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WO/2023/080065A1 |
A method for manufacturing a laminate film comprises: a step (S2) for performing laser processing from a film layer (30) side on a work film (W) having a carrier film (C), a film layer (10), a raw adhesive layer (20), and the film layer ...
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WO/2023/080183A1 |
The present invention relates to a molecular bonding sheet comprising a base sheet and molecular bonding layers disposed on both surfaces of the base sheet, wherein the base sheet has a 23°C storage modulus G1 of 3.5×106-1.0×1010 Pa.
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WO/2023/079780A1 |
Provided are a temperature indicator manufacturing system and a temperature indicator manufacturing method that reduce the labor and cost of management associated with temperature indicator manufacturing. This temperature indicator manuf...
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WO/2023/074556A1 |
This pressure-sensitive adhesive sheet (10) is an optical pressure-sensitive adhesive sheet including a base polymer and having photocurability. The base polymer is a photopolymerization product. The pressure-sensitive adhesive sheet (10...
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WO/2023/074169A1 |
A primer layer-forming composition for forming a primer layer having a cleavage structure in which chemical bonds are irreversibly cleaved in response to external stimuli, the composition containing a film-forming component and a solvent...
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WO/2023/074558A1 |
This adhesive sheet (10) contains a base polymer as a photopolymer and is photocurable. This adhesive sheet (10) has a gel fraction of at least 75% by mass after curing by a photocuring process under the condition of an irradiation integ...
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WO/2023/074474A1 |
The present invention provides a film-like adhesive 1 for semiconductors, the film-like adhesive 1 comprising a first adhesive region 2 and a second adhesive region 3 in the thickness direction. With respect to this film-like adhesive 1 ...
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WO/2023/074557A1 |
This pressure-sensitive adhesive sheet (10) is an optical pressure-sensitive adhesive sheet containing a base polymer. This pressure-sensitive adhesive sheet (10) has a gel percentage G (%) of 90% or less, a shear storage modulus E (MPa)...
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WO/2023/074555A1 |
An adhesive sheet (S) according to the present invention is a photocurable adhesive sheet, wherein the ratio of a surface hardness H2 at 25°C, as measured by nano-indentation, at a location 100 μm away from a cut edge produced by laser...
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WO/2023/068277A1 |
An adhesive tape for circuit connection provided with a first base material, an adhesive film, and a second base material, in that order, the adhesive film containing a cationic polymerizable compound, a thermal cationic polymerization i...
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WO/2023/066902A1 |
The present invention relates to reactive hot-melt adhesive compositions containing, based on the total weight of the composition, a) 3 wt.% to 49 wt.% of at least one alpha-silane-terminated organic polymer; b) 1 wt.% to less than 20 wt...
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WO/2023/068314A1 |
The purpose of the present invention is to provide a pressure-sensitive adhesive tape capable of favorably holding a chip component when receiving the chip component, and when re-transferring the chip component, capable of demonstrating ...
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WO/2023/068009A1 |
Provided is a pressure-sensitive adhesive material having excellent pressure-sensitive adhesiveness, excellent flexibility, and excellent restorability. The pressure-sensitive adhesive material is characterized by including a polymer (...
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WO/2023/068088A1 |
The present invention provides a base material for semiconductor wafer processing, the base material being capable of enhancing adhesion to a stage in a semiconductor wafer processing step. The present invention provides a base material ...
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WO/2023/068315A1 |
The purpose of the present invention is to provide a pressure-sensitive adhesive tape that can have chip components preferably pasted thereto when receiving the chip components, that exhibits excellent detachment performance when re-tran...
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WO/2023/063052A1 |
The purpose of the present invention is to provide a sheet for application to component-mounting surfaces of electronic substrates and for thereby protecting the electronic substrates; and an electronic substrate protected by the sheet. ...
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WO/2023/063211A1 |
A bonding method according to the present invention is for bonding a bush to a bonding member and comprises: an adhesive applying step of applying an adhesive to the portion of a cushioning member to be bonded to the bonding member; a fi...
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WO/2023/060257A1 |
Disclosed are curable adhesive compositions comprising hydroxyl functional polymers and silane functionalized resins. Such adhesive compositions are capable of providing unexpected properties for various uses and end products. The adhesi...
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WO/2023/058481A1 |
Provided is a method for manufacturing an electronic component device, comprising: a step for overlapping a protection sheet on a circuit surface that is at least one side of a substrate and on which a circuit-constituting element is dis...
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WO/2023/058577A1 |
This protective sheet is to be bonded to: a surface to be protected of an electronic component having the surface to be protected; one surface of a piece of glass constituting a display surface of a display device; or one surface of a gl...
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WO/2023/054478A1 |
The purpose of the present invention is to provide an adhesive composition that, even after storage in a high-temperature, high-humidity environment, still exhibits a satisfactory decline in adhesive strength due to the application of vo...
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WO/2023/054484A1 |
The purpose of the present invention is to provide: an adhesive composition from which an adhesive layer, which firmly bonds members when a voltage is not applied thereto, and the adhesive strength of which is sufficiently reduced by app...
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WO/2023/054480A1 |
The purpose of the present invention is to provide: an adhesive composition from which an adhesive layer, which firmly bonds members when no voltage is applied and sufficiently reduces an adhesive force by applying voltage, can be formed...
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WO/2023/054114A1 |
A high-frequency dielectric heating adhesive (1A) contains a thermoplastic resin (A) and a cyano group-containing organic compound (B), and satisfies the following (1). (1) The total light transmittance of the high-frequency dielectric h...
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WO/2023/054234A1 |
Provided is a composition that can be used for an adhesive having excellent fast curability and heat cycle resistance. The present invention provides a two-agent type composition comprising a first agent and a second agent. The first age...
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WO/2023/054676A1 |
Provided is a curable adhesive sheet comprising a curable adhesive layer, with which a cured product having a dielectric loss tangent of 0.01 or less at 23 °C and at 1 GHz can be formed, and first and second release films between which ...
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WO/2023/054302A1 |
Provided is a press-bonded sheet manufacturing method by which a product created by a press-bonding process is peeled smoothly and with the appropriate force, and it is possible to inhibit a drop in adhesive force caused by deformation o...
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WO/2023/053560A1 |
An insulative adhesive tape (3) is configured from a laminated body (L3) of at least three layers including an insulative layer (12), an adhesive layer (13), and a substrate layer (11) provided between the insulative layer (12) and the a...
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WO/2023/053871A1 |
The present invention provides a linerless label for a flight baggage, the linerless label being configured by a smaller number of layers. A linerless label 100 comprises four layers of a surface base material layer 110, an adhesive laye...
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WO/2023/054488A1 |
This transfer film includes a base film and a transfer layer, wherein the transfer layer has a surface protection layer and an adhesive layer, the surface protection layer forms the surface layer of the transfer layer on the base film si...
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WO/2023/054085A1 |
The present invention provides an adhesive composition which has excellent adhesive strength when attached to an adherend and excellent peelability when subjected to batch heating at a high temperature, whereby both high initial adhesive...
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WO/2023/048053A1 |
Provided is an adhesive tape with excellent heat resistance. The adhesive tape comprises a vinyl chloride resin-based base material (A) and an adhesive layer (B) laminated onto at least one side of the base material (A). The base mater...
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WO/2023/047917A1 |
This pressure-sensitive adhesive sheet (10) is an optical pressure-sensitive adhesive sheet. When the pressure-sensitive adhesive sheet (10) is applied to a glass plate and the laminate is thereafter subjected to a heating/pressing treat...
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WO/2023/042676A1 |
An adhesive sheet (X) serving as a variable-color adhesive sheet of the present invention includes: a base polymer; a chromogenic compound which can reversibly change between a colored state created through a reaction with acid and a non...
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WO/2023/042409A1 |
The purpose of the present invention is to provide an adhesive sheet having an adhesive agent layer that has an adhesive surface having a wettability unlikely to change even when being exposed in an air environment and that is unlikely t...
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WO/2023/040076A1 |
The present invention relates to the technical field of sealants, and in particular, to an acrylate sealant for construction and a preparation method therefor. The acrylate sealant for construction comprises preparation raw materials of:...
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WO/2023/037721A1 |
Provided are an optical laminate that has excellent anti-static performance and excellent humidification durability, and an image display device that uses the optical laminate. An optical laminate according to the present invention compr...
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WO/2023/038123A1 |
Provided is an adhesive-layer-equipped substrate having a substrate and an adhesive layer disposed on the substrate, wherein: the adhesive layer contains polymer particles (A), an inorganic oxide (B), and a light-shielding agent (D); the...
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WO/2023/033075A1 |
Provided is an adhesive composition having both high adhesive strength and improved cohesive failure rate. An adhesive composition that includes a thermosetting resin (component (A)), a toughening agent (component (B)), a curing agent ...
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WO/2023/033176A1 |
The purpose of the present invention is to provide an adhesive tape for semiconductor device manufacturing, which is excellent in chip component delamination performance, and which is capable of preventing adhesive residue from remaining...
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WO/2023/033064A1 |
Provided is a refractive index adjustment agent for adjusting the refractive index of adhesives, wherein this refractive index adjustment agent for adhesives is an organic compound comprising a structure having at least two substituents ...
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WO/2023/033074A1 |
The present invention provides an adhesive composition which has achieved a good balance between high bonding strength and improvement of cohesive failure ratio. The present invention provides an adhesive composition which contains a t...
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WO/2023/032685A1 |
The present invention provides an antireflection film with a pressure-sensitive adhesive sheet, the antireflection film being suitable for use in organic EL display devices (OLEDs). This antireflection film 10 with a pressure-sensitive a...
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WO/2023/033076A1 |
Provided is an adhesive composition having both a high adhesion strength and an improved cohesive failure rate. The adhesive composition comprises a heat-curable resin [referred to as component (A)], thermoplastic-resin particles [refe...
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WO/2023/032135A1 |
The purpose of the present invention is to provide a heat-removable pressure-sensitive adhesive tape which is suitable for use in high-temperature heating steps and, when heated at a higher temperature after use in a heating step, can be...
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WO/2023/027563A1 |
Various embodiments of the present disclosure relate to an electronic device including a ceramic resin composite frame. Various embodiments of the present disclosure may provide an electronic device including a ceramic structure, the ele...
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WO/2023/026687A1 |
Provided are: an adhesive composition that has a low resistance and excellent reworkability, and can inhibit the occurrence of dents; and a polarizing plate using the adhesive composition. The adhesive composition according to an embodim...
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WO/2023/022076A1 |
The present invention provides a production method for an adhesive sheet 1A for semiconductor device production that comprises a release film 2 and an adhesive film 3 that is provided on the release film 2. The production method for the ...
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WO/2023/022029A1 |
The purpose of the present invention is to provide an adhesive layer-attached polarizing film having a separator, whereby both easy peelability of the separator and high temperature durability of the adhesive layer are achieved. In the...
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WO/2023/022094A1 |
A curable adhesive composition for use in bonding wiring members as a component of a multilayered wiring board. The curable adhesive composition gives a cured object which, when the thermal expansion coefficient and glass transition temp...
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