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WO/2017/171052A1 |
[Problem] To provide a carrier which makes it possible to obtain a high-quality substrate at a higher yield than conventional ones and a substrate manufacturing method using this carrier. [Solution] A carrier 104 according to the present...
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WO/2017/168366A1 |
A cooling and suction system for polishing heads (5) for polishing, for example by smoothing, lapping or the like, ceramic manufactured items (8) or natural stones, comprises at least one polishing head (5), provided with a plurality of ...
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WO/2017/157193A1 |
An intelligent wall polishing device, comprising a polishing head (1) and a range-of-motion control mechanism (2). An acting end of the range-of-motion control mechanism (2) is connected to a robotic arm (3). The polishing head (1) is mo...
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WO/2017/138355A1 |
According to an embodiment of the present invention, a grinding apparatus is provided with a stage, and a plurality of grinding heads. The stage holds a substrate. The grinding heads are selectively pressed to a substrate surface to be g...
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WO/2017/134616A1 |
An orbital polishing machine (1) for slabs (S) made of stone materials or materials having an equivalent hardness, comprising a stationary basement (2) designed to be secured to the ground, a movable support surface (3) associated with t...
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WO/2017/134925A1 |
Included are a resin layer forming step for forming a resin layer (R) on one surface (W1) of a wafer (W); a first surface grinding step in which the one surface (W1) is held and another surface (W2) is subjected to surface grinding with ...
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WO/2017/129021A1 |
Disclosed are a multi-head planetary grinding machine and an operating method therefor. The grinding machine comprises a machine frame (1). A motor (11) is arranged on the front portion of the machine frame (1), a control box (12) is arr...
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WO/2017/126107A1 |
Provided is a grinding apparatus capable of performing high precision double-headed flat grinding. A grinding apparatus for double-headed grinding of a cylinder and piston for configuring a rotary compressor is provided with: a pair of r...
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WO/2017/101059A1 |
Polishing tools and methods of polishing a glass substrate are disclosed. A polishing tool (200) includes a stem (220) and a polishing material (210) bonded to the stem (220). The polishing material (210) includes, in volume concentratio...
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WO/2017/106186A1 |
An aqueous polishing slurry having enhanced wettability comprises a detergent blend which includes an anionic alkyl sulfate-based detergent and an alkylbenzene sulfonate detergent together with particulate polishing abrasive.
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WO/2017/094462A1 |
A plate glass manufacturing method comprises a transportation step of transporting plate glass (G) in a prescribed transport direction. In the transportation step, a portion of a transport belt (6) is raised by a lifting and lowering dev...
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WO/2017/094646A1 |
[Problem] To provide a processing device for grinding by suppressing brittle-mode grinding and stabilizing a wafer. [Solution] A processing device 1 is provided with: an index table 2 on which a wafer W is moved from a coarse grinding st...
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WO/2017/081617A1 |
The head (1) for polishing of ceramic or natural stone articles comprising a main body (2), at least one support element (3) attached to the main body (2) and supporting at least one tool (4), and means of air cooling (5, 6, 7) said tool...
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WO/2017/076905A1 |
The invention relates to a method for the production of a metal strip (1), in which the metal strip (1) is ground in a plurality of passes at least on one side on substantially the entire surface. During a final grinding passage, the met...
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WO/2017/072726A1 |
Device (1) for working ceramic objects provided with at least one tool (2) operating in rotation to cut at least one ceramic article (4) positioned on a worktop (5), and comprising: at least one cooling element (6) adapted to send compre...
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WO/2017/068945A1 |
Disclosed is a semiconductor wafer processing method wherein, firstly, a thin disc-like wafer is manufactured by slicing a semiconductor single crystal ingot (slicing step), then, a planarized coating layer is formed by applying a curabl...
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WO/2017/063932A1 |
The present invention relates to a stoning or honing device for automatically applying an essentially constant and uniform pressure of an abrasive hard component onto a continuously moving metal strip (6) surface, for the purpose of defe...
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WO/2017/061486A1 |
This duplex grinding device is equipped with: a disc-like carrier ring (2) which has a supporting hole (241) capable of supporting a silicon wafer (W); a rotating mechanism which causes the carrier ring (2) to rotate with the center (C1)...
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WO/2017/057548A1 |
Provided is a grinding machine in which brittle-mode grinding is suppressed so as to achieve stable grinding of a wafer. This grinding machine (1) is provided with: a rotatable spindle (23) that has a grind stone (21) attached to a lower...
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WO/2017/053737A1 |
A floor polishing or grinding pad assembly (10) is provided. In one aspect, a polishing or grinding pad assembly employs a fibrous pad (12), a reinforcement layer or ring (14; 114), and multiple floor-contacting disks (16; 16a; 16b; 16c;...
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WO/2017/044403A1 |
An abrasive rotary tool includes a tool shank a flexible planar section positioned opposite the tool shank. The flexible planar section forms a first abrasive external surface on a first side of the flexible planar section and a second a...
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WO/2017/033462A1 |
A glass plate processing device 1 comprises: a scribe line forming device 5; glass plate breaking devices 15A, 15B; glass plate peripheral edge grinding devices 19A, 19B; and a glass plate conveying device 20 that carries glass plates 2 ...
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WO/2017/025303A1 |
The invention relates to a grinding disc (10, 110, 210) for a grinding machine (90), wherein the grinding disc has a machine side (11) associated with the grinding machine (90) and a processing surface (12, 112, 212) associated with a pr...
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WO/2017/018219A1 |
A substrate processing method according to one mode of the embodiment includes a grinding step, a measurement step, a condition determination step, and a damaged layer removal step. At the grinding step, the surface (W1) of a substrate (...
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WO/2017/018420A1 |
A glass plate 12 equipped with a light-incident-side beveled surface 40 that is positioned in a manner such that a line segment L1 connecting a first intersecting point P1 at which the light-incident-side beveled surface 40 and a light-e...
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WO/2017/009524A1 |
The claimed invention relates to an apparatus for grinding a concrete floor surface. The invention solves the problem of coupling a detachably cohesible diamond grinding arrangement (2) to an apparatus with concrete grinding means (1 ). ...
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WO/2017/007111A1 |
The present invention relates to a brake pad friction material continuous processing apparatus, which is capable of facilitating a chamfering process, regardless of the standard of a brake pad, at the time of manufacturing a friction mat...
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WO/2017/006447A1 |
The purpose of the present invention is to provide a wafer having a step, said wafer making it possible not to leave a resist after development, and to provide a method for manufacturing the wafer. This wafer having a step is a wafer tha...
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WO/2016/207814A1 |
The machine (1) for grinding sheet-like elements, particularly tiles and slabs made of ceramic material, natural stone, glass or the like, comprises a base framework (2), means (3) for advancing at least one sheet-like element (4) on a m...
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WO/2016/185374A1 |
Machine for polishing/ flattening slabs of natural stone or marble or granite or the like, provided with a mechanism for controlling the position of the spindle, such a machine comprising a base on which the slabs are positioned, a bridg...
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WO/2016/181751A1 |
The purpose of the present invention is to provide a polishing pad, which has high planarization precision and for which the polishing rate is not susceptible to decrease over a relatively long period. This polishing pad is provided with...
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WO/2016/183126A1 |
A polishing system includes a first carrier assembly configured to receive and hold a substrate and a polishing pad. The polishing pad includes a top major surface and a bottom major surface positioned opposite the top major surface, and...
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WO/2016/169688A1 |
The invention relates to a device (10) and a method for processing brake linings (44) which are mounted on lining supports (46), comprising a conveying device (16) for the continuous and automated displacement of brake linings (44) to be...
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WO/2016/170898A1 |
This plate glass processing device (1) is provided with: a synchronous motor (2) that drives and rotates a processing tool (B); an arm member (3) that supports the processing tool (B) so as to be rotatable; a support shaft member (4) tha...
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WO/2016/161945A1 |
A polishing method comprises: conveying a workpiece by using a transmission mechanism with a to-be-processed surface of the workpiece facing down; and polishing the to-be-processed surface under the to-be-processed surface by using a pol...
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WO/2016/158102A1 |
Provided is a structural body production method that is provided with: a formation step wherein a resin material is impregnated with carbon fibers and a carbon fiber composite material (10) is formed by curing the resin material; a polis...
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WO/2016/151424A1 |
A tool (U) for polishing and/or lapping stone material surfaces, comprising a member (1) made of abrasive material, a support member (2) for handling said tool (U), a cushioning layer (3) arranged between said abrasive member (1) and sai...
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WO/2016/151561A1 |
The head (4) for polishing ceramic manufactured articles or natural stones comprises a main body (5) and at least one work tool (6) associated with the body (5) for polishing ceramic manufactured articles or natural stones, and air cooli...
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WO/2016/151121A2 |
Disclosed is a machining unit for machining an end face of a workpiece. The machining unit has a work table which rotates or is clocked during the machining process.
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WO/2016/152932A1 |
The purpose of the present invention is to provide a method for manufacturing a glass substrate which is capable of efficiently improving the cleanliness of the surfaces of the glass substrate. This method for manufacturing a glass subst...
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WO/2016/142762A1 |
The invention relates to a system for the polishing treatment of inner walls of aquatic enclosures (1), comprising at least one tank (21) of abrasive mixture and at least one surface treatment head (30) which communicates fluidically wit...
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WO/2016/140176A1 |
This adhesive tape for protecting a semiconductor wafer surface comprises an adhesive layer on a base material film. The adhesive strength at 23°C when adhered to stainless steel is 0.3-10 N/25mm, the adhesive strength when heated to 50...
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WO/2016/140634A1 |
Present invention is a board surface (7) polishing application system (1) for wood-based panel furniture materials such as melamine-coated particleboard, MDF, plywood, parquet, fiberboard etc., wherein it contains at least one polishing ...
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WO/2016/125973A1 |
A grinding tool according to the present invention comprises: a plate; a plurality of holders formed on the plate and having sliding grooves formed thereon; shoes coupled to the sliding grooves of the holders; and grinding tips arranged ...
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WO/2016/120714A1 |
The invention relates to a mobile floor grinding machine (1) having at least two horizontally arranged rotatingly driven grinding tool holding devices (21, 22), in particular in the form of plates, on which grinding tools (23) can be arr...
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WO/2016/120715A1 |
The invention relates to a sanding dust suction device for a movable floor sanding machine (1) with at least two horizontal sanding tool retaining devices (21, 22), in particular in the shape of discs, which are driven in a rotating mann...
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WO/2016/116452A1 |
The present disclosure provides a carrier disk (1, 1', 1'') for holding at least one cutting, grinding or polishing element (23) in a floor grinding machine. The carrier disk (1, 1', 1'') comprises a carrier body (11, 12) having a downwa...
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WO/2016/117327A1 |
A processing apparatus includes: a tool in which a processing surface includes a catalyst material including a transition metal that assists hydrolysis of a surface to be processed of an object to be processed that is immersed in water; ...
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WO/2016/077272A2 |
A sample grinder includes a base having a bowl and a rotating drive plate to operably support a grinding wheel. A head is configured to support a specimen holder and has a first drive for rotational drive of the specimen holder and a sec...
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WO/2016/071188A1 |
The invention relates to a device comprising a turning unit (14) for turning a workpiece. According to the invention, the turning unit (14) comprises a driveable movable turning body which has contact means (18) which can move with the m...
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