Title:
WAFER POLISHING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2024/083063
Kind Code:
A1
Abstract:
Disclosed in the present invention is a wafer polishing system, at least comprising two polishing units; a single polishing unit comprises at least two polishing modules and a first fixed working position, each polishing module comprising a polishing platform and a polishing head; the at least two polishing heads in the same polishing unit can transport a wafer to the first fixed working position; at least a second fixed working position is further provided between adjacent polishing units; and the at least two polishing heads of the adjacent polishing units can transport the wafer to the second fixed working position. In the present invention, coordination of the first fixed working position, the second fixed working position and the polishing heads achieves transportation of wafers between polishing areas in the polishing system, allowing for greater transportation flexibility; the second fixed working position and a third fixed working position are additionally provided, making the whole transfer process of the wafers more complete and rapid; and the cleanliness of the polishing heads is ensured without affecting wafer inflow and outflow, thus improving product yield.
Inventors:
XU XIAOYU (CN)
Application Number:
PCT/CN2023/124672
Publication Date:
April 25, 2024
Filing Date:
October 16, 2023
Export Citation:
Assignee:
HANGZHOU SIZONE ELECTRONIC TECH INC (CN)
International Classes:
B24B7/22; B24B27/00; B24B29/02; B24B41/00; B24B41/06
Attorney, Agent or Firm:
HANGZHOU KAIZHI PATENT AGENCY (GENERAL PARTNERSHIP) (CN)
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