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WO/2024/072822A3 |
Aspects of the disclosure include compositions, reaction mixtures, and methods of use thereof, for preventing or reversing aggregation of molecular entities prone to aggregation.
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WO/2024/096359A1 |
The present invention relates to a hologram recording medium, a method for manufacturing same, and an optical element comprising same. The hologram recording medium satisfies a certain elemental composition ratio, and thus not only has e...
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WO/2024/095774A1 |
[Problem] To provide a silica particle dispersion that has stable quality with little change in surface modifications over time. [Solution] A silica particle dispersion in which surface-treated silica particles have been dispersed in an ...
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WO/2024/096358A1 |
The present invention relates to a hologram recording medium, and an optical element comprising same. The hologram recording medium not only has excellent optical recording characteristics, but also exhibits excellent transparent optical...
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WO/2024/095637A1 |
An actinic-ray-curable composition comprising monofunctional monomers (A), a polyfunctional (meth)acrylate (C) having a number-average molecular weight of 500-40,000, and a photopolymerization initiator (D), wherein the monofunctional mo...
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WO/2024/096361A1 |
The present invention relates to a hologram recording medium and an optical element comprising same. The hologram recording medium is not only excellent in terms of optical recording characteristics, but also has transparent optical prop...
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WO/2024/095777A1 |
The purpose of the present invention is to provide a resin composition from which it is possible to form a resin film having a low dielectric loss tangent and excellent heat resistance. A resin composition according to the present invent...
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WO/2024/096360A1 |
The present invention relates to a photopolymer composition, a hologram recording medium, a method for preparing same, and an optical element comprising same. The photopolymer composition contains an electron donor having reaction energy...
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WO/2024/095927A1 |
The present disclosure provides a photosensitive resin composition which achieves high copper adhesion, while suppressing the occurrence of a copper void at the interface between a copper layer and a resin layer after a high temperature ...
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WO/2024/090410A1 |
Provided is a resin composition with which a novel cured product can be achieved. Also provided are the cured product, a prepreg, a metal-foil-clad laminate board, a resin composite sheet, and a printed wiring board. The resin compositio...
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WO/2024/090375A1 |
The present invention relates to a vinyl chloride-based fiber containing a vinyl chloride-based resin composition, wherein the vinyl chloride-based resin composition contains a vinyl chloride-based resin A and a vinyl chloride-based resi...
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WO/2024/090567A1 |
Provided is a negative photosensitive resin composition comprising: a polyimide (A) represented by formula (1) {in formula (1), A denotes a structure derived from a tetracarboxylic dianhydride, B denotes a structure derived from a diamin...
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WO/2024/090408A1 |
The present invention provides a resin composition, a cured product, a prepreg, a metal foil-clad laminate, a resin composite sheet, and a printed wiring board. Provided is a resin composition comprising: a polymaleimide compound (A); an...
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WO/2024/090516A1 |
A radical polymerizable resin curing agent composition comprising: an organometallic compound (A) containing at least one metal among manganese and cobalt; at least one compound (B) selected from the group consisting of α-acetyl-γ-buty...
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WO/2024/090084A1 |
Provided are: a resin composition which has high transparency, is excellent in compatibility and curing performance, and hardly causes curing failure, even when an unsaturated polyester resin and a (meth)acryloyloxy group-containing resi...
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WO/2024/090151A1 |
Provided is a radically polymerizable resin composition that exhibits superior curing properties in the temperature range of approximately 50-80°C and superior storage stability in the low temperature range of 20°C or lower. A radicall...
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WO/2024/092041A1 |
The present disclosure provides curable compositions comprising one or more of photo-polymerizable monomers as reactive diluents, as well as polymeric materials formed from the curable compositions. Further provided herein are methods of...
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WO/2024/090478A1 |
Provided is a photocurable resin composition which can yield a cured product that exhibits flame retardancy and has excellent mechanical strength, and which is suitable for a shaping method that involves photocuring. This photocurable re...
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WO/2024/085619A1 |
The present invention pertains to a hologram recording medium, and an optical element including said hologram recording medium, wherein before light irradiation, the adhesion between a photopolymer layer and an adhesive protective layer ...
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WO/2024/085048A1 |
Provided are: an active energy ray-curable composition which achieves a viscosity suitable for coating agents, low glossiness for achieving a matte effect, contamination resistance and scratch resistance at the same time; and a method fo...
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WO/2024/080103A1 |
The purpose of the present invention is to provide an optical material composition that enables excellent functional pigment properties, a cured body, an optical article, a lens and spectacles. One embodiment of the present invention pro...
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WO/2024/081115A1 |
Thermally reversible, photocurable compositions is disclosed. The photocurable composition has high strength at low temperatures but also melts at elevated temperatures and is well suited as investment casting pattern composition.
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WO/2024/079926A1 |
The purpose of the present invention is to provide a bismaleimide compound-containing resin composition that has excellent compatibility, that can be cured by means of light, and that requires less heating time and an additional heating ...
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WO/2024/078801A1 |
The present invention relates to a curable and electrochemically debondable one-component (1K) structural adhesive composition comprising a) a (meth)acrylate monomer selected from the group consisting of hydroxypropyl acrylate, hydroxypr...
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WO/2024/079924A1 |
Provided are a resin composition that does not inhibit a photocuring reaction in an exposure step and that can provide excellent alkali developability in a development step, and a resin sheet, a multilayer printed wiring board, and a sem...
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WO/2024/075471A1 |
A novel acrylic compound containing a fluoropolyether group and represented by formula (1) according to the present invention, when added to a composition curable with actinic rays, e.g., ultraviolet light or electron beams, imparts exce...
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WO/2024/075583A1 |
The present invention provides a curable composition which contains a first bismuth compound that comprises bismuth and at least one of an acryloyl group and a methacryloyl group, and a first polymerizable compound that comprises at leas...
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WO/2024/075386A1 |
The present invention addresses the problem that both printing parts before and after retort processing have sufficiently high adhesion and excellent scratch resistance, ink and varnish do not peel off from the printed surface of each re...
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WO/2024/074778A1 |
The invention relates to a two-component composition comprising: - a component A comprising: o an organoborane amine complex, and o a polyol polymer having a number-average molar mass of less than 4500 g/mol; and - a component B comprisi...
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WO/2024/068441A1 |
The invention relates to a graft polyarylether ('PAE') copolymer (P1), a process for preparing the graft PAE copolymer (P1) from a side-chain allyl/vinylene-functionalized PAE copolymer (P0) via free radical reaction with vinyl pyrrolido...
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WO/2024/070808A1 |
Provided is a photosensitive film provided with a photosensitive resin composition layer comprising a photosensitive resin composition, in which the photosensitive resin composition layer has a thickness of 20 μm or more, the photosensi...
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WO/2024/071237A1 |
Provided are: a resin composition including one or more resins selected from the group consisting of polyimides and precursors thereof, the dielectric loss tangent of a cured product obtained by heating the resin composition at 230°C fo...
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WO/2024/070200A1 |
A silicone composition contains (A) an organopolysiloxane having at least three (meth)acrylic groups in one molecule, (B) an organopolysiloxane having at least two alkenyl groups in one molecule and not having a (meth)acrylic group, (C) ...
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WO/2024/070841A1 |
Provided are hollow particles which suppress reductions in pressure resistance under high temperatures. The present invention pertains to hollow particles comprising a shell, which includes a resin, and a hollow portion surrounded by the...
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WO/2024/070713A1 |
The present invention provides a resin composition which enables the achievement of a film having a low dielectric loss tangent, an insulating film which has a low dielectric loss tangent, and a method for producing an interlayer insulat...
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WO/2024/071380A1 |
A resin composition comprising a resin which is at least one resin selected from the group consisting of polyimides and precursors thereof and which has a side chain including a five- or more-membered cyclic structure, a polymerization i...
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WO/2024/070963A1 |
The present invention provides a film production method involving applying, onto a base material, a photosensitive resin composition that includes (A) a resin, (C) a photopolymerization initiator, (D) a radical polymerization inhibitor, ...
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WO/2024/068442A1 |
The invention relates to a graft polyarylether ('PAE') copolymer (P1), a process for preparing the graft PAE copolymer (P1) from a side-chain allyl/vinylene-functionalized PAE copolymer (PO) via free radical reaction with a vinyl sulfona...
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WO/2024/070199A1 |
This heat-curable and photocurable silicone composition comprises: (A) an organopolysiloxane having at least three (meth)acrylic groups per molecule; (B) an organopolysiloxane having at least two alkenyl groups per molecule and having no...
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WO/2024/062932A1 |
Provided is a composition for a vibration-damping material capable of yielding a vibration-damping material having a wide temperature range in which the tanδ value is 0.5 or more. Provided is a vibration-damping material obtained by cur...
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WO/2024/063068A1 |
[Problem] To provide an ultraviolet-curable composition containing silicon atoms, wherein the ultraviolet-curable composition has a high ability to adjust the mechanical properties of the cured product thereof, and has excellent workabil...
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WO/2024/063025A1 |
A resin composition that comprises a resin having an ethylenically unsaturated bond-containing group, the resin being at least one resin selected from the group consisting of a cyclized resin and a precursor thereof and a polyamide, a ph...
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WO/2024/063069A1 |
[Problem] To provide a silicon-atom-containing ultraviolet-curable composition which ensures high regulation ability for the mechanical properties of products to be obtained by curing the composition and which, although being of a solven...
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WO/2024/060603A1 |
Provided are a water-reducing agent and a preparation method therefor. Preparation raw materials of the water-reducing agent comprise the following components in parts by weight: 500-600 parts of an esterified modified starch solution, 1...
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WO/2024/063112A1 |
The purpose of the present invention is to provide a resin composition which can suppress the occurrence of voids and floating during heat treatment and can be easily peeled after the heat treatment. Moreover, another purpose of the pres...
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WO/2024/064836A1 |
The subject matter described herein is directed to molecularly engineered brush-like graft copolymer elastomers and applications thereof. The developed formulation platform is based on the synthesis of brush-like graft copolymer networks...
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WO/2024/057723A1 |
This photocurable coating composition comprises: (A) an organopolysiloxane represented by formula (1) (each R1 independently represents a hydrogen atom or a monovalent hydrocarbon group optionally having an oxygen atom or the like interp...
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WO/2024/058213A1 |
A composition comprising a phosphorylcholine group-containing monomer, a phosphorylcholine group-containing silicone macromer, a silicone monomer or macromer other than the phosphorylcholine group-containing silicone macromer represented...
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WO/2024/058164A1 |
This liquid crystal aligning agent contains: a polymer α obtained from a compound having a polymerizable group having a polymerizable unsaturated hydrocarbon group; at least one type of polymer β selected from among a polyimide, a poly...
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WO/2024/058031A1 |
An actinic-ray-curable resin composition comprising: a polymer containing a quaternary ammonium salt; and a phosphoric acid ester and/or a salt, the anion of the salt including a polyoxyalkylene structure. The actinic-ray-curable resin c...
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