Title:
ADHESIVE COMPOSITION, ADHESIVE SHEET, AND BONDED BODY
Document Type and Number:
WIPO Patent Application WO/2023/054480
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: an adhesive composition from which an adhesive layer, which firmly bonds members when no voltage is applied and sufficiently reduces an adhesive force by applying voltage, can be formed; an adhesive sheet including an adhesive layer formed of said adhesive composition; and a bonded body. The present invention pertains to: an adhesive composition containing a polymer, an ionic liquid, and a tackifier having a hydroxyl value of at most 150 mg KOH/g; an adhesive sheet including an adhesive layer formed of said adhesive composition; and a bonded body.
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Inventors:
KURODA TOMOHARU (JP)
MIZUHARA GINJI (JP)
TSUMURA DAISUKE (JP)
MIZUHARA GINJI (JP)
TSUMURA DAISUKE (JP)
Application Number:
PCT/JP2022/036199
Publication Date:
April 06, 2023
Filing Date:
September 28, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J11/06; C09J7/38; C09J11/08; C09J133/00; C09J167/00; C09J175/04; C09J201/00; C09J201/02
Domestic Patent References:
| WO2022065483A1 | 2022-03-31 |
Foreign References:
| JP2016065209A | 2016-04-28 | |||
| JP2006342191A | 2006-12-21 | |||
| JP6152288B2 | 2017-06-21 | |||
| JP6097112B2 | 2017-03-15 | |||
| JP2020164778A | 2020-10-08 | |||
| JP2021161475A | 2021-10-11 | |||
| JP2022001917A | 2022-01-06 | |||
| JP2022026641A | 2022-02-10 |
Other References:
"Polymer Handbook", 1989, JOHN WILEY & SONS, INC
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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