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WO/2013/039571A1 |
A grinding wheel dressing assembly includes a driving gear rotatable about a central axis and a dressing ring engaged with the driving gear. Rotation of the driving gear about the central axis results in rotation of the dressing ring abo...
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WO/2013/027880A1 |
The present invention enables the sequential cutting, chamfering, and grinding of both side surfaces of a silicon ingot in order to achieve the objectives of improving the workability of the ingot and rationalizing the processing degree ...
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WO/2013/024565A1 |
The present invention is a stock removal evaluation method for evaluating stock removal from a processed wafer in a machining process in which a predetermined amount of material is removed by machining both the front and back faces of th...
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WO/2013/020160A1 |
A grinding apparatus for grinding a floor, the apparatus comprising: a body having a travelling mechanism which enables the body to travel across a floor whilst the apparatus is grinding; a first grinding head incorporating at least one ...
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WO/2013/015095A1 |
A method for manufacturing a powder magnetic core includes a step of acquiring a powder magnetic core by pressure forming with a mold an iron-based alloy powder consisting primarily of an insulation-coated pure iron powder or iron, a ste...
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WO/2013/009685A1 |
A lapping carrier includes a base having first and second opposed major surfaces and at least one aperture extending from the first major surface to the second major surface. A wear layer is disposed on the first major surface of the bas...
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WO/2013/005589A1 |
The present invention relates to an apparatus for peeling a glass substrate, said apparatus being provided with a peeling means that peels from a suction sheet a glass substrate which is suction-held to the suction sheet with a liquid th...
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WO/2012/175790A1 |
The invention relates to an arrangement for floor grinding, which is meant particularly for grinding of a floor with a floor conditioning device, such as a combination machine, floor conditioning machine or like. The arrangement comprise...
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WO/2012/155385A1 |
A multi-carriage symmetrical numerically controlled coordinate grinding machine includes a base (100a,100b), a work table (110), upright posts, several carriages and a grinding head (140). The upright posts include a first upright post (...
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WO/2012/147033A1 |
The present invention relates to a tool for working material surfaces, having a support base (3), an abrasive or cutting portion (2) constrained to said support base (3) and obtained from an abrasive solution or mixture (4), the abrasive...
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WO/2012/140842A1 |
Disclosed is a double-head grinding method in which both surfaces of a work are simultaneously grinded by rotating a pair of ring-shaped grinding stones in a state where the grinding stones faces the work, and by supporting and rotating ...
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WO/2012/137233A1 |
A screeding machine for leveling floor bases comprising a frame or chassis (BB), to which means (AA) for supporting and moving the machine frame (BB) in at least two directions and means (CC) for supporting and moving a milling device (D...
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WO/2012/137143A1 |
The present invention refers to a tool for the roughing and/or polishing of hard surfaces such as stone, marble or the like, of the type usable in association with hand- operated machines, such as an angle grinder or the like, for manual...
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WO/2012/132074A1 |
This method for producing glass substrates for an information recording medium comprises: a step in which a polishing device (1000) is used to polish glass substrates (1), which are being held by a carrier (500) on the polishing device (...
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WO/2012/129888A1 |
A fully symmetric 5-axis tool grinder and a grinding wheel headstock. The grinder comprises a grinder base (2) and a pillar (56). A slide rail (4) is arranged on an inner side surface of the pillar vertically. A grinding wheel headstock ...
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WO/2012/129244A1 |
A polishing system for polishing an optical element includes a polishing pad having a radial dimension and a septum disposed on the polishing pad. The septum is configured to partially surround the optical element. The optical element co...
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WO/2012/124663A1 |
This invention relates to a method of polishing a plate-shaped body, in which a plate-shaped body holding member, which holds the to-be-not-polished surface of a plate-shaped body and undergoes one of orbital revolution and axial rotatio...
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WO/2012/119616A1 |
Method for the single-sided processing of flat workpieces, each of the workpieces having a first and a second face side, the face sides being opposite to one another, wherein the second face side is to be processed, comprising the follow...
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WO/2012/113899A1 |
A surface treatment apparatus comprising a frame (1), a motor (4), a utility tool (5) for treating a surface, the utility tool (5) being driven by said motor (4), at least one supporting wheel (3), roll and/or track and wherein said fram...
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WO/2012/104646A1 |
A grinding machine for grinding an end of a spring, the machine comprising a fixed spring mounting, which is fixable in a known position in the machine, for a spring or springs and a grinding surface secured to a support structure and ar...
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WO/2012/101090A1 |
In order to counteract subsequent deformations, a process for producing a substrate for a reflective optical element for EUV lithography is proposed comprising the following steps: a block of material is provided; a surface of an area of...
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WO/2012/101837A1 |
Provided are: a silicon block grinding/polishing device comprising a grinding function capable of grinding a square column-shaped silicon block within tolerance ranges of ±0.5 mm for the cross-section dimensions thereof and ±0.1° for ...
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WO/2012/097137A2 |
A system for sharpening circular, knife edged blades operates to bias an infeed grinding wheel into contact with the first edge of the blade and an outfeed grinding wheel into contact with the second edge of the blade. The grinding wheel...
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WO/2012/090655A1 |
Provided is a method for producing a glass substrate comprising a polishing step which repeatedly uses a polished surface (24) of a polishing pad (20A) in which a plurality of openings (27) are formed on the polished surface (24) to perf...
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WO/2012/078087A1 |
A device for grinding is disclosed. It comprises a support (11), preferably mobile, for grinding of plane surfaces by grinding means in the form of one or more grinding rounds (14) or an endless grinding band (29). The grinding means are...
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WO/2012/077427A1 |
This grinder is configured by disposing a plurality of grinding pad pieces on the whole surface of a grinding plate. The grinder has a slope at the boundary portion between the front surface and the end surface of each of the grinding pa...
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WO/2012/068186A2 |
An electrode is fonned using a sanding mechanism to condition the surface of the electrode for electrochemical purposes. Hazardous particles emitted during sanding are captured using jetted liquid, and may be recycled for later use. The ...
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WO/2012/034497A1 |
A numerical control machine tool for grinding two sides of a plane by shifting self-rotation and ultrasonic vibration, wherein an upright post (3) is provided on the tool body (1) of the machine tool, a Y axis movement assembly (12) is p...
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WO/2012/032265A1 |
Device for transporting, turning over and surface-treating components (5) moved by conveyor belts (2 and 3) associated with drive motors (13) that drive each of the belts (2 and 3) in opposite directions in order to transport components ...
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WO/2012/032467A1 |
CMP process for substrates containing silicon oxide dielectric films and polysilicon and/or silicon nitride films comprising the steps of (1 ) contacting the substrate with an aqueous composition containing (A) abrasive particles which a...
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WO/2012/027942A1 |
A compact and sensitive cylinder comprises a back cover (1) and a front cover (9) both of which are connected with the cylinder body (13) respectively. An upper airflow orifice (15) is mounted in the back cover (1) of the cylinder. A pis...
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WO/2012/029857A1 |
Provided is a method for producing a glass substrate for magnetic disks, which enables grinding by hard abrasion without a reduction in grinding rate, and with which it is possible to produce high-quality glass substrates at low cost. Th...
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WO/2012/030293A1 |
The invention relates to a device (1) at grinding disc (2) for floor grinding machine, and which comprises a from the machine outgoing, rotatable shaft (4). According to the invention a lower grinding disc (2) is flexibly carried by mean...
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WO/2012/026992A1 |
Systems and methods for polishing a lens having a freeform design cut into a surface of the lens are provided. The system may include a lap blank having a substantial inverse of the freeform design cut into a surface of the lap blank, or...
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WO/2012/025127A1 |
Performing sanding works on wall surfaces and ceiling surfaces with sanding tools (32), occur frequently attrition of the personnel who perform the work due to the fact that the person, simultaneously with the performance of the work whe...
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WO/2012/023818A2 |
The present invention relates to a polishing pad for a system for polishing a glass plate. The polishing pad may be mounted on a polishing plate, and has predetermined flow channel patterns for enabling a polishing liquid supplied from a...
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WO/2012/019668A1 |
The invention relates to a polishing device (1) for polishing a metal product (2), in particular a continuously cast slab, billet, or block. The aim of the invention is to achieve a high polishing rate when said metal products are polish...
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WO/2012/018215A2 |
According to the present invention, it is possible to minimize the difference of the polished amount of the center and the edge of a large substrate in a method for polishing a large substrate.
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WO/2012/012820A1 |
A plate locking mechanism for a surface preparation device comprising a connecting plate having a receiving aperture, a base plate and a floating plate capable of being substantially aligned with the base plate. A fastener extends throug...
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WO/2011/160142A1 |
A grinding tool carrier (1) with substantially circular grinding discs (2) arranged thereupon, an abrasive covering detachably secured on said discs and chip-removing cutters (4) arranged on the grinding tool carrier and between the grin...
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WO/2011/152045A1 |
Disclosed is a semiconductor wafer surface protection sheet which has excellent adherence to the irregularities on the circuit formation surface of a semiconductor wafer, and has excellent detachability after being ground. Specifically, ...
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WO/2011/144624A1 |
Methods and apparatuses are used for optically measuring by interferometry the thickness (T) of an object (2) such as a slice of semiconductor material. Readings of the object thickness by optical interferometry are carried out, rough th...
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WO/2011/138304A1 |
The invention relates to a method for simultaneous double-side grinding of at least one semiconductor wafer, wherein the one or a plurality of semiconductor wafers lie(s) in freely movable fashion in a cutout in a guide plate fixed in a ...
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WO/2011/126028A1 |
Disclosed is a method for manufacturing glass plates. The method comprises the following steps: a forming step for forming sheet glass from molten glass; a cutting step for cutting the sheet glass into glass plates having a predetermined...
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WO/2011/122454A1 |
Disclosed is a glass substrate holding film body such that、in terms of configuration, a self-adsorption type sheet (32) is bonded to a back plate with a double-faced adhesive sheet (34) therebetween, and that a glass substrate is held ...
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WO/2011/117792A1 |
Systems and methods are disclosed for modulating the hydrostatic pressure in a double side wafer grinder having a pair of grinding wheels. The systems and methods use a processor to measure the amount of electrical current drawn by the g...
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WO/2011/110907A1 |
The machine (1) for grinding plate-shaped elements, particularly tiles and slabs of ceramic material, natural stones, glass or the like, comprises: a base frame (2); forward movement means (3) for at least a plate-shaped element (4) havi...
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WO/2011/107872A1 |
The machine (1) for the mechanical machining of plate- shaped elements, particularly tiles and slabs of ceramic material, natural stones, glass or the like, comprises: a base frame (2); forward movement means (3) for at least a plate-sha...
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WO/2011/105302A1 |
Disclosed is a method that is for polishing a magnesium alloy plate and that can cause a stripe pattern to not be prominent and grinding burn to be difficult to arise on the surface of a magnesium alloy plate when wet polishing the surfa...
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WO/2011/105181A1 |
Disclosed is a method for surface treatment of a magnesium alloy plate, said method being able to cause blemishes and discoloration to not be prominent on the plate surface in the case where wet polishing has been performed to smooth the...
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