Title:
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME
Document Type and Number:
WIPO Patent Application WO/2024/095927
Kind Code:
A1
Abstract:
The present disclosure provides a photosensitive resin composition which achieves high copper adhesion, while suppressing the occurrence of a copper void at the interface between a copper layer and a resin layer after a high temperature storage test and having little copper migration in a b-HAST test. A photosensitive resin composition according to the present disclosure contains the following components: (A) a polyimide precursor and/or a polyimide resin; (B) a tetrazole compound; (C) a photopolymerization initiator; and (D) a solvent. The tetrazole compound (B) has a pKa of 1.3 to 4.1, or is represented by general formula (1) or (2), or has a polar surface area (tPSA) of 81 to 200.
Inventors:
WADA KEISUKE (JP)
YOSHIDA MAYUKI (JP)
YOSHIDA MAYUKI (JP)
Application Number:
PCT/JP2023/038954
Publication Date:
May 10, 2024
Filing Date:
October 27, 2023
Export Citation:
Assignee:
ASAHI CHEMICAL IND (JP)
International Classes:
G03F7/004; C08F290/14; C08G73/06; G03F7/027; G03F7/037; G03F7/038; H01L21/768; H01L23/532
Domestic Patent References:
| WO2021025133A1 | 2021-02-11 |
Foreign References:
| JP2019061224A | 2019-04-18 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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