhesive tape for bicycle rims which has favorable workability. The adhesive tape for bicycle rims is an adhesive sheet to be used for blocking spoke holes in a bicycle rim, said adhesive sheet comprising a...
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WO/2022/255308A1 |
The purpose of the present invention is to provide a UV-curable adhesive composition having excellent printability, UV reactivity in the presence of oxygen, and adhesiveness with respect to a variety of types of base materials. Another p...
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WO/2022/255321A1 |
Disclosed is an integrated dicing/die bonding film which comprises a base layer, one or more pressure-sensitive adhesive layers including an ultraviolet-curable pressure-sensitive adhesive layer comprising an ultraviolet-curable pressure...
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WO/2022/255132A1 |
(Problem) To provide a layered body capable of preventing formation of air bubbles in an adhesive agent layer or escape of an adhesive agent therefrom even when being repeatedly bent so as to have the back surface layer side thereof loca...
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WO/2022/255078A1 |
Provided is a resin composition for adhesive films which has a low dielectric loss and nevertheless attains a sufficient adhesion strength and which can give adhesive films inhibited from suffering resin flow. The resin composition compr...
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WO/2022/255131A1 |
[Problem] To provide a multilayer body which is capable of suppressing the occurrence of adhesive omission or air bubbles in an adhesive layer even in cases where the multilayer body is repeatedly bent under high temperature conditions, ...
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