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WO/2022/219228A1 |
The invention is a device (301 ) for inspecting the shape of the blade (1) of a skate (100), with the skate blade having blade alignment markings (11). The device comprises a rectangular straight plate (4) with a first edge (401 ) and a ...
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WO/2022/219507A1 |
Some methods for making a granular material comprise crushing demetallized slag particles with one or more crushers and screening the crushed demetallized slag particles with one or more screens to separate the demetallized slag particle...
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WO/2022/215370A1 |
The present invention is a wafer processing method characterized by surface-grinding a front surface of a wafer and a back surface opposite the front surface, with a grindstone with a grit number of 10000 or more, and double-side polishi...
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WO/2022/216554A1 |
An apparatus and method for to monitoring slurry buildup is disclosed. A substrate polishing apparatus includes a surface coated at least in part with a fluorescent material, a light source configured to illuminate the surface, an image ...
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WO/2022/215553A1 |
This lignin-modified novolac-type phenol resin has a weight-average molecular weight of 5,500 or more.
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WO/2022/214666A1 |
A system (50) for handling a structural member (44) of a blade (10) of a wind turbine (2), comprising a member support (52) configured for supporting the structural member (44), the member support (52) being configured to be mounted to a...
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WO/2022/217135A1 |
A belt sander for sanding a workpiece including a main housing, a motor having a motor shaft disposed within the main housing, a gear assembly driven by the motor shaft, and a drive assembly coupled to the gear assembly for driving a san...
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WO/2022/216179A1 |
The invention relates to cleaning surfaces of contaminants using particles of a solid cryogenic substance. A device comprises a casing, a rotating bladed array, a fixed bladed array secured on the casing, and a flat sieve array secured i...
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WO/2022/215628A1 |
The present invention suppresses a decrease in dimensional accuracy. This method for manufacturing a glass substrate supports a semiconductor device, and generates a glass mother plate, measures the thickness, thickness deviation, and wa...
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WO/2022/210744A1 |
[Problem] To provide a polishing composition that has a superior working force and that has good washability after polishing. [Solution] A polishing composition including: abrasive grains; water; and a hydrophobic dispersion medium. The ...
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WO/2022/207711A1 |
The present invention relates to a tool comprising a cemented carbide part and a steel part joined by brazing where the steel part has an average hardness of between 390 and 510 HV30. The braze joint comprises Ti and a TiC layer with a t...
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WO/2022/210165A1 |
A polishing pad comprising a polishing layer that has a polishing surface for performing a polishing process on an item to be polished, wherein the polishing layer includes hollow microspheres that form hollow bodies within the polishing...
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WO/2022/205656A1 |
A polishing device and polishing process for an indium phosphide substrate, which device and process belong to the technical field of indium phosphide polishing. The polishing device comprises an electrolytic cell, and also comprises an ...
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WO/2022/210676A1 |
This polishing pad has a polishing layer that comprises an isocyanate-terminated prepolymer and a polyurethane resin foam derived from a curing agent, wherein: the distance between hard segments in the polishing layer as measured by smal...
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WO/2022/211085A1 |
A belt processing device (10) moves a processing belt (34) relative to a workpiece (W) to process the workpiece. The belt processing device comprises a first roller (40) that is a processing roller, a second roller (32) that is a driven ...
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WO/2022/209389A1 |
The present invention relates to a polishing pad and a polishing device for use in polishing a substrate such as a wafer. Moreover, the present invention relates to a method of polishing a substrate such as a wafer. A polishing pad (30) ...
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WO/2022/210721A1 |
The present invention provides a machining apparatus and a machining method that make it possible to perform machining on a to-be-machined object at a high machining rate, with a rigidity equivalent to that of a conventional apparatus. T...
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WO/2022/209758A1 |
Provided is a polishing method whereby it becomes possible to reduce defects on the surface of an object to be polished. The polishing method comprises a polishing step for supplying a polishing composition S1 containing abrasive grains ...
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WO/2022/204758A1 |
An automated abrasive control system 100 is provided for controlling abrasive flow in a pneumatic abrasive blast pot 110 having at least one blast hose 116 (shown coupled to a blast nozzle 115). The pneumatic abrasive blast pot 110 is us...
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WO/2022/210264A1 |
This polishing pad includes: a polyurethane sheet serving as a polishing layer; and an end point detection window provided in an opening in the polyurethane sheet. In a dynamic viscoelasticity measurement of the end point detection windo...
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WO/2022/211714A1 |
The disclosure relates to a blast cabinet (100) for blasting at least one object by directing a flow of blasting media from a blasting nozzle (101) arranged within the blast cabinet (100) towards a point of blasting (102) of the at least...
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WO/2022/210037A1 |
Provided is a polishing pad comprising a polishing layer made of a polyurethane resin foam containing an isocyanate-terminated prepolymer, and a curing agent, wherein the ratio (NC80/NC40) of a weight proportion (NC80) of an amorphous ph...
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WO/2022/210216A1 |
Provided is an adhesive tape processing method capable of easily separating a base material and an adhesive constituting an adhesive tape, at low cost. Also provided is an adhesive tape processing device for use with such an adhesive tap...
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WO/2022/209229A1 |
Provided is a polishing composition that can polish a resin-made object to be polished at high polishing speed and that can polish the surface of the resin-made object to be polished so as to be flat and smooth. This polishing compositio...
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WO/2022/209081A1 |
The present invention reduces the time required for alignment work and comprises: a rotatable cutting table 2A, 2B that holds a sealed substrate W that has an alignment mark AM provided thereupon; a cutting mechanism 4 that cuts the seal...
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WO/2022/205548A1 |
The present invention provides a cylindrical grinding machine, comprising: a frame, a machine body, a working table, a Z-axis guide rail assembly, an X-axis guide rail assembly, a B-axis rotary assembly, and a grinding frame. The frame i...
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WO/2022/205542A1 |
A negative-pressure adsorption static-pressure supporting guide rail of a machining machine tool, comprising a guide rail groove (1), a guide rail body, and a static pressure supporting assembly. The guide rail groove (1) is fixedly form...
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WO/2022/209150A1 |
[Problem] To provide a means which, when used for polishing works comprising polysilicon and silicon nitride, is effective in inhibiting both insufficient polishing and dishing. [Solution] A polishing composition which comprises abrasive...
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WO/2022/212161A1 |
Handheld trencher attachment assemblies are disclosed. In one embodiment, the assembly includes a base having digging bar and power cutter portions. The digging bar portion having opposed first and second sides and an opening that extend...
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WO/2022/201650A1 |
[Problem] To provide a processing system that can process a workpiece with good precision. [Solution] A processing system 1 is configured so as to comprise: a tilting device that can tilt a rotational axis 3a of a chuck 3 retaining a wor...
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WO/2022/201649A1 |
[Problem] To provide a processing apparatus that flattens a workpiece so as to have a desired thickness. [Solution] A processing apparatus 1 flattens a non-circular shape workpiece W with a grinding stone 21 and is provided with: a sucti...
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WO/2022/203881A1 |
Chemical-mechanical polishing assemblies may include an upper platen characterized by a first surface and a second surface opposite the first surface. The upper platen may define a recess in the second surface of the upper platen. The up...
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WO/2022/200722A1 |
The invention relates to a method for manufacturing a metal alloy part for an aircraft turbine engine, said method comprising the steps of: • a) producing a blank of the part by additive manufacturing by laser fusion on a powder bed, a...
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WO/2022/203781A1 |
A method and apparatus for polishing a substrate is disclosed herein. More specifically, the apparatus relates to an integrated CMP system for polishing substrates. The CMP system has a polishing station configured to polish substrates. ...
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WO/2022/202688A1 |
The present invention provides a means for reducing surface defects in a substrate after the polishing of the substrate. The present invention relates to a method for polishing a substrate, the method comprising a polishing step, in whic...
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WO/2022/201759A1 |
This portable grinding machine comprises: a grinding machine body; a battery holster; and a power supply cord. The grinding machine body comprises: a body housing that accommodates a motor; and a grinding part configured to move orbitall...
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WO/2022/204290A1 |
A method for repairing an existing portion of a wall, and a wall repair tool (10) includes a cutter (100) rotatable about a cutter axis (140) and having a cutter body (110) with a cutting surface (112). The cutter body (110) has a centra...
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WO/2022/201254A1 |
This polishing pad comprises a polyurethane sheet as a polishing layer, the polyurethane sheet being such that the ratio (E'B40/E'T40) of the 40°C storage elastic modulus E'B40 in a dynamic viscoelasticity measurement performed under be...
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WO/2022/199184A1 |
A sole grinding method and apparatus using block poses. The method comprises the following steps: A. acquiring a lower edge boundary trajectory of a sole; B. obtaining a final sole grinding trajectory (1); C. dividing the sole grinding t...
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WO/2022/201701A1 |
The present invention simplifies the device configuration of a processing device having a blade replacement mechanism and reduces the footprint of the processing device, the present invention being provided with cutting tables 2A, 2B on ...
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WO/2022/201996A1 |
This manufacturing method for an optical connector includes: a first step for inserting and affixing a multi-core fiber, in which an outer peripheral core is formed in a spiral shape, into a ferrule; a second step for inserting the ferru...
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WO/2022/201965A1 |
This method of manufacturing an optical connector comprises: a first step of inserting and fixing a multi-core fiber, of which an outer peripheral core is formed in a spiral shape, to a ferrule; a second step of inserting the ferrule int...
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WO/2022/201700A1 |
The present invention reduces footprint of a processing device, and comprises: a substrate accommodating unit 111 that accommodates an encapsulated substrate W; a cutting table 2A, 2B on which the encapsulated substrate W is processed by...
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WO/2022/202722A1 |
The purpose of the present invention is to provide: a shaft-equipped grindstone that can, with a simple configuration, suppress chipping which occurs at a chamfered section of a product; a chamfering method; a glass plate manufacturing m...
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WO/2022/201213A1 |
Abrasive module (10) made of composite material comprising a base membrane (11) from which a plurality of abrasive heads (12) project.
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WO/2022/199743A1 |
An apparatus for positioning workpieces for through-feed centreless grinding comprises two guide jaws (3, 4), which flank a bearing rail (7), are arranged parallel to one another and can be displaced independently of one another in the s...
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WO/2022/202059A1 |
Provided is a method for manufacturing a polishing pad that comprises a polishing layer having an endpoint detection window, the method including: a curing step for fixing an endpoint detection window member inside of a die, and curing a...
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WO/2022/202008A1 |
The present invention can prevent a decrease in the accuracy of stopping point detection in which a window for stopping point detection is used, while also suppressing influence on polishing performance. A polishing pad 3 comprises a w...
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WO/2022/198739A1 |
An arrayed grinding method based on active pressure modulation, the method comprising: preparing grinding tools; performing measurement to obtain error distribution of a mirror to be processed, and calculating a residence time of a singl...
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WO/2022/201660A1 |
This cutting device configured so as to form a half cut groove in a cutting object comprises a table, a spindle part to which a blade is attached, a detection part, and a control part. The table holds the cutting object. The blade moves ...
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