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WO/2023/039779A1 |
A wear-resistant cutter wheel, comprising a cutter wheel body (10) and a cutter wheel shaft (20) connected to the cutter wheel body (10). A center hole (11) into which the cutter wheel shaft (20) is inserted is formed in the center of th...
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WO/2023/035247A1 |
Embodiments of the present disclosure provide a chemical-mechanical polishing device and a control method therefor. The chemical-mechanical polishing device comprises a polishing platform which is adapted to carry a polishing pad and dri...
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WO/2023/038183A1 |
One embodiment of the present invention provides a technology for automatically performing a polishing process by using a robot and controlling the polishing process in real time by monitoring a current value of a spindle in real time. A...
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WO/2023/036903A1 |
A surface processing apparatus (500) comprises: - a surface processing device (200) to process a surface (SRF1), - a robot (ROBO1 ) to move the surface processing device (200) with respect to the surface (SRF1 ), - an electromagnetic act...
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WO/2023/036012A1 |
A wafer polishing system, at least comprising one polishing unit (1), wherein the polishing unit (1) comprises a wafer transmission channel (2) and at least two polishing modules (3); and the polishing modules (3) are located on both sid...
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WO/2023/038800A1 |
Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements. Each polishing element comprises an individual surface that forms a portion of a pol...
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WO/2023/036011A1 |
Disclosed in the present invention is a wafer polishing system, at least comprising a polishing unit, which comprises a fixed working station and two polishing modules, wherein the polishing modules are located on two sides of the fixed ...
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WO/2023/037272A1 |
Aspects of the present disclosure relate to a method of making an abrasive article. The method can include providing a combination of a mesh backing and a fastener. The mesh backing has a first side and a second side and the mesh backing...
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WO/2023/035810A1 |
A vertical wall construction method and a construction robot. The method comprises: a construction module (130) constructing an indoor vertical wall surface (S1); detecting an obstacle in the direction of construction, and acquiring posi...
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WO/2023/030999A1 |
The invention relates to a grinding disc for a grinding device (12), having a fastening interface (15) formed on a device side (26) of the grinding disc (11) facing the grinding device (12), wherein: on a working side (27) axially opposi...
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WO/2023/032716A1 |
Provided is a polishing composition which has an excellent ability to eliminate bulging around an HLM, and which can improve polishing rate. The polishing composition comprises abrasive grains, a basic compound, and water. In addition, t...
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WO/2023/032930A1 |
This polishing liquid contains cerium oxide abrasive grains and ammonium salt, and has a pH of at least 9.00. This polishing method uses the polishing liquid to polish a member to be polished that contains copper. This component manufact...
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WO/2023/030774A1 |
A method for grinding a semiconductor wafer, wherein the semiconductor wafer is machined in a material-removing manner by means of a grinding tool containing grinding teeth having a height h while supplying a cooling medium into a contac...
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WO/2023/034874A1 |
Examples are disclosed that relate to planarizing substrates without use of an abrasive. One example provides a method of chemically planarizing a substrate, the method comprising introducing an abrasive-free planarization solution onto ...
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WO/2023/032196A1 |
In a process in which grinding is performed after additive manufacturing, the present invention reduces the amount of a portion of a coating, formed during the additive manufacturing, that exceeds a thickness necessary for a product. Thi...
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WO/2023/034573A1 |
A chemical mechanical polishing pad comprising a polishing portion, the polishing portion comprising: a polymeric body; a plurality of polymer particles embedded within the body of the polymeric body, wherein at least a portion of the pl...
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WO/2023/032715A1 |
Provided is a polishing composition which can achieve both maintenance of a polishing rate and an HLM periphery protrusion elimination ability. This polishing composition contains grains, a basic compound, a salt of a sulfur-containing a...
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WO/2023/032714A1 |
Provided is a polishing composition capable of achieving both maintenance of a polishing rate and elimination of bulging of the periphery of a hard laser mark (HLM), the polishing composition comprising abrasive grains, a basic compound,...
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WO/2023/032197A1 |
This complex grinding machine comprises: a holding unit capable of holding and rotating a workpiece; an additive manufacturing unit that is movable with respect to the holding unit and melts a material while supplying the material to a s...
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WO/2023/032929A1 |
This polishing solution is for polishing a resin-containing polishing target member and contains an ether compound having a hydroxy group, and abrasive grains containing cerium oxide. This polishing method is for polishing a resin-contai...
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WO/2023/032489A1 |
Provided is a method for polishing a spectacle lens, the method having: a step for preparing a polishing pad in which a flocked polishing pad is provided to a polishing surface that comes into contact with a plastic spectacle lens, the f...
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WO/2023/032961A1 |
Provided are a glass member that excels in tactile sensation such as the feel of writing using an input pen and the feel of touching with a fingertip, an input device provided with the glass member, a pen input device, a mobile apparatus...
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WO/2023/033981A1 |
A backup pad assembly is presented that includes a backup pad with a cavity and a centerpost that is coupleable to the backup pad. The backup pad is configured to couple to a tool in a first configuration, without the centerpost, and in ...
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WO/2023/032928A1 |
Provided is a polishing liquid for polishing a member to be polished, said polishing liquid containing abrasive grains which include a cerium oxide, wherein the member to be polished contains a resin and particles which include a silicon...
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WO/2023/034962A1 |
Articles and methods regarding abrasive articles that include antimicrobial properties and improved abrasive performance and comprise a first fiber element comprising a woven or non-woven material; and a second fiber element comprising m...
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WO/2023/026814A1 |
The present invention provides a composition for chemical mechanical polishing, the composition being capable of chemically mechanically polishing a semiconductor substrate that contains ruthenium or molybdenum, while maintaining a stabl...
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WO/2023/026948A1 |
Provided are: a surface processing method for a GaN substrate, which is capable of performing surface processing on the GaN substrate in a short period of time; and a manufacturing method for a GaN substrate. This surface processing meth...
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WO/2023/024043A1 |
A PCB substrate burr removing apparatus for electronic device production. The apparatus comprises a collecting box (1), wherein two fixing supports (2) are fixedly mounted at the top of the collecting box (1); lifting grooves are provide...
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WO/2023/026171A1 |
The present disclosure discloses an apparatus (100) for performing superfinishing operation on a raceway of a bearing (200). The apparatus has an arm (10) extending from the superfinishing unit (100). The apparatus comprises a pivot (40)...
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WO/2023/027140A1 |
The purpose of the present invention is to provide a magnetic disk substrate and a method for manufacturing same, and a magnetic disk all of which make it possible to maintain high flatness, despite being thin, after a long-term use, be ...
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WO/2023/027932A1 |
A glass-based article with a textured surface exhibiting low haze is provided. The glass-based articles are produced by utilizing a combination of abrasion and etching, where hydrofluoric acid is not utilized. The process for producing t...
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WO/2023/025577A1 |
The present invention relates to a profiled structure for a component of a power tool, wherein the profiled structure has a front side and a rear side, and wherein the profiled structure has at least two beads on one of the two sides and...
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WO/2023/026813A1 |
Provided is a chemical mechanical polishing composition capable of chemically mechanically polishing a ruthenium- or molybdenum-containing semiconductor substrate while maintaining a stable polishing rate and suppressing the corrosion of...
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WO/2023/025148A1 |
A clamping mechanism and an electric tool. The clamping mechanism comprises a main body (1), a locking cap (2), a spring chuck (3) and an outer sleeve (5) which is sleeved on the periphery of the locking cap and can drive the locking cap...
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WO/2023/026778A1 |
The present invention provides a chemical mechanical polishing composition with which it is possible to suppress ruthenium corrosion and also perform chemical mechanical polishing of a semiconductor substrate containing ruthenium while m...
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WO/2023/024190A1 |
Provided in the present application are a grinding disk and a substrate cleaning device. The grinding disk comprises a thickness self-adaptive layer, and a base layer and a grinding sheet which are fixed to two opposite surfaces of the t...
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WO/2023/026779A1 |
The present invention provides a composition for chemical mechanical polishing, the composition being capable of chemically mechanically polishing a semiconductor substrate that contains ruthenium, while maintaining a stable polishing ra...
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WO/2023/026780A1 |
Provided is a composition for chemical mechanical polishing, with which chemical mechanical polishing can be carried out while suppressing corrosion of ruthenium and maintaining a stable polishing speed for a semiconductor substrate cont...
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WO/2023/023784A1 |
An axle buffer for buffing vehicle axles, the axle buffer comprising a buffer, a buffer rotating means and a buffer locating means, wherein buffer locating means comprises means to radially move the buffer relative to the axle surface an...
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WO/2023/028019A1 |
Described herein are textured glass-based articles. The textured glass-based articles may include a glass-based substrate including a first major surface and a second major surface. At least a portion of one or both of the first major su...
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WO/2023/026723A1 |
The present invention relates to a polishing device. The polishing device comprises: a plurality of window members (50) that transmit infrared rays, and a plurality of infrared radiation thermometers (51) that are disposed under the plur...
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WO/2023/022818A1 |
Exemplary slurry delivery assemblies may include a slurry fluid source. The assemblies may include a flurry delivery lumen having a lumen inlet and a lumen outlet. The lumen inlet may be fluidly coupled with an output of the slurry fluid...
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WO/2023/020837A1 |
The present invention relates to a grinder having a motor, wherein the grinder can be connected to a grinding disc. The grinder is designed to make possible, in addition to a grinding motion in a flat plane, a wobbling motion of the grin...
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WO/2023/021534A1 |
Finishing tool (10) for surface machining slab-like elements. The finishing tool (10) comprises a reusable base (12) and an abrasive component (14) releasably connected to said base (12) in order to be selectively replaced, wherein said ...
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WO/2023/022114A1 |
Provided is a sliding apparatus having excellent sliding properties and low frictional resistance with a snow surface or ice surface. The sliding apparatus for sliding on a slide object (snow surface or ice surface) has a slide surface (...
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WO/2023/019774A1 |
The present invention relates to a hot pressing device for an ACF glue film coupling structure and a process thereof. The hot pressing device comprises a transfer module and a first mounting plate connected to the transfer module; a nega...
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WO/2023/021521A1 |
This invention relates to a system for dispensing of abrasive powder and, water and oil mixture on polishing die for pavilion and crown processing and, table processing of natural and synthetic, single and poly crystal diamond at control...
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WO/2023/018428A1 |
A robotic sharpening system and method for rapidly and accurately sharpening or resharpening cutting tools is provided. The inventive system employs a robotic arm that grasps each cutting tool by its cutting blade instead of by its handl...
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WO/2023/016073A1 |
Provided is a waterjet cutting device, comprising a waterjet cutting head assembly (100). The waterjet cutting head assembly (100) comprises: a liquid transfer pipe (102), the liquid transfer pipe (102) being configured to allow a treatm...
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WO/2023/018881A2 |
A glass container that includes a base defining a hole, and methods of manufacturing and using the glass container, is disclosed. The glass container is manufactured by providing the container and cutting a hole in a wall of the containe...
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