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WO/2023/019134A1 |
The present invention provides, in one aspect, a rotating power tool including a housing, a drive unit within the housing having an electric motor defining a rotational axis, and a drive shaft coupled to the electric motor to receive tor...
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WO/2023/013509A1 |
A wire saw (1) abnormality diagnosis device comprises: a diagnostic mode execution unit (51), a data group acquisition unit (52), a deviation information calculation unit (54), and a determination unit (55). The diagnostic mode execution...
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WO/2023/011979A1 |
The invention relates to a polishing tool (100) for polishing a spectacle lens (L) in a surface machining process, which comprises a tool body (110) for being rotatably supported about a rotational axis (RA1). The tool body (110) compris...
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WO/2023/013146A1 |
The present invention enables accommodating diced workpieces in a tubular container while eliminating use of a moving mechanism for moving a processing table and comprises: a processing table which holds a workpiece; a first holding mech...
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WO/2023/013559A1 |
A robot system 100 comprises: a robot 1 for machining a machining portion B of an object W; a storage unit 32 for keeping an image of the object W, and three-dimensional information; a designation device 9 for designating the machining p...
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WO/2023/013576A1 |
This polishing pad has a polishing layer having a circular polishing surface, and is also provided with a spiral groove or concentric circular grooves consisting of a plurality of annular grooves arranged in concentric circles and formed...
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WO/2023/012042A1 |
The invention relates to a power tool apparatus which is provided to perform an abrasion work operation on a workpiece, said apparatus including at least one spindle which is driven to rotate and a plurality of abrasion components which ...
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WO/2023/013339A1 |
In the present invention, a polishing end point is detected with high accuracy even if there is a change in polishing frictional force. This polishing device comprises a polishing table for holding a polishing pad, a holding unit for h...
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WO/2023/014565A1 |
This disclosure relates to a composition that includes at least one first ruthenium removal rate enhancer; at least one copper removal rate inhibitor; at least one low-k removal rate inhibitor; and an aqueous solvent.
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WO/2023/014624A1 |
The disclosed system may include a slicing component that has a cutting blade. The cutting blade may be configured to cut a semiconductor wafer into multiple wafer strips, where the wafer strips have flat top surfaces and multiple edges....
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WO/2023/012940A1 |
Provided is a polishing pad that can stably achieve a required finishing quality of an object to be polished with strict product standards. The polishing pad is formed from a foam body comprising roughly spherical air bubbles, and is cha...
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WO/2023/013532A1 |
The purpose of the present invention is to provide a pressure-sensitive adhesive tape that has high adhesive strength to rough surfaces and excellent shear strength at high temperatures. Further, a pressure-sensitive adhesive tape accord...
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WO/2023/010621A1 |
A seamless splicing process for a ceramic basin and a countertop, which relates to the technical field of countertop splicing. S1: First, an operator places a ceramic basin on a workbench, and fixes the ceramic basin on the workbench by ...
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WO/2023/013147A1 |
The present invention simplifies device structure, reduces footprint, and prevents scattering of processing fluid. This processing device comprises: a processing table 2A, 2B for holding a sealed substrate W; a first holding mechanism 3 ...
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WO/2023/005044A1 |
an edge trimming machine for a rubber seal, which comprises a mount ring (12) and a plurality of fixing mechanisms (2) located above; a fixed frame (14) is mounted at an outer wall of a bottom part of the mount ring (12), and an electric...
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WO/2023/009116A1 |
Embodiments herein include high throughput density chemical mechanical polishing (CMP) modules and customizable modular CMP systems formed thereof. In one embodiment, a polishing module features a carrier support module, a carrier loadin...
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WO/2023/006155A1 |
Therefore, the aim of the invention is to achieve, for a surface-cleaning and engraving machine, an increase in the flow velocity of at least the blasting agent for more effective cleaning of many different and complicated surfaces or su...
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WO/2023/004860A1 |
Disclosed in the present invention is an aluminum alloy die casting mold surface deburring treatment device, comprising a grinding kettle, a bottom frame, and a motor. Four bottom frames are mounted at the bottom of the grinding kettle; ...
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WO/2023/004960A1 |
Disclosed are robotic automatic assembling machine (4) for a graphite electrode and a joint, comprising an industrial robot (4-1), a joint conveying workbench (4-2), a joint temporary storage table (4-3), a scanning system (4-4), a torqu...
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WO/2023/007356A1 |
An abrading operation monitoring system is presented that includes a particle tracking system that receives, from a particle position retriever, a position of an abrasive particle on an abrasive article surface. The system also includes ...
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WO/2023/004907A1 |
A preparation method for a substrate having a sanding surface. The preparation method comprises: providing a flattening mill, which comprises a first rack and a second rack, wherein the first rack comprises a first working roll and a thi...
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WO/2023/005046A1 |
The present application relates to the technical field of rubber-head burr machining, and in particular to an automatic burr removing apparatus for a tooth-cleaning rubber head. The automatic burr removing apparatus comprises a base plat...
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WO/2023/005257A1 |
A floating non-contact ultrasonic reinforced flexible sub-aperture polishing apparatus and a polishing method therefor. The polishing apparatus comprises a flexible tool (101), a horn (102), an ultrasonic transducer (103), an electricall...
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WO/2023/004961A1 |
An automatic numerical control graphite electrode and joint precision machining detection assembly and packaging line, which is composed of an automatic graphite electrode machining line (1), an automatic truss conveying type graphite jo...
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WO/2023/007938A1 |
The present invention provides a composition for chemical mechanical polishing, the composition enabling high-speed polishing of a silicon nitride film while restraining the speed of the silicon oxide film polishing, the composition also...
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WO/2023/008386A1 |
Provided is a rotary tool 10 to be attached to an output shaft of a power tool, the rotary tool 10 comprising a resin base plate 11 formed in a disc shape from a resin material, and a plurality of grindstone tips 18 disposed along a circ...
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WO/2023/001324A1 |
The invention relates to a production system (11) for grinding a first end face (7) of a tapered roller (1) for a rolling element bearing (2), comprising at least one tapered-roller carrier (3) and a grinding tool (12), wherein the at le...
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WO/2023/000208A1 |
Provided are a band saw blade sandblasting model construction method, a band saw blade sandblasting apparatus and a sandblasting method. During a sandblasting process, an opening number of a first spray gun (41) and a second spray gun (4...
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WO/2023/003625A1 |
Embodiments of the disclosure generally relate to a retaining ring assembly having an annular lower portion, and an annular upper portion. The annular lower portion includes a step feature and an interlocking feature. In some configurati...
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WO/2023/000607A1 |
Provided is an assistive processing apparatus for a special-shaped self-aligning bearing grinding machine for aerospace, comprising a transition disc (2), balance blocks (3), a pressing plate (4), a stop block assembly, and a centering s...
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WO/2023/004269A1 |
A novel pad-in-a-bottle (PIB) technology for advanced chemical-mechanical planarization (CMP) copper barrier CMP compositions, systems and processes has been disclosed for use with polyurethane-based polishing pads having a plurality of ...
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WO/2023/002829A1 |
Provided is a technology that, when using a top ring, prevents the fitting parts of a band from coming out of a groove. In a top ring 10 of a polishing device 100, an outer circumferential wall 11 of a retainer member 30 and/or an oute...
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WO/2023/003947A1 |
A tool such as a wafer handler or wafer chuck can include a surface having at least one protrusion. A diamond coating is formed from diamond grains sized so that 90% of the grains are between 200 and 300 nanometers, with the diamond coat...
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WO/2023/003724A1 |
Exemplary substrate edge polishing apparatuses may include a chuck body defining a substrate support surface. The apparatuses may include an edge ring seated on the chuck body. The apparatuses may include a retaining wall disposed radial...
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WO/2023/003105A1 |
A brazing system according to an embodiment of the present invention, which is for brazing an object to be bonded to a base material, comprises: a turntable provided with a reception part for receiving the base material and rotatable clo...
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WO/2023/000414A1 |
Disclosed are a method and a device for curvature-adaptive cluster magnetorheological polishing of a free curved surface. The polishing method comprises the following steps: placing a workpiece to be processed in a rotating platform asse...
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WO/2023/283905A1 |
A processing and polishing apparatus for the production of medical instruments, comprising a base (1), a machine table (2), a clamping assembly and an atomizing assembly. The atomizing assembly is provided on the top of the machine table...
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WO/2023/287975A1 |
An orbital sander includes a housing, a drive unit within the housing having an electric motor defining a rotational axis, and a drive shaft coupled for co-rotation with the motor about the rotational axis having a fan rotatably coupled ...
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WO/2023/284233A1 |
A conditioner, a chemical-mechanical polishing device, and a detection method of a conditioner. The conditioner comprises a polishing portion (1) and a driving portion (2), wherein the polishing portion (1) is mounted on the driving port...
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WO/2023/286633A1 |
A metal wire made of tungsten or a tungsten alloy, wherein the number of times before the metal wire is severed when subjected to a fatigue test in accordance with JIS C6821 standard with a maximum stress of 4400 MPa is 20,000 or more.
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WO/2023/287507A1 |
Embodiments provided herein include a system and method for cleaning a first surface of a substrate using a brush carousel assembly. In one embodiment, the brush carousel assembly includes one or more rotatable brush mounting assemblies ...
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WO/2023/288053A1 |
A sanding pad comprises a laminate structure of a deformable and flexible core layer defining a first surface and an opposing second surface, each said surface having a sandpaper layer affixed thereto, whereby each said sandpaper layer i...
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WO/2023/286478A1 |
[Problem] To provide an elastic polishing material suitable for the surface treatment of a workpiece having a complicated surface shape for a metal working product such as a metal mold or a drill. [Solution] Provided is an elastic polish...
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WO/2023/280363A1 |
For polishing a workpiece (7), such as a pipe elbow, in a polishing machine (100), the workpiece (7) is automatically swivelled through a central polishing area (6) of a rota-tional polishing station (1) after adjustment of the radius of...
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WO/2023/282832A1 |
The present disclosure relates to a grinding apparatus (1) for grinding a concrete surface comprising a base unit (2) comprising a chassi (3) and at least one rotating means (4) at least partially enclosed by said chassi (3). The at leas...
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WO/2023/279443A1 |
The present invention relates to a positioning protection structure for a grinding robot. The present invention relates to the technical field of grinding robots. The positioning protection structure is composed of a grinding placement s...
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WO/2023/283525A1 |
A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier hea...
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WO/2023/283582A1 |
Techniques for polishing and repairing a device's surface are disclosed. An applicator is coated with a paste using a CNC machine. The applicator is attached to a candle bit of the CNC machine, and a device is disposed on a staging area ...
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WO/2023/283559A1 |
A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a motor to generate relative motion between the platen and the c...
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WO/2023/281763A1 |
[Problem] To provide: a differential pressure-eliminating bag that can be used to replace the gas inside of an inert gas circulation-type blasting device with an inert gas while being capable of maintaining a constant pressure inside of ...
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