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WO/2024/083063A1 |
Disclosed in the present invention is a wafer polishing system, at least comprising two polishing units; a single polishing unit comprises at least two polishing modules and a first fixed working position, each polishing module comprisin...
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WO/2024/074631A1 |
The invention relates to a plate grinding/polishing device (10) for surface grinding and/or polishing the sample surface on the lower side of, in particular, embedded and/or non-embedded samples by way of a rotating grinding/polishing pl...
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WO/2024/068231A1 |
The invention relates to a method for producing a pressing tool (1) from a steel sheet (2), wherein the pressing tool (1) is designed for pressing material panels by hot pressing, and wherein the method includes using a machining device ...
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WO/2024/070270A1 |
[Problem] To provide a jig which is for polishing an optical fiber ferrule, and which can fix and remove various types of optical fiber ferrules without using a tool such as a wrench or a driver. [Solution] This jig for polishing an opti...
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WO/2024/073562A1 |
A sander flex pad suitable for use with a rotary floor sander, wherein the sander flex pad comprises a flat circular disc with a center opening and an intact circular peripheral edge; wherein the disc has at least 2 cuts through the disc...
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WO/2024/057951A1 |
This substrate processing apparatus comprises: a substrate holding unit that holds a substrate; a drive mechanism that drives a tool for processing the substrate being held by the substrate holding unit; a housing in which the substrate ...
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WO/2024/052352A1 |
A grinding robot (7) for grinding a surface (2, 3, 4, 5) has a grinding device by means of which the surface (2, 3, 4, 5) can be ground using a grinding means, a movement device by means of which the grinding device can be moved over the...
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WO/2024/047305A1 |
The invention relates to a method for polishing the front face of a polycrystalline silicon carbide slab comprising a surface region at least partially work-hardened under the effect of grinding, comprising: - relative movement of a rota...
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WO/2024/041159A1 |
An ultrasonic thinning device for a wafer, comprising an adsorption unit and a grinding unit. The adsorption unit comprises vacuum suction cups (20) each having a cup body (201); air flow channels (202) and adsorption holes (203) are eve...
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WO/2024/025002A1 |
The present invention relates to a method for polishing the surface of a 3D-printed orthopedic Ti alloy plate, the method enabling the surface of a 3D-printed orthopedic Ti alloy plate to be polished to a roughness level suitable for bio...
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WO/2024/018854A1 |
A substrate processing method comprising: preparing a substrate having a first main surface and a second main surface opposite to the first main surface and having waviness in each of the first main surface and the second main surface; i...
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WO/2024/019256A1 |
An exterior material for home appliances, according to an embodiment, may include a base material having a hierarchical circular structure pattern on the upper surface thereof. The hierarchical circular structure pattern may include a pl...
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WO/2024/001121A1 |
The present invention relates to the technical field of ultra-precision polishing, and particularly relates to a semiconductor wafer magnetically-controlled grinding and polishing integrated disc and a use method therefor. The semiconduc...
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WO/2023/250444A2 |
A tool handle having a grip portion with two parallel attachment legs projecting perpendicular to the grip portion; the grip portion having a threaded hole for mounting a threaded extension pole; the threaded hole located on top of the g...
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WO/2023/250445A1 |
A masonry cutting system having an extension handle assembly with a fork assembly mountable to a right-angle grinder in parallel alignment and with a blade on the grinder oriented vertically, a shroud with a self-adjusting guard and the ...
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WO/2023/234555A1 |
Transparent ceramic glass for a cooktop, according to one embodiment, may comprise: a glass material including an uneven layer etched on the upper surface thereof; an upper print layer formed on the upper part of the uneven layer; and a ...
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WO/2023/234998A1 |
Methods and systems for thinning a device wafer to tens of micron, micron, or sub-micron thicknesses are disclosed. Device wafers are thinned by using a two-step grinding process and a chemical mechanical polish (CMP) process. One or mor...
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WO/2023/229660A1 |
The invention relates to a brake disc arrangement (86) having a brake disc (12) that has a friction ring (14) and a brake disc pot having an opening concentric to a central brake disc axis, which opening is delimited by a boundary which ...
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WO/2023/228787A1 |
The present invention provides a method for producing a ground wafer, wherein a ground wafer is produced by grinding a starting material wafer that has a first main surface and a second main surface, the method comprising: a first resin ...
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WO/2023/197514A1 |
Disclosed in the present application is a ground mortar cleaning actuator, which comprises a ground module, a wall corner module, a transmission module and a translation module, wherein the ground module is configured to clean mortar on ...
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WO/2023/195427A1 |
[Problem] To provide a device for cleaning/polishing floors by rotating a brush or sponge in a head section, or the like, wherein the handling of the device is facilitated. [Solution] Provided is a simplified and miniaturized cleaning de...
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WO/2023/187844A1 |
Apparatus (100) for working a sheet (200) comprising movement means (111, 112) configured to move at least one sheet (200) at a time in a direction of advance (F), and at least one working unit (113) comprising a working head (123) on wh...
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WO/2023/192128A1 |
A method of polishing a surface of a polycrystalline sintered ceramic body, the method comprising the steps of: a) providing a sintered ceramic body comprising a polycrystalline material and having a density of from about 99.5% to about ...
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WO/2023/190299A1 |
A boron nitride plate surface treatment method according to an embodiment comprises a first polishing step and a second polishing step. In the first polishing step, a surface of a boron nitride plate is polished using a first polishing m...
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WO/2023/184727A1 |
A PCB grinding method, a PCB regrinding device, and a PCB. The PCB grinding method comprises: establishing a board thickness data model, the board thickness data model comprising the board thickness of each hole plugging area before hole...
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WO/2023/185202A1 |
Disclosed in the present invention is a wafer polishing system, comprising: a wafer transfer apparatus that comprises a fixing base and a carrying table, the fixing base being capable of driving the carrying table to move in a wafer tran...
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WO/2023/181756A1 |
The present invention pertains to a polishing method and a polishing device for polishing a peripheral portion of a substrate such as a wafer. The polishing method includes: holding a substrate (W) and rotating the substrate (W) by means...
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WO/2023/183100A1 |
A chemical mechanical polishing composition comprises, consists of, or consists essentially of a liquid carrier, abrasive particles in the liquid carrier, a pyrophosphate compound, and a sulfonate compound or a compound including a quate...
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WO/2023/183220A1 |
A method of manufacturing a photomask including the steps of providing a photomask blank, inspecting the photomask blank to determine presence of one or more defects in the photomask blank, wherein the one or more defects comprise one or...
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WO/2023/176611A1 |
This substrate polishing device performs a polishing process on a processing surface of a substrate and comprises a grinding module in which a first grinding member and a second grinding member that has a larger maximum diameter than the...
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WO/2023/176448A1 |
This tool assembly comprises: a rotatable processing tool 2 for processing the end surfaces of a glass plate; and a rotatable holder 3 that holds the processing tool 2. The tool assembly further comprises: a cavity portion 9c that is use...
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WO/2023/176451A1 |
This tool assembly comprises: a rotatable processing tool 2 for processing the end surfaces of a glass plate G; and a rotatable holder 3 that holds the processing tool 2. The tool assembly further comprises: a cavity portion 9c that is u...
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WO/2023/174340A1 |
Disclosed in the present invention is a dual-electric-motor driven ground leveling grinder, comprising a main electric motor, a worm drive box, a gear box, a secondary electric motor, a universal joint, racks, and counterweight sliding b...
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WO/2023/151245A1 |
The present invention relates to a surface friction treatment method for a ceramic reinforced aluminum-based composite material brake disc. A layer of recombinant film is formed on a friction surface of a ceramic reinforced aluminum-base...
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WO/2023/142579A1 |
A chemical-mechanical combined machining method for a silicon carbide surface, comprising the following steps: first mounting a grinding and polishing tool (1) and silicon carbide (2) on a machine table of grinding and polishing equipmen...
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WO/2023/137928A1 |
An intelligent plane polishing method, comprising a workbench (1), a feeding and clamping robot, and a polishing head (3). The workbench (1) has a high-precision base surface, and a front end and a side surface each are provided with a f...
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WO/2023/139124A1 |
The invention relates to a double-side grinding machine (10), comprising a first machine part (16) with a first grinding disc (18) and a second machine part (20) with a second grinding disc (22), wherein a distance between the first grin...
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WO/2023/137029A2 |
Abrasive devices suitable for use in cylinder style floor cleaning machines for the purpose of deep cleaning, restoring, honing and/or polishing are described. The abrasive devices include an elongated body and abrasive structures extend...
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WO/2023/133196A2 |
An adaptable belt sander may comprise: a tool holder; a housing; a drive system comprising a first gear and a second gear configured to engage the first gear, the second gear coupled to a shaft; and a belt system comprising a belt extend...
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WO/2023/119847A1 |
The present invention relates to a substrate processing method and a substrate processing device for processing a substrate such as a wafer. In this substrate processing method, a substrate (W) having a notch (Nw) is rotated and moved in...
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WO/2023/119684A1 |
The purpose of the present invention is to provide a method and a device for producing a semiconductor crystal wafer that make it possible to easily and reliably produce a semiconductor crystal wafer of high quality. This method is for...
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WO/2023/120869A1 |
A retainer ring according to one embodiment comprises: a core part formed in a ring shape and including a metal material; and an injection part formed around the core part through molding so as to surround the core part, wherein the core...
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WO/2023/111831A1 |
Machine (1) for smoothing and/or polishing articles, preferably in slab form, by using predetermined operating conditions, comprising a plurality of spindles (6) mounted on a machining station (4) and having one or more abrasive tools (8...
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WO/2023/106016A1 |
Provided is a wafer manufacturing method for obtaining a wafer from an ingot (2) having a c-axis provided in a state in which a center axis (L) is tilted in an off-angle direction (Dθ) by an off-angle greater than 0 degree, the method c...
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WO/2023/104586A1 |
The present disclosure relates to a floor grinding machine (1) comprising an electric motor (2) which extends along an axis of rotation (x) and which is interconnected to a grinding unit (3). The grinding unit (3) comprises a housing (4)...
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WO/2023/098342A1 |
Provided in the present application are a grinding mechanism and a grinding robot, which relate to the technical field of robot building. The grinding mechanism comprises: a base; a spline nut mounted on the base; a spline shaft arranged...
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WO/2023/100957A1 |
Provided is a glass sheet manufacturing method comprising: a grinding step P1 for processing an end face 1a of a glass sheet 1 with a grinding wheel 2; and a polishing step P2 for processing the end face 1a of the glass sheet 1 with a po...
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WO/2023/096544A1 |
An inspection tool (100) for inspection of a concrete surface (180), the tool comprising a vision-based sensor (110) arranged to be directed at a section of the concrete surface (180), guiding means (120) for allowing an operator (170) t...
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WO/2023/093594A1 |
A floor polishing robot trajectory deviation correction method and apparatus having an error correction function, relating to the technical field of robot control. The method comprises: obtaining the pose of a robot in real time by means...
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WO/2023/091844A1 |
A method of forming a retreaded tire is provided. The method includes coupling a retread element to a tire casing to form a retreaded tire having a tread surface and machining a sidewall of the retreaded tire. The sidewall of the retread...
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