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Title:
RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED PRODUCT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/071380
Kind Code:
A1
Abstract:
A resin composition comprising a resin which is at least one resin selected from the group consisting of polyimides and precursors thereof and which has a side chain including a five- or more-membered cyclic structure, a polymerization initiator, and a polymerizable compound; a cured object; a layered product; a method for producing the cured object; a method for producing the layered product; a method for producing a semiconductor device; and the semiconductor device.

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Inventors:
NOZAKI ATSUYASU (JP)
OOTA KAZUYA (JP)
Application Number:
PCT/JP2023/035636
Publication Date:
April 04, 2024
Filing Date:
September 29, 2023
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C08G73/10; C08F290/14; G03F7/004; G03F7/027; G03F7/037; G03F7/075; G03F7/20
Domestic Patent References:
WO2018003726A12018-01-04
WO2017170600A12017-10-05
WO2018159637A12018-09-07
Foreign References:
JP2006512422A2006-04-13
JPS63318549A1988-12-27
Attorney, Agent or Firm:
SIKS & CO. (JP)
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