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WO/2023/194595A1 |
The method for shaping a carrier sheet of high hardness, in particular a gres sheet, comprises the steps of providing a solid carrier sheet of high hardness having a thickness of at least 6 mm; covering (S100) a front surface of the carr...
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WO/2023/190008A1 |
This rotary dresser comprises a superabrasive particle layer in which superabrasive particles are bound in a single layer to a base metal by means of a plating layer, the superabrasive particles comprising first superabrasive particles h...
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WO/2023/184634A1 |
The present invention relates to the field of optical thin films, mainly aims at a nodular defect for reducing an optical thin film damage threshold, and particularly relates to a method for improving a thin film laser damage threshold b...
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WO/2023/187844A1 |
Apparatus (100) for working a sheet (200) comprising movement means (111, 112) configured to move at least one sheet (200) at a time in a direction of advance (F), and at least one working unit (113) comprising a working head (123) on wh...
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WO/2023/189512A1 |
Provided is a polishing composition that can achieve an excellent polishing/removal rate for a polishing target. The polishing composition provided by the present invention is used for polishing a polishing target. The polishing composit...
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WO/2023/190604A1 |
Provided is a silicon polishing method and a polishing fluid 26 with which polishing efficiency is achieved. When a polishing pad 18 that is a polishing abrasive grain-including polishing pad including polishing abrasive grains 36 is use...
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WO/2023/184802A1 |
Provided in the present invention are an aspheric prism manufacturing method and an aspheric prism. The method comprises the steps of: S1, by using a thermoforming method, performing integral forming on a prism and lenses to obtain forme...
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WO/2023/192128A1 |
A method of polishing a surface of a polycrystalline sintered ceramic body, the method comprising the steps of: a) providing a sintered ceramic body comprising a polycrystalline material and having a density of from about 99.5% to about ...
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WO/2023/189716A1 |
Provided is a dicing device that can perform a maintenance task well even when a workpiece is large. This dicing device (10) comprises a housing (52) which accommodates in the interior thereof a work table (12) that holds and moves a wor...
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WO/2023/189400A1 |
The present invention provides: a composition for chemical mechanical polishing, the composition being capable of selectively polishing tungsten films by increasing the polishing rate of tungsten films with respect to silicon oxide films...
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WO/2023/191019A1 |
The present invention provides: porous silica particles which have balanced and adequate disintegratability, while having excellent disintegration uniformity; and a method for producing these porous silica particles. Porous silica partic...
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WO/2023/192248A1 |
This disclosure relates to polishing compositions containing at least one abrasive, at least one organic acid or a salt thereof, at least one organic solvent in an amount of from about 3% to about 50% by weight of the composition, and an...
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WO/2023/189113A1 |
A polishing device according to an embodiment comprises: a supporting unit for supporting a polishing tool; a stage for holding an object to be polished; a first drive unit for causing the support unit and the stage to move relative to o...
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WO/2023/187903A1 |
This burnishing tool is for, with respect to a workpiece having a spiral wall, burnishing the inner peripheral surface and the outer peripheral surface of the spiral wall, said tool comprising: a tool body which is to be mounted to a bur...
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WO/2023/189165A1 |
An information processing device (5) comprises: an information acquisition unit (500) that acquires operating status information including top ring status information, polishing table status information, polishing fluid supply nozzle sta...
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WO/2023/190299A1 |
A boron nitride plate surface treatment method according to an embodiment comprises a first polishing step and a second polishing step. In the first polishing step, a surface of a boron nitride plate is polished using a first polishing m...
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WO/2023/189145A1 |
This cooling fluid supply structure comprises: a first supply flow path (101) that passes through the inside of a spindle housing (4a) and penetrates a wall surface of an engaging recess (30d) at the tip thereof; a second supply flow pat...
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WO/2023/189812A1 |
The present invention provides a polishing composition that can realize a high-quality surface. The polishing composition includes silica particles (A), a basic compound (B), a first water-soluble polymer (C1), a second water-soluble pol...
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WO/2023/189701A1 |
The present invention relates to a polishing composition including abrasive grains and a dispersion medium, wherein the pH is less than 5.0, the abrasive grains comprise surface-modified silica particles having an organic acid immobilize...
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WO/2023/184727A1 |
A PCB grinding method, a PCB regrinding device, and a PCB. The PCB grinding method comprises: establishing a board thickness data model, the board thickness data model comprising the board thickness of each hole plugging area before hole...
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WO/2023/190428A1 |
The purpose of the present invention is to provide a polishing pad capable of inhibiting the occurrence of scratches, a method for producing the polishing pad, and a method for polishing the surface of an optical material or semiconducto...
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WO/2023/185202A1 |
Disclosed in the present invention is a wafer polishing system, comprising: a wafer transfer apparatus that comprises a fixing base and a carrying table, the fixing base being capable of driving the carrying table to move in a wafer tran...
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WO/2023/181756A1 |
The present invention pertains to a polishing method and a polishing device for polishing a peripheral portion of a substrate such as a wafer. The polishing method includes: holding a substrate (W) and rotating the substrate (W) by means...
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WO/2023/180880A1 |
A curable composition comprises from 45 to 55 percent by weight of epoxy resin preparable by reaction of epichlorohydrin with at least one of bisphenol A or bisphenol F, from 6 to 12 percent by weight of an at least trifunctional (meth)a...
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WO/2023/183100A1 |
A chemical mechanical polishing composition comprises, consists of, or consists essentially of a liquid carrier, abrasive particles in the liquid carrier, a pyrophosphate compound, and a sulfonate compound or a compound including a quate...
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WO/2023/181810A1 |
The present invention provides a means for speeding up polishing on an object to be polished. Provided is a polishing composition comprising abrasive grains, a dispersion medium, and a water-soluble polymer, wherein the abrasive grains a...
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WO/2023/180555A1 |
The invention relates to a hand grinding machine comprising: a disc tool (40) having a machining face (44) for machining a workpiece (WST); and a machine housing (50) in which a drive motor (11) for driving a tool holder (14) is arranged...
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WO/2023/183488A1 |
An abrasive article including a body including abrasive particles contained within a bond material, a first major surface, a second major surface, and a side surface extending between the first major surface and second major surface, and...
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WO/2023/180554A1 |
The invention relates to a hand grinding machine comprising: a disc tool (40) having a machining face (44) for machining a workpiece (WST); a machine housing (50) in which a drive motor (11) for driving a tool holder (14) is arranged, on...
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WO/2023/180332A1 |
The invention relates to a method for pretreating a component prior to a coating process, comprising the steps of: starting the blasting of the component with a first abrasive; ending the blasting of the component with a first abrasive; ...
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WO/2023/182779A1 |
A device for manufacturing a CMP conditioning disk may comprise: a diamond jig that provides a jig pocket in which a diamond can be seated; a suction unit that selectively provides the jig pocket with a suction force; and a moving unit f...
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WO/2023/180865A1 |
A robotic system for modifying a surface is presented. The system includes a motive robot arm with an arm movement mechanism. The system also includes a tool coupled to the arm movement mechanism. The tool is configured to removably coup...
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WO/2023/180877A1 |
A curable composition comprises from 45 to 80 percent by weight of epoxy resin preparable by reaction of epichlorohydrin with at least one of bisphenol A or bisphenol F, from 6 to 12 percent by weight of an at least trifunctional (meth)a...
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WO/2023/180248A1 |
The invention relates to a device for transporting an object to a grinding machine and/or away from a grinding machine, with said device comprising: a base; a support arranged on the base, which can be rotated about a first axis of rotat...
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WO/2023/181772A1 |
A method for manufacturing an R-T-B based sintered magnet according to the present disclosure comprises: a milling step for preparing a powder of an alloy for an R-T-B based sintered magnet; a molding step for fabricating a powder molded...
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WO/2023/181651A1 |
The present invention relates to a coupling device for coupling a rotating body such as such as a polishing head and dresser to a rotating shaft. The present invention further relates to a device for attaching and detaching the rotating ...
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WO/2023/183220A1 |
A method of manufacturing a photomask including the steps of providing a photomask blank, inspecting the photomask blank to determine presence of one or more defects in the photomask blank, wherein the one or more defects comprise one or...
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WO/2023/182392A1 |
A polishing pad having a polishing layer and an endpoint detection window provided to an opening in the polishing layer, the polishing pad being such that, in measurement of dynamic viscoelasticity in an elongation mode at a frequency of...
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WO/2023/176315A1 |
Provided is a polishing pad that makes it easier to manage polishing liquid, enables omission or simplification of a wafer cleaning step after polishing, makes treatment of the polishing liquid less cumbersome after polishing, and enable...
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WO/2023/176611A1 |
This substrate polishing device performs a polishing process on a processing surface of a substrate and comprises a grinding module in which a first grinding member and a second grinding member that has a larger maximum diameter than the...
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WO/2023/175723A1 |
A grinding machine (1, 2) includes, in an alternatively selectable configuration: a first grindstone spindle unit (30) including a first unit housing (32) that rotatably supports a first grindstone spindle (31) by a fluid bearing (32b) t...
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WO/2023/177453A1 |
A superabrasive compact and a method of making the superabrasive compact are disclosed. A superabrasive compact may comprise a diamond table and a substrate. The diamond table may be attached to the substrate. The diamond table may inclu...
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WO/2023/175799A1 |
A grinding machine (1, 101, 201) comprises: a grinding wheel (T) for grinding a workpiece (W); moving bodies (12, 15) that move the grinding wheel relative to the workpiece; movement motors (12a, 15a) that move the moving bodies; manual ...
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WO/2023/173793A1 |
A blade precision forging method, comprising: placing a workpiece to be processed on a multi-adaptive blade feeding rotary table T1 for feeding, putting a blank into a furnace, heating and forging, carrying out hold-cutting type trimming...
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WO/2023/174688A1 |
A face milling cutter (1) comprising: • a tool body (2); • at least two cutting inserts (20) for forming a milled flat surface on a workpiece and mounted in a respective insert seat (10) in the tool body, each cutting insert having a...
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WO/2023/176448A1 |
This tool assembly comprises: a rotatable processing tool 2 for processing the end surfaces of a glass plate; and a rotatable holder 3 that holds the processing tool 2. The tool assembly further comprises: a cavity portion 9c that is use...
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WO/2023/175455A1 |
Abrasive elements can be secured to a perimeter of a base disk using double-sided adhesive tape, thereby forming an abrasive grinding wheel.
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WO/2023/176451A1 |
This tool assembly comprises: a rotatable processing tool 2 for processing the end surfaces of a glass plate G; and a rotatable holder 3 that holds the processing tool 2. The tool assembly further comprises: a cavity portion 9c that is u...
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WO/2023/175981A1 |
[Problem] To provide a machine tool equipped with a workpiece changer capable of reducing machining cycle time by reducing non-machining time, and also provide a corresponding machining system. [Solution] A workpiece changer 4 comprises:...
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WO/2023/174340A1 |
Disclosed in the present invention is a dual-electric-motor driven ground leveling grinder, comprising a main electric motor, a worm drive box, a gear box, a secondary electric motor, a universal joint, racks, and counterweight sliding b...
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