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WO/2021/256416A1 |
The purpose of the present invention is to provide an adhesive composition that is durable against a liquid electrolyte and that has improved hot adhesion characteristics. This adhesive composition is characterized by containing an acid-...
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WO/2021/256360A1 |
This adhesive contains a thermoplastic resin binder (A), modified polyolefin resin particles (B) and an organic solvent. This adhesive has high water repellency, while exhibiting high bondability with respect to metals, resins and the li...
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WO/2021/257874A1 |
Adhesive compositions containing (1) one or two adhesive compositions produced from the fruit but not the seeds of Osage orange fruit and (2) a known adhesive. The one or two adhesive compositions produced from the fruit but not the seed...
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WO/2021/256406A1 |
[Problem] To provide an adhesive set, an adhesion method, and powder, whereby adhesive curing time can be shortened. [Solution] An adhesive set 1 having: an adhesive 10 that is provided to an adhesion section 50 for a first target object...
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WO/2021/251386A1 |
Disclosed is an adhesive film for circuit connection. This adhesive film for circuit connection comprises: a first adhesive layer that contains conductive particles, a cured product of a photocurable resin component, and a first heat-cur...
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WO/2021/251124A1 |
One aspect of the present invention relates to a packaging body comprisingcat least a paper substrate and a hot melt adhesive, wherein the packaging body is characterized in that the hot melt adhesive is obtained by a production method t...
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WO/2021/251018A1 |
The present invention is a temporarily bonding method for bonding, to a support body via a temporary bonding layer, a wafer comprising a first principal surface including a circuit and a second principal surface that is to be processed a...
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WO/2021/251475A1 |
The present invention pertains to: a film mirror laminate comprising an adhesive layer, a base film, a metal reflective layer, and an optical adjustment layer in this order, wherein the storage elastic modulus of the adhesive layer at 25...
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WO/2021/246419A1 |
The present invention pertains to an adhesive composition containing: (a) modified cellulose fibers having a cellulose type-I crystal structure, and having a mean fiber length of 1000 nm or less and a mean fiber diameter of 1-300 nm; and...
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WO/2021/241548A1 |
One purpose of the present invention is to provide a curable resin composition having excellent applicability by spin coating and giving cured objects which are excellent in terms of adhesiveness and long-term heat resistance. Another pu...
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WO/2021/241213A1 |
One aspect of the present invention pertains to a sanitary article in which a substrate is fixed by a hot-melt adhesive and which is characterized in that: the hot-melt adhesive is produced by a production method comprising introducing, ...
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WO/2021/240126A1 |
The present invention relates to a composition, particularly a hot melt adhesive composition, that is able to change colour when exposed to different temperature conditions.
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WO/2021/235477A1 |
Provided are: a color correction filter for an image display device, the color correction filter having a pigment-containing layer that includes a resin and a pigment, an adhesion layer A that is disposed on one surface of the pigment-co...
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WO/2021/235389A1 |
Provided is an adhesive laminated film (50) used to protect circuit-forming surfaces of electronic components, the adhesive laminated film (50) comprising a base layer (20), a concave-convex absorbent resin layer (30), and an adhesive re...
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WO/2021/230376A1 |
The present invention relates to a sterilizing composition characterized by having the exceptional action of suppressing the loss of durability of synthetic adhesives, as well as a highly sterilizing action. The sterilizing composition i...
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WO/2021/230094A1 |
Provided is a moisture-curable hot-melt adhesive capable of combining satisfactory initial bonding strength with a sufficiently long working time. The moisture-curable hot-melt adhesive includes an alkoxysilyl-group-containing urethane p...
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WO/2021/230212A1 |
This conductive adhesive contains an adhesive composition and conductive particles; and the compressive hardness of the conductive particles at 20% compression is 10.0 Gpa or more at 25°C, while being 3.5 Gpa or less at 150°C.
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WO/2021/225051A1 |
A support tape for processing fiber-reinforced composite materials having a first adhesive layer in which the adhesive force A1 to a fiber-reinforced composite material at 23°C is 0.5 N/20 mm or higher, and the adhesive force A2 to the ...
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WO/2021/225052A1 |
A support material for processing fiber-reinforced composite materials which comprises a support member and an adhesive layer disposed upon the support member, the elastic modulus of the support member at 23°C being 0.1-30 GPa.
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WO/2021/225167A1 |
This easily disintegrable adhesive material contains a thermosetting hyperbranched polymer (P) and a disintegration-imparting agent (Q). The thermosetting hyperbranched polymer (P) is a dual curing type thermosetting hyperbranched polyme...
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WO/2021/225163A1 |
An objective of the present invention is to provide an adhesive composition that enables an adherend to be easily removed even after having spent an extended length of time at 250°C or higher, or having undergone a high-temperature mach...
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WO/2021/220663A1 |
Provided is an adhesive sheet that can be temporarily fixed to an adherend in a detachable manner, and that does not require high output laser light irradiation for detachment. The adhesive sheet comprises an adhesive layer containing ...
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WO/2021/220662A1 |
Provided is an adhesive sheet that can be temporarily fixed to an adherend in a detachable manner, that does not require high output laser light irradiation for detachment, and that can eliminate the necessity of a step for rinsing the a...
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WO/2021/215745A1 |
The present invention relates to a curing agent, an adhesive composition for a semiconductor having excellent adhesion as well as preventing cracks from forming by comprising the curing agent and thus exhibiting excellent durability, an ...
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WO/2021/215384A1 |
A polarizing film which is a constituent of an image display panel, and comprises a polarization film, a functional layer, an adhesive layer and a first transparent protective film, wherein the functional layer is adjacent to the viewing...
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WO/2021/215385A1 |
A polarizing film constituting an image display device that has an image display cell, wherein the polarizing film has a polarizing membrane, a functional layer, an adhesive layer, and a first transparent protective film, the functional ...
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WO/2021/214290A1 |
The invention relates to reactive hot-melt adhesive compositions containing, based on the total weight of the composition, a) 3 wt.% to 49 wt.% of at least one alpha-silane-terminated organic polymer; b) 1 wt.% to less than 20 wt.%, pref...
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WO/2021/215354A1 |
Provided is a double-sided adhesive tape that has excellent shock absorbency across a wide temperature range, in particular in a low temperature range. This double-sided adhesive tape has an adhesive layer on both surface sides of a ba...
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WO/2021/210921A1 |
An electronic device includes a front plate, a back plate that faces away from the front plate, a display, a frame, a polymer member, and an adhesive layer. The display is disposed between the front plate and the back plate and visible t...
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WO/2021/210587A1 |
A polyfunctional compound represented by formula (1). (In the formula, X represents a carbon atom or a C1-20 n-valent linking group, Ar represents an arylene group, R1 each independently represent a divalent group including a polymer blo...
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WO/2021/205727A1 |
[Problem] To provide an optical laminate capable of favorably peeling a surface protective film and a peeling method. [Solution] The optical laminate sequentially comprises: a surface protective film; a polarizing laminate including a po...
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WO/2021/206069A1 |
A temporary protection film for semiconductor encapsulation which comprises a substrate film and an adhesive layer. The adhesive layer comprises a thermoplastic resin and a low-molecular-weight additive having a molecular weight less tha...
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WO/2021/206115A1 |
An adhesive composition containing a compound which includes an aromatic heterocycle and a side-chain group bonded to the aromatic heterocycle and including at least one chain selected from the group consisting of alkyl chains having thr...
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WO/2021/200751A1 |
The present invention pertains to an adhesive that includes a resin component (A), a crosslinking agent (B), and a flame retardant (C) and has a gel fraction of at least 30% by mass after wet heat treatment for 14 days under conditions a...
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WO/2021/200686A1 |
A high-frequency dielectric heating adhesive sheet (1) has: a first adhesive layer (10) containing a first thermoplastic resin; a second adhesive layer (20) containing a second thermoplastic resin; and an intermediate layer (30). The rat...
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WO/2021/199798A1 |
According to the present invention, protection is provided, by a protective film, to an engineering plastic/inorganic substrate laminate which is employed in a production method for obtaining a flexible electronic device by temporarily s...
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WO/2021/200732A1 |
One purpose of the present invention is to provide an optical laminate body which is suitable for the manufacture of a self-light-emitting display device, e.g., a mini/micro-LED display element, that has improved luminous efficiency, is ...
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WO/2021/200054A1 |
The present invention relates to: a pressure-sensitive adhesive composition comprising a polymer, an ionic liquid, and an alignable material; and a pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer formed fr...
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WO/2021/200685A1 |
A high-frequency dielectric heating adhesive sheet (1) includes: a first adhesive layer (10) that contains a first thermoplastic resin and a first dielectric filler; and a second adhesive layer (20) that contains a second thermoplastic r...
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WO/2021/200734A1 |
The purpose of the present invention is to provide an optical laminate that is suitable for producing a self-luminous display device such as a mini/micro-LED display device in which light emission efficiency is increased and the anti-ref...
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WO/2021/200684A1 |
This high-frequency dielectric heating adhesive sheet (1) comprises a first adhesive layer (10), a second adhesive layer (20), and an intermediate layer (30) which is arranged between the first adhesive layer (10) and the second adhesive...
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WO/2021/200755A1 |
The present invention provides an aqueous dispersion enabling production of a film that has improved water resistance, tensile elasticity, and breaking point stress, and that exhibits suppressed reduction in breaking point distortion. Th...
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WO/2021/200616A1 |
An adhesive sheet comprising a base material and an adhesive agent layer that is layered on one surface of the base material, wherein the base material is formed from a material comprising a polyester resin, and among the monomer units c...
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WO/2021/201208A1 |
The present invention addresses the problem of providing an adhesive composition which exhibits excellent adhesiveness and adhesion to various plastics such as polypropylene, polyethylene, and cycloolefin resin. The adhesive composition ...
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WO/2021/200757A1 |
Provided is a sheet adhesive for optical use which contains an (A) component and a (B) component, said sheet adhesive for optical use giving a cured product that exhibits a storage sheer modulus (G'0) of 2×107 Pa or less at 0°C. The sh...
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WO/2021/200733A1 |
The purpose of the present invention is to attain reductions in the number of steps and in necessary members in steps for producing self-luminescent display devices, such as mini/micro light emitting diode (LED) display devices, having a...
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WO/2021/200292A1 |
The present invention relates to a layered body, an electromagnetic wave permeable layered body, and an article equipped with the layered body or the electromagnetic wave permeable layered body. The layered body and the electromagnetic w...
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WO/2021/200585A1 |
Provided is an adhesive for a semiconductor, the adhesive being used to seal connection portions in a semiconductor device having: a connection structure in which connection portions of semiconductor chips and a wiring circuit board are ...
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WO/2021/200758A1 |
Provided is a photocurable sheet adhesive that contains an (A) component, a (B) component, and a (C) component, wherein at least one epoxy resin constituting the (B) component gives a cured product that has a glass transition temperature...
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WO/2021/200687A1 |
A bonding method in which an adhesive sheet (10) comprising a first thermoplastic resin and an adhesive sheet (20) comprising a second thermoplastic resin are used, wherein the adhesive sheet (10) has a volume content VA1 of the first th...
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