Title:
CURABLE ADHESIVE COMPOSITION AND CURABLE ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2023/002970
Kind Code:
A1
Abstract:
Provided is a curable adhesive composition comprising a binder resin (A) having a reactive functional group, a poly(phenylene ether) resin (B) having a vinyl group and a number-average molecular weight of 1,500 or higher but lower than 5,000, and a polyfunctional compound (C) having two or more unsaturated hydrocarbon groups each having a double bond at the end.
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Inventors:
NISHIJIMA KENTA (JP)
KASHIO MIKIHIRO (JP)
KASHIO MIKIHIRO (JP)
Application Number:
PCT/JP2022/027985
Publication Date:
January 26, 2023
Filing Date:
July 19, 2022
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J4/00; C09J7/35; C09J11/04; C09J11/06; C09J123/00; C09J171/12; C09J201/02
Domestic Patent References:
| WO2016147984A1 | 2016-09-22 | |||
| WO2020196718A1 | 2020-10-01 | |||
| WO2021085008A1 | 2021-05-06 | |||
| WO2021085009A1 | 2021-05-06 |
Foreign References:
| JP2020100759A | 2020-07-02 | |||
| JP2018039950A | 2018-03-15 | |||
| JP2015196729A | 2015-11-09 | |||
| JP6905160B1 | 2021-07-21 |
Attorney, Agent or Firm:
KOBAYASHI Hiroshi et al. (JP)
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