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Title:
ADHESIVE FILM, AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2022/265074
Kind Code:
A1
Abstract:
This adhesive film contains a thermoplastic resin, wherein the tanδ maximum peak temperature is 0-52°C, the shear storage elastic modulus at 20°C is 3×105 Pa or greater and the proportion of undissolved components when 1.0 g of an early adhesive film is dissolved using 10 g of isopropyl alcohol is 35-100 mass%.

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Inventors:
OOHIGASHI YUJI (JP)
ISHIKAWA YUKI (JP)
TERAGUCHI YUMIKO (JP)
KAMOSHIDA NAOKI (JP)
OKADA YUUKI (JP)
URADOKORO KANAKO (JP)
Application Number:
PCT/JP2022/024191
Publication Date:
December 22, 2022
Filing Date:
June 16, 2022
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
B32B17/10; B32B27/00; B32B27/30; C03C27/12; C09J7/38; C09J129/14; C09J201/00; G02B5/30; G02F1/13; G02F1/1335
Domestic Patent References:
WO2014148360A12014-09-25
WO2016158694A12016-10-06
WO2017061545A12017-04-13
Foreign References:
JP2019065166A2019-04-25
JP2015025042A2015-02-05
JP2017149956A2017-08-31
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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